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TMS320VC5509AGBBR

Texas Instruments

TMS320VC5509AGBBR by Texas Instruments

TMS320VC5509AGBBR by Texas Instruments is a DSP with 128K RAM, 16-bit data bus, and 20 MHz clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point processing capabilities. Operates in temperature range of -40 to 85°C with boundary scan feature for testing.

Median Price

$15.984

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,715 parts In-Stock

1+ parts

$15.984

100+ parts

$13.962

1k+ parts

$9.629

10k+ parts

-

3,715

$15.984

$13.962

$9.629

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 311 parts In-Stock

1+ parts

$15.185

100+ parts

-

1k+ parts

-

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-

311

$15.185

-

-

-

Vyrian

USA . 3,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,257

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 962 parts In-Stock

1+ parts

$8.340

100+ parts

-

1k+ parts

-

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962

$8.340

-

-

-

Corphita

USA . 67 parts In-Stock

1+ parts

$14.386

100+ parts

-

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-

10k+ parts

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67

$14.386

-

-

-

Microchip USA

USA . 1,154 parts In-Stock

1+ parts

$36.220

100+ parts

$35.700

1k+ parts

$35.440

10k+ parts

$35.180

1,154

$36.220

$35.700

$35.440

$35.180

Parana Technologies

USA . 2,333 parts In-Stock

1+ parts

$45.655

100+ parts

-

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-

10k+ parts

-

2,333

$45.655

-

-

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DigiPath Technology Company

USA . 570 parts In-Stock

1+ parts

$50.272

100+ parts

-

1k+ parts

-

10k+ parts

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570

$50.272

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-

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ChromeModa Solutions

Germany . 5,902 parts In-Stock

1+ parts

$51.298

100+ parts

$42.064

1k+ parts

-

10k+ parts

-

5,902

$51.298

$42.064

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-

IDEA Electronic Components Group

UK . 688 parts In-Stock

1+ parts

$51.298

100+ parts

$48.733

1k+ parts

$46.168

10k+ parts

-

688

$51.298

$48.733

$46.168

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Corohmni

South Africa . 764 parts In-Stock

1+ parts

$60.008

100+ parts

-

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764

$60.008

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Overview

Experience the power of Texas Instruments with the TMS320VC5509AGBBR Digital Signal Processor. Designed for high-quality performance, this DSP offers unparalleled value and benefits to customers in various applications. With a maximum clock frequency of 20 MHz and a low power mode, this innovative product delivers exceptional results while maintaining efficiency. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and facilitating automated assembly.

Maximum Supply Voltage: 1.65 V

Ensures safe operation within specified voltage limits.

On Chip Data RAM Width: 16

Offers sufficient on-chip memory for data processing tasks.

Address Bus Width: 21

Enables efficient memory addressing for faster data access.

Package Shape: RECTANGULAR

Facilitates easy mounting and placement within electronic devices.

No. of Terminals: 179

Provides ample connectivity options for interfacing with external components.

Minimum Supply Voltage: 1.55 V

Allows for operation at lower power levels, conserving energy.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Indicates specialized functionality for signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5509AGBBR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

21

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PBGA-B179

JESD-609 Code:

e0

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

179

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA179(UNSPEC)

Package Shape:

Peak Reflow Temperature (C):

220

RAM Words:

128K

ROM Programmability:

FLASH

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Peripheral IC Type:

Trade Compliance

TMS320VC5509AGBBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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