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TMS32C6211BZFNA150

Texas Instruments

TMS32C6211BZFNA150 by Texas Instruments

TMS32C6211BZFNA150 by Texas Instruments is a 32-bit DSP with 22-bit address bus, 32-bit external data bus, and max clock frequency of 150 MHz. Ideal for industrial applications requiring fixed-point technology, it features low power mode and integrated cache for efficient processing in digital signal processing tasks.

Median Price

$43.254

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 200 parts In-Stock

1+ parts

$44.609

100+ parts

$39.652

1k+ parts

$29.156

10k+ parts

-

200

$44.609

$39.652

$29.156

-

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$41.900

1k+ parts

$37.490

10k+ parts

$35.290

1

-

$41.900

$37.490

$35.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,958 parts In-Stock

1+ parts

$38.466

100+ parts

-

1k+ parts

-

10k+ parts

-

4,958

$38.466

-

-

-

Vyrian

USA . 8,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,341

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$19.420

100+ parts

-

1k+ parts

-

10k+ parts

-

525

$19.420

-

-

-

Parana Technologies

USA . 1,099 parts In-Stock

1+ parts

$33.996

100+ parts

$3,157.065

1k+ parts

$30.597

10k+ parts

-

1,099

$33.996

$3,157.065

$30.597

-

Corphita

USA . 1,945 parts In-Stock

1+ parts

$36.441

100+ parts

-

1k+ parts

-

10k+ parts

-

1,945

$36.441

-

-

-

DigiPath Technology Company

USA . 834 parts In-Stock

1+ parts

$37.434

100+ parts

-

1k+ parts

-

10k+ parts

-

834

$37.434

-

-

-

ChromeModa Solutions

Germany . 6,017 parts In-Stock

1+ parts

$38.198

100+ parts

$31.322

1k+ parts

-

10k+ parts

-

6,017

$38.198

$31.322

-

-

IDEA Electronic Components Group

UK . 1,562 parts In-Stock

1+ parts

$38.198

100+ parts

$36.288

1k+ parts

$34.378

10k+ parts

-

1,562

$38.198

$36.288

$34.378

-

Corohmni

South Africa . 687 parts In-Stock

1+ parts

$72.327

100+ parts

-

1k+ parts

-

10k+ parts

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687

$72.327

-

-

-

Microchip USA

USA . 2,716 parts In-Stock

1+ parts

$108.370

100+ parts

$106.480

1k+ parts

$105.540

10k+ parts

$104.600

2,716

$108.370

$106.480

$105.540

$104.600

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

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Overview

Experience the power of cutting-edge technology with the TMS32C6211BZFNA150 by Texas Instruments, a leading manufacturer known for its high-quality digital signal processors. Ideal for a wide range of applications, this DSP offers integrated cache, multiple power supplies, and boundary scan capabilities. With a maximum clock frequency of 150 MHz and low power mode, this product provides unmatched performance and efficiency. Trust Texas Instruments to deliver superior products that exceed expectations and unlock endless possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy body material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Integrated cache helps in faster data access and processing, improving overall performance.

Maximum Supply Voltage: 1.89 V

Operating at a maximum supply voltage of 1.89V ensures efficient power consumption.

Address Bus Width: 22

With a wide address bus width of 22, the processor can handle large amounts of memory efficiently.

Package Shape: SQUARE

Square-shaped package allows for efficient space utilization on circuit boards.

Bit Size: 32

32-bit architecture enables fast and efficient processing of data in real-time applications.

Power Supplies (V): 1.8,3.3

Supporting multiple power supplies at 1.8V and 3.3V allows for flexibility in different operating environments.

No. of Terminals: 256

Having 256 terminals provides ample connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY

Grid array package style ensures secure connections and easy mounting on PCBs.

Minimum Supply Voltage: 1.71 V

Operating at a minimum supply voltage of 1.71V ensures reliable performance even in low power conditions.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature of 105°C allows for use in industrial applications without overheating.

No. of External Interrupts: 4

Supporting 4 external interrupts allows for efficient handling of external events and real-time responsiveness.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the processor can function in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish ensures reliable electrical connections and long-term durability.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation process and makes it compatible with different mounting configurations.

Maximum Seated Height: 2.32 mm

A low maximum seated height of 2.32mm allows for slim and compact device designs.

Width: 27 mm

A width of 27mm provides a balance between compact size and sufficient space for components.

Boundary Scan: YES

Boundary scan feature helps in testing and diagnosing the processor's functionality during manufacturing and maintenance.

External Data Bus Width: 32

A wide external data bus width of 32 enables rapid data transfer between the processor and external memory devices.

Maximum Clock Frequency: 150 MHz

Operating at a maximum clock frequency of 150MHz ensures high-speed performance for demanding processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

With a peak reflow temperature time of 30 seconds, the processor can undergo reflow soldering quickly and efficiently during manufacturing.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and component integrity during the manufacturing process.

Internal Bus Architecture: MULTIPLE

Using multiple internal bus architecture enhances data flow efficiency and reduces processing bottlenecks.

Length: 27 mm

A length of 27mm provides a well-balanced form factor for easy integration into diverse electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes the processor suitable for harsh operating environments and extended use.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports multiple peripheral IC types catering to a wide range of signal processing applications.

No. of Timers: 2

Having 2 timers facilitates accurate timekeeping and event scheduling in various real-time applications.

Technology: CMOS

CMOS technology ensures low power consumption and high reliability for long-term operation.

Terminal Form: BALL

Ball terminal form simplifies the installation process and facilitates secure soldering on PCBs.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V ensures optimal performance and power efficiency.

No. of DMA Channels: 16

Supporting 16 DMA channels enables efficient data transfer and processing without CPU intervention.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27mm allows for compact layout designs and efficient use of PCB space.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and reduces processing overhead for faster performance.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level of 4 ensures proper handling and storage to prevent damage during reflow soldering.

Low Power Mode: YES

Low power mode feature helps in minimizing power consumption during idle or low activity periods, enhancing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6211BZFNA150 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

256

No. of Timers:

2

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.32 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS32C6211BZFNA150 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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