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TMS5702125CZWTQQ1

Texas Instruments

TMS5702125CZWTQQ1 by Texas Instruments

TMS5702125CZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 22-bit address bus width, operating at max 80 MHz. Ideal for automotive applications, it features 24-Ch 12-Bit ADCs, DMA(16) channels, and connectivity options like CAN(3), I2C, SCI(2), SPI(5).

Median Price

$59.488

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 228 parts In-Stock

1+ parts

$59.488

100+ parts

$62.462

1k+ parts

$58.893

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228

$59.488

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$58.893

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Vyrian

USA . 5,237 parts In-Stock

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Digiode

USA . 2,643 parts In-Stock

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2,643

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Distributors (Availability)

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One Stop Electronics

USA . 559 parts In-Stock

1+ parts

$7.000

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559

$7.000

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AZTECH Wire

Italy . 327 parts In-Stock

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$15.426

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327

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Parana Technologies

USA . 1,128 parts In-Stock

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$31.976

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$93.282

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$31.976

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DigiPath Technology Company

USA . 1,773 parts In-Stock

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$35.209

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$32.393

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1,773

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IDEA Electronic Components Group

UK . 792 parts In-Stock

1+ parts

$35.928

100+ parts

$34.132

1k+ parts

$32.335

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792

$35.928

$34.132

$32.335

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ChromeModa Solutions

Germany . 441 parts In-Stock

1+ parts

$35.928

100+ parts

$29.461

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441

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Corphita

USA . 3,491 parts In-Stock

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Microchip USA

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Overview

Experience the next level of performance and reliability with the TMS5702125CZWTQQ1 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments offers top-notch quality and innovation in every product. Ideal for automotive applications, this microcontroller delivers unmatched efficiency and power with its advanced features like 24-channel ADC converters and 12-bit resolution. Trust Texas Instruments to provide the cutting-edge solutions you need for your projects, ensuring seamless integration and superior performance every time. Choose the TMS5702125CZWTQQ1 and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during assembly.

Maximum Supply Voltage: 1.32 V

Efficient power usage and optimal performance within the specified voltage range.

Address Bus Width: 22

Allows for efficient and fast memory addressing, enhancing overall processing speed.

Screening Level: AEC-Q100

Meets automotive quality standards, ensuring reliability and performance in automotive applications.

Bit Size: 32

Provides high processing capabilities and supports a wide range of applications.

Power Supplies (V): 1.2

Operates within a standard voltage range for compatibility with various power sources.

No. of Terminals: 337

Offers a high level of connectivity for interfacing with other components and peripherals.

Width: 16 mm

Compact size allows for integration into smaller devices and circuit designs.

Maximum Clock Frequency: 80 MHz

High clock frequency enables fast data processing and performance in real-time applications.

Temperature Grade: AUTOMOTIVE

Designed to withstand harsh automotive environments, making it suitable for automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and streamlined processing of instructions.

RAM Bytes: 196608

Ample memory for storing data and executing programs, supporting complex computation tasks.

Analog To Digital Convertors: 24-Ch 12-Bit

Integrated ADC channels for accurate and high-resolution analog-to-digital conversions.

Connectivity: CAN(3), I2C, SCI(2), SPI(5)

Supports multiple communication interfaces for versatile connectivity and compatibility with various devices.

Technical Specifications

Microcontrollers TMS5702125CZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

144

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

375 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SCI(2), SPI(5)

Peripherals:

DMA(16), POR, TIMER(45), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5702125CZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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