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TMS5701227BPGEQQ1

Texas Instruments

TMS5701227BPGEQQ1 by Texas Instruments

TMS5701227BPGEQQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU, 144 terminals, and 80 MHz clock frequency. Ideal for automotive applications, it features ADC and DMA channels, 327680 ROM words, and operates in temperature range of -40 to 125 °C.

Median Price

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4

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1k+

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Digiode

USA . 3,272 parts In-Stock

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Vyrian

USA . 1,161 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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Atlantic Semiconductor

USA . 10 parts In-Stock

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AZTECH Wire

Italy . 691 parts In-Stock

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$8.113

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Parana Technologies

USA . 1,207 parts In-Stock

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$18.492

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DigiPath Technology Company

USA . 213 parts In-Stock

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$20.362

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$18.733

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ChromeModa Solutions

Germany . 6,492 parts In-Stock

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IDEA Electronic Components Group

UK . 2,333 parts In-Stock

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$19.739

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$18.700

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One Stop Electronics

USA . 1,229 parts In-Stock

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Corphita

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Perfect Parts

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Microchip USA

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Overview

Experience superior performance and reliability with the TMS5701227BPGEQQ1 microcontroller by Texas Instruments. Renowned for their cutting-edge technology and innovation, Texas Instruments has crafted a versatile product suitable for various applications in the automotive industry. With features like high-speed processing, advanced ADC and DMA channels, and low power consumption, this microcontroller offers unmatched value and efficiency to customers looking to elevate their projects to the next level. Trust in Texas Instruments to deliver exceptional quality and performance with the TMS5701227BPGEQQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the microcontroller lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly of the microcontroller.

Maximum Supply Voltage: 1.32 V

With a maximum supply voltage of 1.32V, this microcontroller is energy-efficient and can operate within a low power consumption range.

Address Bus Width: 13

A wider address bus width of 13 allows for efficient memory addressing and data transfer within the microcontroller.

Screening Level: AEC-Q100

AEC-Q100 screening standard ensures high reliability and quality, making it suitable for automotive applications where durability is critical.

Package Shape: SQUARE

The square package shape provides easy mounting and fitting within compact spaces on the PCB.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger data sizes and perform complex operations efficiently.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2V and 3.3V) allows flexibility in design and compatibility with different power sources.

No. of Terminals: 144

Having 144 terminals provides a sufficient number of connection points for interfacing with other components and peripherals.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14V ensures the microcontroller can operate efficiently even at lower power levels.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this microcontroller can withstand harsh environmental conditions and high-temperature environments.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family offers high performance and efficiency, making this microcontroller suitable for real-time applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C ensures reliable operation even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to interface with analog sensors and signals, expanding its application range.

DMA Channels: YES

Support for DMA channels allows for efficient data transfer between peripherals and memory, reducing CPU overhead and improving system performance.

ROM Words: 327680

With a large ROM size of 327680 words, this microcontroller can store a significant amount of program memory for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6mm makes this microcontroller suitable for compact designs with limited vertical space.

Width: 20 mm

The compact width of 20mm allows for easy placement and integration of the microcontroller into various PCB layouts.

External Data Bus Width: 16

The 16-bit external data bus width enables high-speed data transfer between the microcontroller and external memory devices.

Maximum Clock Frequency: 80 MHz

Operating at a maximum clock frequency of 80MHz, this microcontroller can deliver high-speed processing for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly of the microcontroller on the PCB.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can withstand the high temperatures of the reflow soldering process during assembly.

Length: 20 mm

The compact length of 20mm allows for space-efficient placement and integration of the microcontroller within the PCB layout.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets the high-quality and reliability standards required for automotive electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient and optimized instruction execution, making it suitable for performance-critical applications.

RAM Bytes: 196608

With a large RAM size of 196608 bytes, this microcontroller can efficiently handle data processing and storage requirements for complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

The gull-wing terminal form factor provides secure and reliable solder connections during PCB assembly, ensuring robust electrical connections.

Maximum Supply Current: 350 mA

With a maximum supply current of 350mA, this microcontroller operates within a low power consumption range, ideal for energy-efficient applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures stable and efficient operation of the microcontroller within a specified voltage range.

PWM Channels: YES

Support for PWM channels allows for precise control of digital signals, making this microcontroller suitable for applications requiring accurate pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick reprogramming of the microcontroller firmware, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting and space-efficient PCB layout design.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this microcontroller can withstand moderate exposure to moisture during storage and assembly processes.

Speed: 160 rpm

Operating at a speed of 160 rpm, this microcontroller can deliver fast and responsive performance for real-time applications.

No. of I/O Lines: 16

Having 16 I/O lines provides flexibility in interfacing with external devices and peripherals, enabling versatile connectivity options.

Technical Specifications

Microcontrollers TMS5701227BPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

327680

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS5701227BPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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