Loading...

UCC3911DP-4

Texas Instruments

UCC3911DP-4 by Texas Instruments

UCC3911DP-4 by Texas Instruments is a Power Management IC with 16 terminals, operating voltage of 5V to 7.2V, and BICMOS technology. It is used in power supply support circuits for applications requiring a small outline package with dual terminal position and gull wing form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,405

-

-

-

-

Digiode

USA . 3,357 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,357

-

-

-

-

Semi Source

USA . 16 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 693 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

693

$4.500

-

-

-

Parana Technologies

USA . 723 parts In-Stock

1+ parts

$6.107

100+ parts

-

1k+ parts

$6.884

10k+ parts

-

723

$6.107

-

$6.884

-

DigiPath Technology Company

USA . 373 parts In-Stock

1+ parts

$6.725

100+ parts

-

1k+ parts

-

10k+ parts

-

373

$6.725

-

-

-

IDEA Electronic Components Group

UK . 474 parts In-Stock

1+ parts

$6.862

100+ parts

-

1k+ parts

$6.176

10k+ parts

-

474

$6.862

-

$6.176

-

ChromeModa Solutions

Germany . 320 parts In-Stock

1+ parts

$6.862

100+ parts

$5.627

1k+ parts

-

10k+ parts

-

320

$6.862

$5.627

-

-

AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$16.484

100+ parts

-

1k+ parts

-

10k+ parts

-

884

$16.484

-

-

-

Corphita

USA . 4,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,970

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Perfect Parts

USA . 3,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,852

-

-

-

-

Microchip USA

USA . 445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

445

-

-

-

-

Overview

Unlock the power of efficient energy management with the UCC3911DP-4 by Texas Instruments. As a leader in Power Management ICs, Texas Instruments delivers top-notch quality and reliability. Ideal for a variety of applications, this product offers unparalleled value with its advanced features and benefits. Experience seamless power supply support circuitry with the UCC3911DP-4, designed to optimize performance and enhance overall functionality. Upgrade your systems today with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount capability makes it easier to integrate into PCBs, saving space and simplifying assembly process.

Nominal Supply Voltage (Vsup): 5V

5V nominal supply voltage is common and widely compatible, making it easy to interface with other components.

Power Supplies (V): 7.2

Supports a wide range of power supplies, allowing flexibility in various applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even in demanding environments.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for use in cold conditions without compromising functionality.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance with low power consumption, making the IC efficient and reliable.

Technical Specifications

Power Management ICs UCC3911DP-4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

7.2

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

UCC3911DP-4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20