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TMS5701115CZWTQQ1

Texas Instruments

TMS5701115CZWTQQ1 by Texas Instruments

TMS5701115CZWTQQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU family, offering 128KB RAM and 64K data EEPROM. It features 24-Ch 12-Bit ADCs, 16 DMA channels, and peripherals like CAN, I2C, LIN for automotive applications. Operating at up to 80MHz with low power mode support and FLASH ROM programmability.

Median Price

$17.858

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 740 parts In-Stock

1+ parts

$17.858

100+ parts

$15.599

1k+ parts

$10.758

10k+ parts

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740

$17.858

$15.599

$10.758

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,733 parts In-Stock

1+ parts

$16.965

100+ parts

-

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-

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4,733

$16.965

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Vyrian

USA . 4,292 parts In-Stock

1+ parts

-

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4,292

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 333 parts In-Stock

1+ parts

$12.280

100+ parts

-

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333

$12.280

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Corphita

USA . 795 parts In-Stock

1+ parts

$16.072

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-

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795

$16.072

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Advanced Electronics

New Zealand . 97 parts In-Stock

1+ parts

$32.474

100+ parts

$29.551

1k+ parts

$26.629

10k+ parts

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97

$32.474

$29.551

$26.629

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Microchip USA

USA . 3,238 parts In-Stock

1+ parts

$48.080

100+ parts

$47.390

1k+ parts

$47.050

10k+ parts

$46.700

3,238

$48.080

$47.390

$47.050

$46.700

Parana Technologies

USA . 43 parts In-Stock

1+ parts

$53.109

100+ parts

-

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43

$53.109

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DigiPath Technology Company

USA . 392 parts In-Stock

1+ parts

$58.480

100+ parts

$53.801

1k+ parts

-

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392

$58.480

$53.801

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ChromeModa Solutions

Germany . 6,924 parts In-Stock

1+ parts

$59.673

100+ parts

$48.932

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6,924

$59.673

$48.932

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IDEA Electronic Components Group

UK . 2,301 parts In-Stock

1+ parts

$59.673

100+ parts

$56.689

1k+ parts

$53.706

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2,301

$59.673

$56.689

$53.706

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Overview

Experience the power of innovation with the TMS5701115CZWTQQ1 microcontroller by Texas Instruments. This cutting-edge device, part of the CORTEX-R4F CPU family, offers unmatched performance and reliability for automotive applications. With features like 24-ch 12-bit ADCs, 16 DMA channels, and 40 timers, this microcontroller ensures seamless connectivity and precision control. Trust Texas Instruments to deliver top-quality products that exceed expectations and drive your projects towards success. Upgrade to the TMS5701115CZWTQQ1 today and revolutionize your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this microcontroller lightweight and durable for various applications.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V allows for reliable operation without risking damage to the microcontroller.

Address Bus Width: 13

With a 13-bit address bus width, this microcontroller can efficiently access a large memory space, enabling complex computations and data processing.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels allows for the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller makes it efficient in executing instructions quickly, making it suitable for real-time applications.

Maximum Clock Frequency: 80 MHz

The high maximum clock frequency of 80 MHz enables fast processing speed and performance in demanding applications.

Connectivity: CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI(2)

Offering a variety of connectivity options such as CAN, I2C, LIN, SPI, etc., makes this microcontroller versatile and suitable for communication with different devices and protocols.

Technical Specifications

Microcontrollers TMS5701115CZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

101

No. of Serial I/Os:

7

No. of Terminals:

337

No. of Timers:

40

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

128

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Maximum Supply Current:

465 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI(2)

Peripherals:

CAP(6), CRC(2), DMA(16), QEP(2), POR, PWM(14), TIMER(44)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5701115CZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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