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XOMAPL132BZWTA2E

Texas Instruments

XOMAPL132BZWTA2E by Texas Instruments

XOMAPL132BZWTA2E by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at a supply voltage range of 1.14V to 1.32V, featuring a GRID ARRAY package style with 361 terminals for various applications requiring low profile and fine pitch components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,074 parts In-Stock

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6,074

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Digiode

USA . 2,852 parts In-Stock

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2,852

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$8.653

100+ parts

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719

$8.653

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Parana Technologies

USA . 31 parts In-Stock

1+ parts

$19.873

100+ parts

-

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$19.828

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31

$19.873

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$19.828

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DigiPath Technology Company

USA . 583 parts In-Stock

1+ parts

$21.882

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583

$21.882

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ChromeModa Solutions

Germany . 4,798 parts In-Stock

1+ parts

$22.329

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$18.310

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4,798

$22.329

$18.310

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IDEA Electronic Components Group

UK . 1,510 parts In-Stock

1+ parts

$22.329

100+ parts

$21.213

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$20.096

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1,510

$22.329

$21.213

$20.096

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One Stop Electronics

USA . 709 parts In-Stock

1+ parts

$28.000

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709

$28.000

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Corohmni

South Africa . 1,045 parts In-Stock

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$66.851

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1,045

$66.851

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Corphita

USA . 879 parts In-Stock

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879

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Overview

Elevate your projects to the next level with the XOMAPL132BZWTA2E by Texas Instruments. Known for their top-notch quality and reliable performance, Texas Instruments delivers cutting-edge technology in their range of Other Function uPs,uCs & Peripheral ICs. This innovative product boasts a square package shape, 361 terminals, and a low profile design, making it perfect for a variety of applications. With a nominal supply voltage of 1.2V and advanced CMOS technology, the XOMAPL132BZWTA2E offers unmatched value and efficiency, ensuring that your projects run smoothly and efficiently every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, suitable for portable devices.

Surface Mount: YES

Surface mounting capability allows for easy integration onto PCBs, saving space and making assembly more efficient.

Maximum Supply Voltage: 1.32 V

With a high maximum supply voltage, this product can handle power fluctuations and provide stable performance.

Package Shape: SQUARE

The square shape of the package allows for uniform heat dissipation and efficient use of space on the PCB.

No. of Terminals: 361

With a high number of terminals, this product offers versatile connectivity options for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables high density mounting and precise connections on the PCB.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures energy efficiency and reliable operation even under low power conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and allows for easy access during assembly and maintenance.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables a slim profile design for space-constrained applications.

Width: 16 mm

Compact width dimension facilitates easy integration into compact electronic devices or systems.

Length: 16 mm

The length dimension provides a balanced form factor for optimal placement on the PCB without occupying excess space.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product offers advanced processing capabilities and features suitable for complex functions.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliable performance for efficient operation.

Terminal Form: BALL

Ball terminal form allows for easy soldering and reliable connections on the PCB.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a standard operating range for consistent performance and compatibility with various power sources.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm enables high-density mounting and precise connections for enhanced reliability and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XOMAPL132BZWTA2E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

JESD-30 Code:

S-PBGA-B361

Length:

16 mm

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

XOMAPL132BZWTA2E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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