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TMS470R1A384PZQ

Texas Instruments

TMS470R1A384PZQ by Texas Instruments

TMS470R1A384PZQ by Texas Instruments is a 32-bit ARM7 microcontroller with 393216 ROM words, 32768 RAM bytes, and 14 I/O lines. Ideal for automotive applications, it operates b/w -40 to 125 °C with a max clock frequency of 20 MHz. It features ADC and DMA channels, PWM support, and low power consumption at a max supply current of 115 mA.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,816 parts In-Stock

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Digiode

USA . 1,379 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 482 parts In-Stock

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$12.124

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482

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One Stop Electronics

USA . 1,515 parts In-Stock

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$23.000

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Parana Technologies

USA . 1,437 parts In-Stock

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$27.975

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$42.330

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DigiPath Technology Company

USA . 1,313 parts In-Stock

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$30.804

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ChromeModa Solutions

Germany . 5,259 parts In-Stock

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$31.433

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$25.775

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$31.433

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IDEA Electronic Components Group

UK . 690 parts In-Stock

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$31.433

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$29.861

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$28.290

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690

$31.433

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Advanced Electronics

New Zealand . 209 parts In-Stock

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$48.166

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$47.684

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$45.757

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Corphita

USA . 4,490 parts In-Stock

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Microchip USA

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Overview

Experience the exceptional performance of the TMS470R1A384PZQ microcontroller by Texas Instruments, a leading manufacturer known for producing high-quality and reliable electronic components. This versatile microcontroller is ideal for a wide range of applications in the automotive industry, offering advanced features such as ADC and DMA channels, PWM channels, and a 32-bit CPU. With a compact square package design and a wide temperature range, this microcontroller delivers superior functionality and efficiency, making it the perfect choice for your next project. Unlock endless possibilities with the TMS470R1A384PZQ and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the microcontroller.

Surface Mount: YES

Allows for easy installation on circuit boards, reducing assembly time.

Maximum Supply Voltage: 2.05 V

Provides a safe operating range for the microcontroller.

Package Shape: SQUARE

Facilitates efficient placement on the circuit board.

Bit Size: 32

Offers a high level of processing capability for complex tasks.

Power Supplies (V): 1.9,3.3

Allows for flexibility in power input options.

No. of Terminals: 100

Provides multiple connection points for interfacing with other components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and space-efficient design for the microcontroller.

Minimum Supply Voltage: 1.71 V

Ensures stable performance even under low voltage conditions.

Maximum Operating Temperature: 125 °C

Suitable for use in a wide range of temperature environments.

CPU Family: ARM7

Known for its high performance and energy efficiency.

Minimum Operating Temperature: -40 °C

Allows for operation in cold temperature environments.

ADC Channels: YES

Enables the microcontroller to convert analog signals into digital data.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory.

Terminal Position: QUAD

Helps in organizing and connecting external devices to the microcontroller.

ROM Words: 393216

Offers large storage capacity for program and data storage.

Maximum Seated Height: 1.6 mm

Allows for a compact overall design of the microcontroller module.

Width: 14 mm

Compact dimensions for space-constrained applications.

Maximum Clock Frequency: 20 MHz

Provides fast processing speeds for quick response times.

Length: 14 mm

Compact dimensions for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications with temperature requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses Reduced Instruction Set Computing for efficient processing.

RAM Bytes: 32768

Sufficient memory for storing and manipulating data during operation.

Technology: CMOS

Known for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering of the microcontroller to the circuit board.

Maximum Supply Current: 115 mA

Indicates the maximum current consumption of the microcontroller.

Nominal Supply Voltage: 2 V

Provides the recommended voltage for optimal performance.

PWM Channels: YES

Allows for precise control of digital signals for various applications.

ROM Programmability: FLASH

Enables reprogramming of the ROM memory for flexibility in applications.

Terminal Pitch: 0.5 mm

Provides fine pitch for connecting external devices to the microcontroller.

Speed: 48 rpm

Indicates the maximum speed of data processing and response time.

No. of I/O Lines: 14

Sufficient input/output lines for interfacing with external devices.

Technical Specifications

Microcontrollers TMS470R1A384PZQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

14

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

115 mA

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS470R1A384PZQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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