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IRFL9110

Vishay Intertechnology

IRFL9110 by Vishay Intertechnology

Vishay Intertechnology's IRFL9110 is a P-CHANNEL FET for switching applications. It features a 100V DS breakdown voltage, 1.1A max drain current, and 3.1W power dissipation. With GULL WING terminals and ENHANCEMENT MODE operation, it suits surface mount designs requiring high performance in small outline packages.

Median Price

$0.767

Lifecycle Status

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23

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1k+

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Component Electronics Inc.

Canada . 47 parts In-Stock

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$0.920

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Ack Elektronik San.Tic.Ltd.Sti

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PC Components Company LLC

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A2Z Electronics, Inc.

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Vyrian

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Mil-Aero Solutions, Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Prism Electronics

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Resion

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NPI Materials, Inc.

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Sensible Micro Corp

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Corohmni

South Africa . 698 parts In-Stock

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Aztec Data Supply Inc.

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AZTECH Wire

Italy . 850 parts In-Stock

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Ampacity Inc.

Singapore . 1,215 parts In-Stock

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Continental Prestige Electronics

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Glotronic Ltd.

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Overview

Discover the IRFL9110 by Vishay Intertechnology, a high-quality P-Channel Field Effect Transistor perfect for switching applications. With its single configuration and built-in diode, this transistor offers enhanced performance and reliability. Ideal for various electronic projects, this transistor boasts a maximum drain current of 1.1A and a minimum DS breakdown voltage of 100V. Trust Vishay Intertechnology for cutting-edge technology and superior quality in every component. Experience the difference with the IRFL9110 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package ensures longevity and ease of handling.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-resistance and high current capability, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Easy to mount on PCBs, saving space and allowing for efficient assembly.

Minimum DS Breakdown Voltage: 100 V

High breakdown voltage ensures reliability and stability in high-voltage applications.

Package Shape: RECTANGULAR

Rectangular shape enables easy placement and alignment on PCBs.

Terminal Form: GULL WING

Gull wing terminals provide secure connection points for efficient electrical performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor, enhancing overall efficiency.

Maximum Drain Current (Abs) (ID): 1.1 A

High maximum drain current capability ensures the transistor can handle a wide range of currents effectively.

No. of Terminals: 3

Simple three-terminal design for easy integration into circuits.

Maximum Power Dissipation (Abs): 3.1 W

High power dissipation capability ensures the transistor can handle high-power applications with ease.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space and allows for dense PCB designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high-speed switching and low power consumption for efficient performance.

Maximum Power Dissipation Ambient: 2 W

Good power dissipation in ambient conditions ensures stable operation even in varying temperature environments.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows the transistor to be used in various environments without overheating.

Transistor Element Material: SILICON

Silicon material provides reliable and consistent performance over time.

Minimum Operating Temperature: -55 °C

Capable of operating in low-temperature conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability for easy integration into circuits.

Maximum Feedback Capacitance (Crss): 18 pF

Low feedback capacitance minimizes signal distortion and ensures high-speed switching performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) IRFL9110 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Additional Features:

AVALANCHE RATED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

1.1 A

Maximum Drain Current (ID):

1.1 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

18 pF

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PSSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

2 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRFL9110 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-01-600-4399, 5961016004399

NIIN

016004399

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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