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XOMAPL132BZWT2E

Texas Instruments

XOMAPL132BZWT2E by Texas Instruments

XOMAPL132BZWT2E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 1.14V to 1.32V, making it suitable for low-power applications requiring advanced CMOS technology and fine pitch terminal layout. The compact SQUARE shape and BALL terminals enable versatile integration in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,886 parts In-Stock

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4,886

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Digiode

USA . 905 parts In-Stock

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905

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Distributors (Availability)

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One Stop Electronics

USA . 180 parts In-Stock

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$11.000

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180

$11.000

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AZTECH Wire

Italy . 728 parts In-Stock

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$14.401

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728

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Corohmni

South Africa . 1,010 parts In-Stock

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$71.110

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$71.110

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Parana Technologies

USA . 264 parts In-Stock

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$74.006

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264

$74.006

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DigiPath Technology Company

USA . 2,234 parts In-Stock

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$81.490

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$74.971

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2,234

$81.490

$74.971

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ChromeModa Solutions

Germany . 4,359 parts In-Stock

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$83.153

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$68.185

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$83.153

$68.185

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IDEA Electronic Components Group

UK . 1,533 parts In-Stock

1+ parts

$83.153

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$78.995

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$74.838

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1,533

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$74.838

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Corphita

USA . 1,982 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the XOMAPL132BZWT2E, a high-quality microprocessor circuit designed for a wide range of applications. With a sleek square package style and 361 terminals, this versatile IC offers unparalleled performance and reliability. From IoT devices to automotive systems, this product is the perfect solution for your electronic design needs. Trust in Texas Instruments to deliver top-notch products that exceed expectations. Elevate your projects with the XOMAPL132BZWT2E today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the integrated circuit components within the package, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and reducing assembly complexity.

Maximum Supply Voltage: 1.32 V

High maximum supply voltage tolerance allows for compatibility with various power sources and voltage levels, increasing flexibility in application.

Package Shape: SQUARE

Square package shape provides efficient use of space on circuit boards, optimizing layout and design considerations.

No. of Terminals: 361

High number of terminals allow for complex connections and functions to be supported, enhancing the versatility and capabilities of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design offers high-density integration and connectivity, ideal for compact and advanced electronic devices.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage requirement enables efficient power consumption and operation, promoting energy efficiency and extending battery life.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connection to external circuitry, ensuring reliable electrical contact and signal transmission.

Maximum Seated Height: 1.4 mm

Low maximum seated height profile minimizes space usage and allows for slim device designs, enhancing aesthetic appeal and portability.

Width: 16 mm

Compact width dimension enables integration into confined spaces and tight layouts, enabling versatile placement options in electronic systems.

Length: 16 mm

Moderate length dimension offers a balanced form factor for the product, providing a good mix of functionality and spatial optimization.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit technology enhances processing capabilities and computational performance, enabling advanced functionality and high-speed operations.

Technology: CMOS

CMOS technology delivers low power consumption, high noise immunity, and fast switching speeds, making the product efficient and reliable for diverse applications.

Terminal Form: BALL

Ball terminal form offers reliable connectivity and robust mechanical strength, ensuring secure attachment and stable performance in various operating conditions.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage specification provides consistent and reliable power delivery, supporting smooth operation and overall system performance.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density packaging and mounting on circuit boards, enabling efficient usage of available space and resources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XOMAPL132BZWT2E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

JESD-30 Code:

S-PBGA-B361

Length:

16 mm

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

XOMAPL132BZWT2E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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