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TMS32C6202BGNZA250

Texas Instruments

TMS32C6202BGNZA250 by Texas Instruments

TMS32C6202BGNZA250 by Texas Instruments is a 32-bit DSP with integrated cache, 250 MHz clock frequency, and 32768 RAM words. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include 22-bit address bus width, 1.5-3.3V power supplies, and boundary scan capability for efficient testing.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 4,534 parts In-Stock

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Digiode

USA . 2,487 parts In-Stock

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2,487

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One Stop Electronics

USA . 978 parts In-Stock

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$1.000

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978

$1.000

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AZTECH Wire

Italy . 339 parts In-Stock

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$17.647

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339

$17.647

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Parana Technologies

USA . 661 parts In-Stock

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$51.862

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$4,816.181

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$46.676

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661

$51.862

$4,816.181

$46.676

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DigiPath Technology Company

USA . 45 parts In-Stock

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$57.107

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45

$57.107

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ChromeModa Solutions

Germany . 3,566 parts In-Stock

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$58.272

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$47.783

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$58.272

$47.783

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IDEA Electronic Components Group

UK . 863 parts In-Stock

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$58.272

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$55.358

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$52.445

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863

$58.272

$55.358

$52.445

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Corohmni

South Africa . 5,132 parts In-Stock

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$116.012

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Microchip USA

USA . 2,090 parts In-Stock

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$152.270

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$148.210

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$146.180

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$144.140

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$152.270

$148.210

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$144.140

Kepictronics

USA . 6,000 parts In-Stock

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Corphita

USA . 3,940 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,775 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS32C6202BGNZA250 by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-quality products like this Digital Signal Processor, perfect for applications requiring high-speed processing and precision. With integrated cache and low power mode, this DSP offers unmatched performance and efficiency. Whether you're in industrial automation or telecommunications, this versatile processor will elevate your projects to new heights. Trust Texas Instruments to deliver excellence, value, and innovation with every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the DSP, making it suitable for various environments.

Integrated Cache: YES

Integrated cache improves the performance of the DSP by reducing access time to frequently used instructions and data.

Maximum Supply Voltage: 1.57 V

High maximum supply voltage allows for flexibility in power supply options and operation.

On Chip Data RAM Width: 8

Wider on-chip data RAM width allows for faster data processing and manipulation.

Address Bus Width: 22

The wide address bus width allows for a larger address space, enabling the processor to access more memory locations.

Package Shape: SQUARE

Square package shape makes it easier to mount and align the DSP on circuit boards, improving assembly efficiency.

Bit Size: 32

32-bit processing capability enables the DSP to handle complex mathematical calculations and algorithms efficiently.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages gives flexibility in designing power management systems for the DSP.

No. of Terminals: 352

High number of terminals allows for connectivity to external components and interfaces, expanding the DSP's functionality.

Package Style (Meter): GRID ARRAY

Grid array package style provides a reliable and secure connection between the DSP and the circuit board, reducing the risk of solder joint failure.

Minimum Supply Voltage: 1.43 V

Low minimum supply voltage ensures compatibility with a wide range of power sources, making the DSP versatile in different applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows the DSP to perform reliably in harsh environmental conditions.

No. of External Interrupts: 4

Multiple external interrupts provide the DSP with the ability to respond to external events quickly, enhancing real-time processing capabilities.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the DSP can operate in cold environments without performance degradation.

Terminal Finish: TIN LEAD

Tin lead terminal finish enhances solderability and conductivity, improving the overall reliability of the DSP connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting of the DSP on circuit boards and simplifies the layout of components.

Maximum Seated Height: 2.8 mm

Low maximum seated height allows for compact device designs and minimizes the space required for integrating the DSP.

RAM Words: 32768

Large RAM capacity enables the DSP to store and access a significant amount of data, supporting complex processing tasks.

Width: 27 mm

Compact width dimension makes the DSP suitable for space-constrained applications and integration into smaller devices.

Boundary Scan: YES

Boundary scan capability simplifies the testing and debugging of the DSP during production and maintenance processes.

External Data Bus Width: 32

Wide external data bus width enables high-speed data transfers between the DSP and external devices, enhancing overall system performance.

Maximum Clock Frequency: 250 MHz

High maximum clock frequency allows the DSP to execute instructions quickly and efficiently, leading to improved processing speed.

Maximum Time At Peak Reflow Temperature (s): 20

Sufficient time at peak reflow temperature ensures proper solder melting and component mounting during the assembly process.

Peak Reflow Temperature °C: 220

High peak reflow temperature ensures proper solder reflow and strong mechanical bonds between the DSP and the circuit board.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and enables parallel processing, improving overall system performance.

Length: 27 mm

Compact length dimension makes the DSP suitable for space-constrained applications and integration into smaller devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation of the DSP in rugged industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows the DSP to interface with a wide range of external devices and systems, increasing its applicability.

No. of Timers: 2

Multiple timers provide timing and scheduling capabilities to the DSP, enabling precise control of timing-critical operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form simplifies the mounting and connection of the DSP to the circuit board, ensuring secure and reliable electrical connections.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the DSP within its specified voltage range.

No. of DMA Channels: 4

Multiple DMA channels facilitate efficient data transfers between memory and peripherals, reducing CPU overhead and improving system performance.

ROM Programmability: MROM

Mask ROM programmability enhances data security and reliability by preventing accidental or unauthorized modifications to the program code.

Terminal Pitch: 1 mm

Narrow terminal pitch enables high-density mounting of the DSP on circuit boards, conserving space and improving design flexibility.

Format: FIXED POINT

Fixed-point format accelerates mathematical calculations and simplifies programming, making the DSP suitable for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 indicates that the DSP can withstand exposure to moderate moisture levels during storage and handling.

Low Power Mode: YES

Low power mode enables energy-efficient operation and reduces power consumption during idle or low activity periods, extending battery life.

On Chip Program ROM Width: 8

Wider on-chip program ROM width allows for efficient storage and retrieval of program instructions, enhancing the DSP's processing capabilities.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6202BGNZA250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

250 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

352

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS32C6202BGNZA250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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