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TMS5703134DZWTQQ1

Texas Instruments

TMS5703134DZWTQQ1 by Texas Instruments

TMS5703134DZWTQQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU, 24-Ch 12-Bit ADC, and 45 timers. Ideal for automotive applications, it features CAN(3), I2C, SCI(2), SPI(5) connectivity and operates at up to 80 MHz clock frequency. With low power mode and integrated cache, it offers high performance in a compact package.

Median Price

$25.430

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 559 parts In-Stock

1+ parts

$25.430

100+ parts

$22.605

1k+ parts

$16.621

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559

$25.430

$22.605

$16.621

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Distributors (In-Stock)

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Digiode

USA . 1,248 parts In-Stock

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$24.158

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$24.158

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Vyrian

USA . 9,475 parts In-Stock

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9,475

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Chip Stock

USA . 133 parts In-Stock

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133

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Distributors (Availability)

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AZTECH Wire

Italy . 669 parts In-Stock

1+ parts

$13.530

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669

$13.530

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Corphita

USA . 133 parts In-Stock

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$22.887

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133

$22.887

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Parana Technologies

USA . 1,124 parts In-Stock

1+ parts

$37.570

100+ parts

$3,488.987

1k+ parts

$33.813

10k+ parts

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1,124

$37.570

$3,488.987

$33.813

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DigiPath Technology Company

USA . 2,083 parts In-Stock

1+ parts

$41.370

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2,083

$41.370

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ChromeModa Solutions

Germany . 3,731 parts In-Stock

1+ parts

$42.214

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$34.615

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3,731

$42.214

$34.615

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IDEA Electronic Components Group

UK . 2,156 parts In-Stock

1+ parts

$42.214

100+ parts

$40.103

1k+ parts

$37.993

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2,156

$42.214

$40.103

$37.993

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Component Stockers USA

USA . 347 parts In-Stock

1+ parts

$349.320

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347

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Overview

Unlock the potential of your automotive applications with the TMS5703134DZWTQQ1 microcontroller from Texas Instruments. With a cutting-edge Cortex-R4F CPU family and advanced peripherals like ADC, DMA, and PWM channels, this device offers unmatched performance and flexibility. Designed with automotive-grade technology, this microcontroller ensures reliability even in extreme temperatures. Whether you're developing ADAS systems or vehicle control units, trust Texas Instruments for superior quality and innovation. Experience the power of precision engineering with the TMS5703134DZWTQQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a wide range of environments.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quicker retrieval.

Maximum Supply Voltage: 1.32 V

Allows for efficient power usage and helps prevent damage from voltage spikes.

On Chip Data RAM Width: 8

Enables faster data processing and storage capabilities.

Address Bus Width: 22

Supports a large memory address space for handling complex applications.

Screening Level: AEC-Q100

Meets automotive industry quality standards for reliability and performance in harsh conditions.

Technical Specifications

Microcontrollers TMS5703134DZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

144

No. of Serial I/Os:

5

No. of Terminals:

337

No. of Timers:

45

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Maximum Supply Current:

700 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SCI(2), SPI(5)

Peripherals:

DMA(16), POR, TIMER(45), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5703134DZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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