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TMS32C6414EZLZ5E0

Texas Instruments

TMS32C6414EZLZ5E0 by Texas Instruments

TMS32C6414EZLZ5E0 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.18 MHz. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption.

Median Price

$123.276

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$106.940

1k+ parts

$95.680

10k+ parts

$90.060

15

-

$106.940

$95.680

$90.060

DigiKey

USA . 15 parts In-Stock

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-

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15

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Verical

USA . 15 parts In-Stock

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$139.613

1k+ parts

$126.250

10k+ parts

-

15

-

$139.613

$126.250

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 20 parts In-Stock

1+ parts

$90.000

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20

$90.000

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Digiode

USA . 4,738 parts In-Stock

1+ parts

$112.879

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4,738

$112.879

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DigiKey Marketplace

USA . 15 parts In-Stock

1+ parts

$114.430

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15

$114.430

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Vyrian

USA . 7,390 parts In-Stock

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7,390

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Microfarads

USA . 19 parts In-Stock

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 483 parts In-Stock

1+ parts

$55.393

100+ parts

-

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-

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483

$55.393

-

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DigiPath Technology Company

USA . 1,287 parts In-Stock

1+ parts

$60.994

100+ parts

$56.115

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-

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1,287

$60.994

$56.115

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IDEA Electronic Components Group

UK . 358 parts In-Stock

1+ parts

$62.239

100+ parts

$59.127

1k+ parts

$56.015

10k+ parts

-

358

$62.239

$59.127

$56.015

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ChromeModa Solutions

Germany . 302 parts In-Stock

1+ parts

$62.239

100+ parts

$51.036

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302

$62.239

$51.036

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Corohmni

South Africa . 2,373 parts In-Stock

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$77.138

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2,373

$77.138

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Corphita

USA . 879 parts In-Stock

1+ parts

$106.938

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879

$106.938

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Microchip USA

USA . 2,436 parts In-Stock

1+ parts

$120.790

100+ parts

$117.570

1k+ parts

$115.960

10k+ parts

$114.350

2,436

$120.790

$117.570

$115.960

$114.350

Perfect Parts

USA . 134 parts In-Stock

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Authorized Procurement Solutions

USA . 49 parts In-Stock

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Overview

Experience unparalleled performance and versatility with the TMS32C6414EZLZ5E0 by Texas Instruments. As a leading manufacturer in the industry of Digital Signal Processors, Texas Instruments delivers cutting-edge technology that meets the demands of various applications. With integrated cache and low power mode, this DSP offers unmatched value and benefits to customers. Whether you're working on audio processing, telecommunications, or control systems, this product provides the reliability and efficiency you need to take your projects to the next level. Choose Texas Instruments for quality, innovation, and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices or products requiring rugged construction.

Integrated Cache: YES

Integrated cache helps improve the overall performance of the DSP, allowing for faster data access and processing.

Maximum Supply Voltage: 1.26 V

Operates at a relatively low maximum supply voltage, making it energy-efficient and suitable for low-power applications.

Address Bus Width: 32

With a wide address bus width of 32, the DSP can handle large amounts of memory and data, enabling complex signal processing tasks.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and facilitates easier placement on the PCB.

Bit Size: 32

With a 32-bit architecture, the DSP can perform high-speed calculations and processing of digital signals with precision.

Power Supplies (V): 1.2,3.3

Supports multiple power supply voltages, offering flexibility for different system requirements and power management strategies.

No. of Terminals: 532

The high number of terminals provides ample connectivity options and interfaces for connecting peripherals and external components.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Offers various package styles for different mounting and thermal management needs, ensuring reliable operation in diverse applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage enhances energy efficiency and extends battery life in power-constrained applications.

Maximum Operating Temperature: 90 °C

Capable of operating at high temperatures, making it suitable for industrial and automotive applications where thermal performance is crucial.

No. of External Interrupts: 4

Provides external interrupt capabilities for handling time-critical events and real-time signal processing tasks.

Minimum Operating Temperature: 0 °C

Capable of operating in cold environments, ensuring reliable performance in various temperature conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/Silver/Copper terminal finish offers good conductivity and corrosion resistance, enhancing the longevity of the product.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, providing easy access to the terminals for soldering and mounting.

Maximum Seated Height: 3.3 mm

Low seated height allows for a compact and slim design, suitable for space-constrained applications or products with height restrictions.

RAM Words: 16384

Large RAM capacity of 16384 words enables efficient data storage and retrieval for processing complex algorithms and signal patterns.

Width: 23 mm

Compact width dimension makes it suitable for applications with limited board space or size constraints.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes during manufacturing and maintenance, improving overall product reliability.

External Data Bus Width: 64

Wide external data bus width of 64 bits enhances data transfer speeds and bandwidth, enabling high-throughput signal processing.

Maximum Clock Frequency: 75.18 MHz

High maximum clock frequency allows for fast processing of digital signals and real-time data, meeting demanding performance requirements.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during soldering processes, ensuring reliable connections and robust assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture improves data flow and communication within the DSP, optimizing performance and efficiency.

Length: 23 mm

Compact length dimension makes it suitable for space-constrained designs or products requiring a slim profile.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports a variety of peripheral IC types, expanding connectivity and compatibility with other devices and components in the system.

No. of Timers: 3

Multiple timers facilitate time-sensitive operations and scheduling tasks, enhancing the versatility and functionality of the DSP.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for energy-efficient and high-performance applications.

Terminal Form: BALL

Ball terminal form provides reliable connections and solder joints, ensuring stable operation and durability in harsh environmental conditions.

Maximum Supply Current: 125 mA

Low maximum supply current consumption helps reduce power dissipation and extends battery life in portable and battery-operated applications.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2 V ensures consistent and reliable operation of the DSP across different operating conditions.

No. of DMA Channels: 64

Supports a high number of DMA channels for efficient data transfer and management, improving system performance and responsiveness.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8 mm allows for high-density mounting and compact PCB designs, saving space and enabling miniaturization.

Format: FIXED POINT

Fixed-point format simplifies signal processing algorithms and reduces computational complexity, speeding up processing tasks and enhancing efficiency.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates the level of moisture sensitivity during storage and handling, ensuring proper precautions are taken to prevent moisture-related damage.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation and power management, reducing overall power consumption and extending battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6414EZLZ5E0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6414EZLZ5E0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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