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TPIC5424LDW

Texas Instruments

TPIC5424LDW by Texas Instruments

TPIC5424LDW by Texas Instruments is a N-CHANNEL FET for SWITCHING applications. It features 60V DS Breakdown Voltage, 3A Pulsed Drain Current, and 0.48 ohm Drain-Source On Resistance. With a package style of SMALL OUTLINE, it operates in ENHANCEMENT MODE with max power dissipation of 1.4W at 150°C.

Median Price

$1.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

600

-

$1.750

$1.560

$1.470

DigiKey

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.300

10k+ parts

-

600

-

-

$2.300

-

Verical

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.950

10k+ parts

$1.837

600

-

-

$1.950

$1.837

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,792 parts In-Stock

1+ parts

$1.852

100+ parts

-

1k+ parts

-

10k+ parts

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1,792

$1.852

-

-

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Vyrian

USA . 2,819 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,819

-

-

-

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DigiKey Marketplace

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$2.030

1k+ parts

-

10k+ parts

-

600

-

$2.030

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,044 parts In-Stock

1+ parts

$0.306

100+ parts

-

1k+ parts

$1.549

10k+ parts

-

2,044

$0.306

-

$1.549

-

DigiPath Technology Company

USA . 985 parts In-Stock

1+ parts

$0.337

100+ parts

-

1k+ parts

-

10k+ parts

-

985

$0.337

-

-

-

ChromeModa Solutions

Germany . 6,732 parts In-Stock

1+ parts

$0.344

100+ parts

$0.282

1k+ parts

-

10k+ parts

-

6,732

$0.344

$0.282

-

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IDEA Electronic Components Group

UK . 227 parts In-Stock

1+ parts

$0.344

100+ parts

-

1k+ parts

$0.310

10k+ parts

-

227

$0.344

-

$0.310

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Corphita

USA . 3,987 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

-

10k+ parts

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3,987

$1.755

-

-

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Microchip USA

USA . 5,544 parts In-Stock

1+ parts

$12.155

100+ parts

-

1k+ parts

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10k+ parts

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5,544

$12.155

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-

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Assy Fe

Spain . 125 parts In-Stock

1+ parts

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100+ parts

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125

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Overview

Discover the TPIC5424LDW by Texas Instruments, a top-of-the-line Power FET with unparalleled quality and reliability. Designed by a trusted manufacturer, this complex N-CHANNEL transistor is perfect for switching applications. With a maximum pulsed drain current of 3A and an avalanche energy rating of 180mJ, this product offers exceptional performance and efficiency. Whether you're looking to enhance your electronic projects or streamline your systems, the TPIC5424LDW delivers value, benefits, and advantages that will exceed your expectations. Upgrade to Texas Instruments for superior quality and innovation in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging provides a durable and lightweight housing for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them ideal for switching applications.

Configuration: COMPLEX

The complex configuration allows for more precise control and customization of the FET's performance, leading to optimized output in different scenarios.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers reliable and efficient performance when turning on and off electrical circuits.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB, making it a convenient choice for compact electronic designs.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle high voltages without risk of damage, ensuring reliable operation in various voltage scenarios.

Maximum Pulsed Drain Current (IDM): 3 A

The high pulsed drain current rating of 3A allows the FET to handle short bursts of high current, making it suitable for applications with dynamic power requirements.

Maximum Power Dissipation (Abs): 1.4 W

With a maximum power dissipation of 1.4W, this FET can efficiently handle heat dissipation, ensuring reliable operation under high power conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the FET to operate in a wide range of environmental conditions without overheating, ensuring long-term reliability.

Maximum Drain-Source On Resistance: 0.48 ohm

The low on-resistance of 0.48 ohms minimizes power losses and improves efficiency in conduction mode, making it an optimal choice for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) TPIC5424LDW attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Maximum Drain-Source On Resistance:

.48 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

125 pF

JEDEC-95 Code:

MS-013AC

JESD-30 Code:

R-PDSO-G20

No. of Elements:

4

No. of Terminals:

20

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

1.389 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

3 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

132 ns

Maximum Turn On Time (ton):

110 ns

Trade Compliance

TPIC5424LDW Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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