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UC3906QG3

Texas Instruments

UC3906QG3 by Texas Instruments

UC3906QG3 by Texas Instruments is a Power Management IC with 10V nominal voltage and 20 terminals in a square chip carrier package. It operates b/w -20 to 70°C, suitable for power supply support circuits. With a max supply voltage of 40V and surface mount capability, it's ideal for commercial applications requiring efficient power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,730 parts In-Stock

1+ parts

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4,730

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Digiode

USA . 2,503 parts In-Stock

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2,503

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 199 parts In-Stock

1+ parts

$1.500

100+ parts

-

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199

$1.500

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Ampacity Inc.

Singapore . 303 parts In-Stock

1+ parts

$4.500

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303

$4.500

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Semicontronic

India . 375 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

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375

$5.500

$5.362

$5.335

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Parana Technologies

USA . 207 parts In-Stock

1+ parts

$11.036

100+ parts

-

1k+ parts

$11.496

10k+ parts

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207

$11.036

-

$11.496

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ChromeModa Solutions

Germany . 6,685 parts In-Stock

1+ parts

$12.400

100+ parts

$10.168

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6,685

$12.400

$10.168

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IDEA Electronic Components Group

UK . 534 parts In-Stock

1+ parts

$12.400

100+ parts

$11.780

1k+ parts

$11.160

10k+ parts

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534

$12.400

$11.780

$11.160

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AZTECH Wire

Italy . 281 parts In-Stock

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$14.472

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281

$14.472

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DigiPath Technology Company

USA . 2,361 parts In-Stock

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$11.180

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2,361

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$11.180

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Corphita

USA . 2,152 parts In-Stock

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2,152

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Perfect Parts

USA . 616 parts In-Stock

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616

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Corohmni

South Africa . 279 parts In-Stock

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279

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Microchip USA

USA . 195 parts In-Stock

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195

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Overview

Experience top-notch quality and performance with the UC3906QG3 by Texas Instruments, a leading manufacturer of Power Management ICs. This versatile chip carrier offers unparalleled reliability and efficiency for a wide range of applications, making it an essential component for your power supply support circuits. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing you with the value and benefits you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes it easier to integrate into various electronic devices and PCBs.

Nominal Supply Voltage (Vsup): 10 V

Suitable for applications requiring a 10V supply voltage, providing flexibility in usage.

Maximum Operating Temperature: 70 °C

Can operate at high temperatures without compromising performance, ensuring reliability.

Technology: BIPOLAR

Utilizing bipolar technology offers high performance and efficiency in power management.

Technical Specifications

Power Management ICs UC3906QG3 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

10

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

3.6 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8.965 mm

Trade Compliance

UC3906QG3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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