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TMS5701224CZWTQQ1

Texas Instruments

TMS5701224CZWTQQ1 by Texas Instruments

TMS5701224CZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 1310720 ROM words, 196608 RAM bytes, and 24-Ch 12-Bit ADC channels. Ideal for automotive applications due to AEC-Q100 screening level, CORTEX-R4F CPU family, and connectivity options like CAN, I2C, LIN.

Median Price

$19.065

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,753 parts In-Stock

1+ parts

$19.065

100+ parts

$16.653

1k+ parts

$11.485

10k+ parts

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10,753

$19.065

$16.653

$11.485

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 892 parts In-Stock

1+ parts

$18.112

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892

$18.112

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Nova Conductors

Japan . 15 parts In-Stock

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$19.980

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15

$19.980

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Vyrian

USA . 8,849 parts In-Stock

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8,849

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Distributors (Availability)

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AZTECH Wire

Italy . 263 parts In-Stock

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$14.300

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263

$14.300

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Ampacity Inc.

Singapore . 10,649 parts In-Stock

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$16.210

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10,649

$16.210

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Semicontronic

India . 10,571 parts In-Stock

1+ parts

$16.210

100+ parts

$15.805

1k+ parts

$15.724

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-

10,571

$16.210

$15.805

$15.724

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Corphita

USA . 3,849 parts In-Stock

1+ parts

$17.158

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3,849

$17.158

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$19.580

100+ parts

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$18.797

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500

$19.580

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$18.797

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Continental Prestige Electronics

USA . 5,835 parts In-Stock

1+ parts

$19.980

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$19.580

5,835

$19.980

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$19.580

Corohmni

South Africa . 197 parts In-Stock

1+ parts

$36.315

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197

$36.315

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Parana Technologies

USA . 1,758 parts In-Stock

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$43.474

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1,758

$43.474

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DigiPath Technology Company

USA . 1,709 parts In-Stock

1+ parts

$47.870

100+ parts

$44.040

1k+ parts

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1,709

$47.870

$44.040

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ChromeModa Solutions

Germany . 6,647 parts In-Stock

1+ parts

$48.847

100+ parts

$40.055

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6,647

$48.847

$40.055

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IDEA Electronic Components Group

UK . 1,009 parts In-Stock

1+ parts

$48.847

100+ parts

$46.405

1k+ parts

$43.962

10k+ parts

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1,009

$48.847

$46.405

$43.962

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QUARKTWIN TECHNOLOGY LTD

USA . 22,301 parts In-Stock

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Component Connect

USA . 9,834 parts In-Stock

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9,834

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Argo Parts USA

USA . 2,749 parts In-Stock

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2,749

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Overview

Discover the cutting-edge TMS5701224CZWTQQ1 by Texas Instruments, a top-tier manufacturer renowned for delivering high-quality microcontrollers. Ideal for automotive applications, this powerful device offers unparalleled performance and reliability. With advanced features like 24-channel 12-bit ADCs and 16 DMA channels, this product ensures seamless connectivity and efficient operation. Trust in Texas Instruments to provide you with the innovative solutions you need to elevate your projects to the next level. Experience the value and benefits of the TMS5701224CZWTQQ1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection to the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power input, accommodating a range of voltage levels without damaging the device.

Package Shape: SQUARE

The square package shape helps in efficient placement on circuit boards and saves space, making it ideal for compact designs.

CPU Family: CORTEX-R4F

Being part of the CORTEX-R4F family ensures high performance and reliability in processing data and running applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the microcontroller to operate in harsh environmental conditions without overheating.

ADC Channels: YES

The presence of Analog to Digital Converters enables the microcontroller to accurately convert analog signals to digital data for processing.

Connectivity: CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI(2)

The multiple connectivity options make it versatile for communication with other devices, networks, and sensors in various applications.

Speed: 180 rpm

The high speed capability of 180 rpm allows the microcontroller to process data quickly and efficiently, ensuring smooth operation in real-time applications.

Technical Specifications

Microcontrollers TMS5701224CZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

101

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

196608

ROM Words:

1310720

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI(2)

Peripherals:

CAP(6), DMA(16), POR, PWM(14), QEP(2), TIMER(44), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5701224CZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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