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TMS5703137BZWTQQ1

Texas Instruments

TMS5703137BZWTQQ1 by Texas Instruments

TMS5703137BZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 22-bit address bus width, operating at a max frequency of 80 MHz. Ideal for automotive applications, it features ADC and DMA channels, along with 262144 bytes of RAM for efficient data processing.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 687 parts In-Stock

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Nova Conductors

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One Stop Electronics

USA . 888 parts In-Stock

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AZTECH Wire

Italy . 272 parts In-Stock

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$19.133

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Ampacity Inc.

Singapore . 682 parts In-Stock

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Parana Technologies

USA . 652 parts In-Stock

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DigiPath Technology Company

USA . 1,961 parts In-Stock

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$33.794

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$31.091

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ChromeModa Solutions

Germany . 3,006 parts In-Stock

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IDEA Electronic Components Group

UK . 465 parts In-Stock

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Corohmni

South Africa . 634 parts In-Stock

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Continental Prestige Electronics

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Lixinc

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Corphita

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Aranea Global

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Argo Parts USA

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Microchip USA

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Perfect Parts

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Overview

Upgrade your electronic devices with the TMS5703137BZWTQQ1 microcontroller from Texas Instruments, a leader in innovative technology solutions. Ideal for automotive applications, this high-quality product offers unmatched performance and reliability. With advanced features like ADC and DMA channels, ROM programmability, and PWM channels, this microcontroller provides seamless integration and enhanced functionality. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights. Choose the TMS5703137BZWTQQ1 for superior quality and unparalleled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Maximum Supply Voltage: 1.32 V

Allows for a higher maximum supply voltage, providing flexibility in power supply options.

CPU Family: CORTEX-R4F

The CORTEX-R4F family offers high performance and energy efficiency, making this microcontroller suitable for a variety of applications.

Maximum Operating Temperature: 125 °C

Can operate effectively in high temperature environments, enhancing reliability.

RAM Bytes: 262144

With a large RAM capacity, this microcontroller can handle complex tasks and store more data efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient processing and execution of instructions, resulting in faster operation.

Maximum Clock Frequency: 80 MHz

High clock frequency enables quick execution of instructions and faster data processing.

Technical Specifications

Microcontrollers TMS5703137BZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

337

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

440 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS5703137BZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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