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TMS5703137BPGEQQ1

Texas Instruments

TMS5703137BPGEQQ1 by Texas Instruments

TMS5703137BPGEQQ1 by Texas Instruments is a 32-bit microcontroller with 144 terminals, operating at up to 80 MHz. Ideal for automotive applications, it features 24-Ch 12-Bit ADCs, 16 DMA channels, and peripherals like CAN, Ethernet, I2C, LIN, SCI, SPI. With low power mode and on-chip Flash ROM programmability.

Median Price

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2

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1k+

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Vyrian

USA . 7,181 parts In-Stock

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Digiode

USA . 324 parts In-Stock

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324

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AZTECH Wire

Italy . 336 parts In-Stock

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$16.371

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One Stop Electronics

USA . 1,227 parts In-Stock

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$21.000

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Parana Technologies

USA . 213 parts In-Stock

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$69.016

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$6,409.177

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$62.114

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213

$69.016

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DigiPath Technology Company

USA . 297 parts In-Stock

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$75.995

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$69.915

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ChromeModa Solutions

Germany . 4,660 parts In-Stock

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$77.546

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$63.588

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$77.546

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IDEA Electronic Components Group

UK . 378 parts In-Stock

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$77.546

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$73.669

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$69.791

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378

$77.546

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$69.791

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Lixinc

USA . 2,541 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unleash the power of innovation with the TMS5703137BPGEQQ1 by Texas Instruments, a high-quality microcontroller designed for automotive applications. With its advanced technology and robust manufacturing by Texas Instruments, this microcontroller offers unparalleled performance and reliability. From CAN bus communication to Ethernet connectivity, this versatile device provides customers with endless possibilities for their automotive projects. Trust in Texas Instruments to deliver cutting-edge solutions that drive success in the automotive industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and resistance to external elements, making the product suitable for various environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range for the device, preventing potential damage from overvoltage.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, making the product suitable for automotive applications that require stringent criteria.

Package Shape: SQUARE

The square shape allows for a compact design, optimizing space utilization on the PCB.

Bit Size: 32

Offers high computational capabilities and processing power, suitable for handling complex tasks and applications.

Power Supplies (V): 1.2,3.3

Provides flexibility in voltage requirements, allowing compatibility with a wide range of external components and peripherals.

No. of Terminals: 144

Sufficient number of terminals for connecting to various external devices and interfaces, enabling versatile functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Different package styles offer flexibility in PCB design and assembly options, catering to specific requirements of the application.

Minimum Supply Voltage: 1.14 V

Ensures the device operates reliably even at low supply voltages, enhancing power efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range makes the product suitable for harsh environmental conditions and extended operation.

CPU Family: CORTEX-R4F

Utilizes a powerful CPU architecture that offers high performance and efficiency, ideal for demanding applications.

Minimum Operating Temperature: -40 °C

Withstands extremely low temperatures, making the product suitable for automotive and industrial applications in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance, ensuring reliable electrical connections for the device's terminals.

ADC Channels: YES

Integrated analog-to-digital converters enable the device to interface with analog sensors and signals, expanding its usability in various applications.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce the load on the CPU, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal layout facilitates easy and secure PCB mounting, ensuring stable connections and reliability.

ROM Words: 3145728

Large ROM capacity allows for storing extensive program data and instructions, supporting complex algorithms and functionalities.

Maximum Seated Height: 1.6 mm

Low seated height aids in compact PCB design and space-saving, crucial for electronic devices with size constraints.

Width: 20 mm

Compact width dimension contributes to the overall small form factor of the device, suitable for applications with limited space.

Boundary Scan: YES

Boundary scan capability enables testing and debugging of PCB connections, ensuring manufacturing quality and reliability.

Peripherals: DMA(16), POR, TIMER(51), WDT

Rich set of peripherals including timers, watchdog timer, and DMA controllers enhance the device's functionality and versatility for various applications.

Maximum Clock Frequency: 80 MHz

High clock frequency enables fast processing and execution of instructions, making the product suitable for real-time and high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature time ensures proper soldering and assembly process, maintaining the reliability of the device during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance supports lead-free soldering processes, complying with modern environmental standards.

Length: 20 mm

Compact length dimension contributes to the space-saving design of the device, suitable for applications with size constraints.

Temperature Grade: AUTOMOTIVE

Designed and tested for automotive-grade reliability and performance, ensuring durability and stability in rugged automotive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture microcontroller with integrated peripherals, offering efficient processing and control capabilities for a wide range of applications.

RAM Bytes: 262144

Ample RAM capacity allows for efficient data storage and processing, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the device.

Terminal Form: GULL WING

Gull wing terminal form provides secure mounting and soldering capabilities, ensuring reliable electrical connections for the device.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple high-resolution ADC channels facilitate accurate analog signal conversion, enabling precise sensor interfacing and data acquisition.

Maximum Supply Current: 420 mA

The specified supply current ensures stable and efficient operation of the device within the specified voltage range, supporting its overall performance.

Nominal Supply Voltage: 1.2 V

Nominal supply voltage ensures consistent and stable operation of the device, improving reliability and performance.

No. of DMA Channels: 16

Multiple DMA channels enable efficient data transfer and management, optimizing system performance and responsiveness.

PWM Channels: YES

Pulse Width Modulation channels provide precise control over analog devices and motors, enhancing the device's versatility in control applications.

Connectivity: CAN(3), ETHERNET, I2C, LIN, SCI, SPI(5)

Diverse connectivity options including CAN, Ethernet, I2C, LIN, SCI, and SPI interfaces allow for seamless integration with various communication protocols and networks.

ROM Programmability: FLASH

Flash ROM programming capability enables easy and flexible firmware updates, ensuring adaptability to changing requirements and functionalities.

Terminal Pitch: 0.5 mm

Fine terminal pitch aids in compact PCB design and space-saving, crucial for electronic devices with size constraints.

Format: FLOATING POINT

Supports floating-point arithmetic operations, enabling high-precision calculations and mathematical functions for sophisticated applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to prevent damage.

Speed: 160 rpm

The specified speed rating indicates the device's processing capabilities, supporting high-speed data processing and control tasks.

Low Power Mode: YES

Low power mode functionality enhances energy efficiency and prolongs battery life, making the device suitable for portable and battery-powered applications.

On Chip Program ROM Width: 8

On-chip program ROM with a width of 8 bits supports efficient program storage and execution, enhancing the device's overall performance.

No. of I/O Lines: 58

Adequate number of I/O lines allow for versatile connectivity and interfacing with external devices, expanding the device's functionality and application scope.

Technical Specifications

Microcontrollers TMS5703137BPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

58

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

420 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Connectivity:

CAN(3), ETHERNET, I2C, LIN, SCI, SPI(5),

Peripherals:

DMA(16), POR, TIMER(51), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5703137BPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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