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TRF1221IRGZT

Texas Instruments

TRF1221IRGZT by Texas Instruments

TRF1221IRGZT by Texas Instruments is an RF up converter with a frequency range of 1700-3600 MHz. It operates on 5V power supply, has 48 terminals, and can handle temperatures from -40 to 85°C. Ideal for applications requiring high-frequency conversion in RF/microwave systems.

Median Price

$32.828

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 12,695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,695

-

-

-

-

Rochester

USA . 12,482 parts In-Stock

1+ parts

-

100+ parts

$29.180

1k+ parts

$26.110

10k+ parts

$24.580

12,482

-

$29.180

$26.110

$24.580

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$36.475

1k+ parts

$32.638

10k+ parts

$30.725

5,000

-

$36.475

$32.638

$30.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,266 parts In-Stock

1+ parts

$30.808

100+ parts

-

1k+ parts

-

10k+ parts

-

4,266

$30.808

-

-

-

Vyrian

USA . 567 parts In-Stock

1+ parts

$32.430

100+ parts

-

1k+ parts

-

10k+ parts

-

567

$32.430

-

-

-

DigiKey Marketplace

USA . 12,695 parts In-Stock

1+ parts

$33.730

100+ parts

-

1k+ parts

-

10k+ parts

-

12,695

$33.730

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 66 parts In-Stock

1+ parts

$1.069

100+ parts

-

1k+ parts

$1.922

10k+ parts

-

66

$1.069

-

$1.922

-

DigiPath Technology Company

USA . 1,784 parts In-Stock

1+ parts

$1.177

100+ parts

-

1k+ parts

-

10k+ parts

-

1,784

$1.177

-

-

-

ChromeModa Solutions

Germany . 5,427 parts In-Stock

1+ parts

$1.201

100+ parts

$0.985

1k+ parts

-

10k+ parts

-

5,427

$1.201

$0.985

-

-

IDEA Electronic Components Group

UK . 2,034 parts In-Stock

1+ parts

$1.201

100+ parts

-

1k+ parts

$1.081

10k+ parts

-

2,034

$1.201

-

$1.081

-

Corphita

USA . 377 parts In-Stock

1+ parts

$29.187

100+ parts

-

1k+ parts

-

10k+ parts

-

377

$29.187

-

-

-

Component Stockers USA

USA . 9,382 parts In-Stock

1+ parts

$33.310

100+ parts

$31.310

1k+ parts

$28.310

10k+ parts

$28.310

9,382

$33.310

$31.310

$28.310

$28.310

Authorized Procurement Solutions

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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40,000

-

-

-

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A-Z Elektronik GmbH

Germany . 5,759 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,759

-

-

-

-

Kepictronics

USA . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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120

-

-

-

-

Overview

Unlock the power of seamless RF/Microwave conversion with the TRF1221IRGZT by Texas Instruments. Crafted with precision and expertise, this up/down converter offers unparalleled quality and performance in a compact and durable package. Whether you're in telecommunications, aerospace, or defense industries, this versatile component delivers reliable and efficient signal processing to meet your unique needs. Experience the value of superior technology and innovation with the TRF1221IRGZT, where excellence meets affordability for all your conversion requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that ensures longevity and portability of the converter.

Maximum RF Output Frequency: 3600 MHz

High frequency output enables support for a wide range of applications and devices.

Construction: COMPONENT

High-quality components used in construction ensure reliable performance and longevity.

Minimum RF Output Frequency: 1700 MHz

Supports a wide range of frequencies for versatility in usage scenarios.

Power Supplies (V): 5

Efficient power supply requirement ensures energy-saving operation.

No. of Terminals: 48

Sufficient terminals for connecting to various components and devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Operational in harsh cold conditions without compromising performance.

Terminal Finish: Matte Tin (Sn)

High-quality terminal finish for optimal connectivity and signal transmission.

LO Tunable: YES

Frequency agility through LO tuning for customized performance.

RF or Microwave Device Type: UP CONVERTER

Converts signals to higher frequencies for compatibility with various devices and systems.

Minimum Intermediate Frequency (IF): 250 MHz

Support for low intermediate frequencies for versatile signal processing.

Maximum Output Power: 0 dBm

Optimal output power level for efficient signal transmission and reception.

Minimum Input Power (CW): 20 dBm

High input power handling capability for robust performance.

Maximum Intermediate Frequency (IF): 350 MHz

Support for high intermediate frequencies for diverse signal processing needs.

Mounting Feature: SURFACE MOUNT

Easy and convenient mounting on surfaces for seamless integration into systems and devices.

Technical Specifications

RF/Microwave Up/Down Converters TRF1221IRGZT attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments

Specs

Construction:

COMPONENT

Maximum Intermediate Frequency (IF):

350 MHz

Minimum Intermediate Frequency (IF):

250 MHz

Minimum Input Power (CW):

20 dBm

JESD-609 Code:

e3

LO Tunable:

YES

Mounting Feature:

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Power:

0 dBm

Package Body Material:

Package Equivalence Code:

LCC48,.27SQ,20

Power Supplies (V):

5

Maximum RF Output Frequency:

3600 MHz

Minimum RF Output Frequency:

1700 MHz

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Terminal Finish:

Matte Tin (Sn)

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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