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TSB43DB42GHC

Texas Instruments

TSB43DB42GHC by Texas Instruments

TSB43DB42GHC by Texas Instruments is a Serial Communication Controller with 32-bit address and data bus width, supporting up to 400 MBps transfer rate. It features a low-profile grid array package style, suitable for PCI bus compatibility in consumer circuits. The IC operates at a max clock frequency of 33 MHz and uses IEEE1394A drive interface standard.

Median Price

$14.230

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 670 parts In-Stock

1+ parts

-

100+ parts

$12.310

1k+ parts

$11.020

10k+ parts

$10.370

670

-

$12.310

$11.020

$10.370

DigiKey

USA . 670 parts In-Stock

1+ parts

-

100+ parts

$14.230

1k+ parts

-

10k+ parts

-

670

-

$14.230

-

-

Verical

USA . 644 parts In-Stock

1+ parts

-

100+ parts

$15.387

1k+ parts

$13.775

10k+ parts

$12.963

644

-

$15.387

$13.775

$12.963

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,181 parts In-Stock

1+ parts

$12.996

100+ parts

-

1k+ parts

-

10k+ parts

-

3,181

$12.996

-

-

-

Vyrian

USA . 2,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,356

-

-

-

-

DigiKey Marketplace

USA . 670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

670

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 991 parts In-Stock

1+ parts

$12.312

100+ parts

-

1k+ parts

-

10k+ parts

-

991

$12.312

-

-

-

Vigor

Singapore . 670 parts In-Stock

1+ parts

$13.140

100+ parts

-

1k+ parts

-

10k+ parts

-

670

$13.140

-

-

-

Component Stockers USA

USA . 1,314 parts In-Stock

1+ parts

$14.090

100+ parts

$13.240

1k+ parts

-

10k+ parts

-

1,314

$14.090

$13.240

-

-

Parana Technologies

USA . 558 parts In-Stock

1+ parts

$58.183

100+ parts

-

1k+ parts

-

10k+ parts

-

558

$58.183

-

-

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DigiPath Technology Company

USA . 1,007 parts In-Stock

1+ parts

$64.067

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

$64.067

-

-

-

ChromeModa Solutions

Germany . 5,008 parts In-Stock

1+ parts

$65.374

100+ parts

$53.607

1k+ parts

-

10k+ parts

-

5,008

$65.374

$53.607

-

-

IDEA Electronic Components Group

UK . 108 parts In-Stock

1+ parts

$65.374

100+ parts

$62.105

1k+ parts

$58.837

10k+ parts

-

108

$65.374

$62.105

$58.837

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

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-

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Microchip USA

USA . 236 parts In-Stock

1+ parts

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236

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Overview

Enhance your communication systems with the TSB43DB42GHC by Texas Instruments, a cutting-edge Serial Communication Controller that guarantees top-notch quality and reliability. Crafted by the renowned manufacturer, Texas Instruments, this controller is designed to optimize data transfer rates up to 400 MBps, making it ideal for a wide range of applications. With its sleek package style and compact size, the TSB43DB42GHC offers unparalleled value and benefits to customers seeking high-speed connectivity solutions. Upgrade your technology today with this innovative product!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Address Bus Width: 32

Enables efficient data transfer and communication between devices.

Package Shape: SQUARE

Space-efficient design for compact electronic devices.

No. of Terminals: 196

Offers a high level of connectivity for various external components.

Maximum Data Transfer Rate: 400 MBps

Ensures fast and reliable data transmission between devices.

Terminal Finish: TIN LEAD

Provides a reliable connection and prevents oxidization of terminals.

Maximum Seated Height: 1.5 mm

Low profile design for integration in slim electronic devices.

Width: 15 mm

Compact size for easy integration and space-saving installation.

External Data Bus Width: 32

Allows for high-speed data transfer and efficient communication.

Maximum Clock Frequency: 33 MHz

Supports high-speed data processing and communication.

Length: 15 mm

Space-efficient design for compact electronic devices.

Peripheral IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics applications.

Technology: CMOS

Low power consumption and high integration capabilities.

Terminal Form: BALL

Provides a secure and reliable connection to external components.

Bus Compatibility: PCI

Compatible with a widely-used bus standard for easy integration.

Terminal Pitch: 1 mm

Allows for high-density packaging and space-efficient design.

Moisture Sensitivity Level (MSL): 3

Suitable for use in environments with moderate humidity levels.

Drive Interface Standard: IEEE1394; IEEE1394A

Supports high-speed data transfer and communication protocols.

Technical Specifications

Serial Communication Controllers TSB43DB42GHC attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

400 MBps

Drive Interface Standard:

IEEE1394; IEEE1394A

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e0

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TSB43DB42GHC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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