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IRFL024NTRPBF

Infineon Technologies

IRFL024NTRPBF by Infineon Technologies

IRFL024NTRPBF by Infineon is a N-CHANNEL FET with 55V DS Breakdown Voltage, 0.0028A ID, and 0.075ohm RDS. It's used for SWITCHING applications in ENHANCEMENT MODE with a max temp of 150°C. The transistor has a GULL WING terminal form, operates in METAL-OXIDE SEMICONDUCTOR technology, and can withstand -55 to 150°C temperature range.

Median Price

$0.276

Lifecycle Status

Suppliers In-Stock

12

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1k+

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Arrow

USA . 43 parts In-Stock

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$0.856

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$0.247

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Distrelec

Netherlands . 2,434 parts In-Stock

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Element14

Singapore . 1,478 parts In-Stock

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$0.559

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$0.392

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Chip1Stop

Japan . 1,199 parts In-Stock

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$0.206

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Verical

USA . 1,199 parts In-Stock

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Adafruit Industries

USA . 600 parts In-Stock

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Farnell

UK . 148 parts In-Stock

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$0.276

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Distributors (In-Stock)

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Digiode

USA . 747 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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$0.391

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$0.391

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Schukat

Germany . 2,800 parts In-Stock

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$0.253

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$0.210

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$0.203

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$0.253

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Vyrian

USA . 1,929 parts In-Stock

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ComSIT Distribution GmbH

Germany . 998 parts In-Stock

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Ampacity Inc.

Singapore . 2,355 parts In-Stock

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$0.167

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Corphita

USA . 650 parts In-Stock

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Argo Parts USA

USA . 1,824 parts In-Stock

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$0.318

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$0.308

1,824

$0.318

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Continental Prestige Electronics

USA . 1,621 parts In-Stock

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$0.318

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$0.312

1,621

$0.318

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$0.312

Semicontronic

India . 1,849 parts In-Stock

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$0.387

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$0.377

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$0.375

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1,849

$0.387

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Netroflash

USA . 1,000 parts In-Stock

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$0.391

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$0.391

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Component Stockers USA

USA . 17,134 parts In-Stock

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$0.610

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$0.370

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$0.260

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17,134

$0.610

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$0.260

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Corohmni

South Africa . 690 parts In-Stock

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$0.952

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$0.952

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Aztec Data Supply Inc.

USA . 15,884 parts In-Stock

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$1.199

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$1.199

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Modulus Dynamics

Lithuania . 11,996 parts In-Stock

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$1.634

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$1.569

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$1.503

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$1.634

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Perfect Parts

USA . 56,679 parts In-Stock

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GreenTree Electronics

Israel . 18,348 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,711 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,807 parts In-Stock

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Kepictronics

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Lixinc

USA . 2,142 parts In-Stock

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Glotronic Ltd.

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Microchip USA

USA . 1,843 parts In-Stock

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Advanced Electronics

New Zealand . 600 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

USA . 350 parts In-Stock

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$0.100

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Overview

Unlock the power of cutting-edge technology with the IRFL024NTRPBF from Infineon Technologies. This high-quality small signal FET offers unparalleled performance and reliability for a wide range of switching applications. With a single configuration featuring a built-in diode, this N-channel transistor is designed to enhance efficiency and optimize functionality. Its innovative design and robust construction make it an essential component for any project where precision and durability are key. Say goodbye to limitations and hello to endless possibilities with the IRFL024NTRPBF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components, making it a reliable choice.

Polarity or Channel Type: N-CHANNEL

The N-channel type allows for efficient control and switching capabilities, making it ideal for a variety of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this single configuration offers added convenience and functionality, simplifying circuit designs.

Transistor Application: SWITCHING

Designed for switching applications, this transistor ensures quick and responsive performance in various electronic circuits.

Surface Mount: YES

With surface mount capability, this transistor is easy to install and is ideal for compact electronic designs.

Minimum DS Breakdown Voltage: 55 V

The minimum breakdown voltage of 55V ensures reliable performance and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit boards, making it a versatile choice for different projects.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy soldering, enhancing the overall reliability of the transistor.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode enables fast and efficient switching functions, making it suitable for a wide range of applications.

No. of Terminals: 3

With three terminals, this transistor offers flexibility in circuit designs and allows for various connection options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact electronic devices and designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology ensures high performance and efficiency in signal amplification and switching functions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows for reliable performance in demanding environmental conditions.

Transistor Element Material: SILICON

The use of silicon as the transistor element material provides durability and reliability, ensuring long-term performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows for operation in a wide range of environments, making it versatile and dependable.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers corrosion resistance and ensures secure connections, enhancing the durability of the transistor.

Maximum Drain Current (ID): 0.0028 A

With a maximum drain current of 0.0028 A, this transistor can handle high current loads, making it suitable for a variety of applications.

Maximum Drain-Source On Resistance: 0.075 ohm

The low drain-source on resistance of 0.075 ohm minimizes power loss and improves efficiency in switching operations.

Terminal Position: SINGLE

With a single terminal position, this transistor is easy to install and can be easily integrated into circuit designs.

Case Connection: DRAIN

The drain case connection ensures efficient heat dissipation and reliable operation, making it a good choice for high-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a 30-second maximum time at peak reflow temperature, this transistor is easy to solder and install, saving time during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures secure soldering and reliable connections, ensuring the longevity of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) IRFL024NTRPBF attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (ID):

.0028 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PSSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRFL024NTRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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