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TMS5703137CPGEQQ1

Texas Instruments

TMS5703137CPGEQQ1 by Texas Instruments

TMS5703137CPGEQQ1 by Texas Instruments is a 32-bit microcontroller with 144 terminals, operating at up to 80 MHz. Ideal for automotive applications, it features 24-Ch 12-Bit ADC channels and connectivity options like CAN, ETHERNET, I2C, LIN, MIBSPI, SCI, and SPI. With a temperature range of -40 to 125 °C and low profile design at 1.6 mm seated height, it offers high performance in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 4,911 parts In-Stock

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Vyrian

USA . 2,849 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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Atlantic Semiconductor

USA . 10 parts In-Stock

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Connect4Technologies Inc.

Canada . 5 parts In-Stock

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AZTECH Wire

Italy . 604 parts In-Stock

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$15.451

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One Stop Electronics

USA . 734 parts In-Stock

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$35.000

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734

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Parana Technologies

USA . 2,046 parts In-Stock

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$63.681

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DigiPath Technology Company

USA . 1,940 parts In-Stock

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$70.121

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ChromeModa Solutions

Germany . 2,596 parts In-Stock

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$71.552

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$58.673

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IDEA Electronic Components Group

UK . 1,485 parts In-Stock

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$71.552

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$67.974

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$64.397

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Corphita

USA . 536 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Experience the power and precision of the TMS5703137CPGEQQ1 by Texas Instruments, a leading manufacturer in the industry. As part of the microcontrollers category, this versatile product offers unmatched quality and reliability for a wide range of applications. With features like multiple ADC and DMA channels, extensive connectivity options, and a robust RISC architecture, this microcontroller provides exceptional value and performance for automotive and industrial projects. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments and usage scenarios.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power input options, accommodating a range of power sources.

CPU Family: CORTEX-R4F

Being part of the CORTEX-R4F family ensures high-performance computing capabilities, making this microcontroller suitable for complex tasks and applications.

ROM Words: 3145728

With a large ROM size, this microcontroller can store a significant amount of program data, enabling the implementation of complex algorithms and functions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller allows for efficient and streamlined processing of instructions, leading to improved overall performance.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables this microcontroller to interface with analog sensors and signals, expanding its range of applications.

Connectivity: CAN(3), ETHERNET, I2C, LIN, MIBSPI(3), SCI(2), SPI

The versatile connectivity options make this microcontroller suitable for various communication protocols and network interfaces, enhancing its compatibility with other systems.

Technical Specifications

Microcontrollers TMS5703137CPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

58

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

420 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, LIN, MIBSPI(3), SCI(2), SPI

Peripherals:

DMA(16), POR, TIMER(40), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5703137CPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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