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TMS320VC5471GHKA

Texas Instruments

TMS320VC5471GHKA by Texas Instruments

TMS320VC5471GHKA by Texas Instruments is a 16-bit DSP with 32-bit external data bus, operating at max 100 MHz. Ideal for industrial applications, it features low power mode, 16384 RAM words, and operates b/w -40 to 85 °C.

Median Price

$21.140

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,498 parts In-Stock

1+ parts

$21.140

100+ parts

$20.720

1k+ parts

$20.290

10k+ parts

-

20,498

$21.140

$20.720

$20.290

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,541 parts In-Stock

1+ parts

$20.083

100+ parts

-

1k+ parts

-

10k+ parts

-

2,541

$20.083

-

-

-

Vyrian

USA . 2,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,224

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$9.180

100+ parts

-

1k+ parts

-

10k+ parts

-

226

$9.180

-

-

-

Ampacity Inc.

Singapore . 20,171 parts In-Stock

1+ parts

$17.970

100+ parts

-

1k+ parts

-

10k+ parts

-

20,171

$17.970

-

-

-

Corphita

USA . 1,534 parts In-Stock

1+ parts

$19.026

100+ parts

-

1k+ parts

-

10k+ parts

-

1,534

$19.026

-

-

-

Parana Technologies

USA . 1,431 parts In-Stock

1+ parts

$73.006

100+ parts

$6,779.697

1k+ parts

$65.705

10k+ parts

-

1,431

$73.006

$6,779.697

$65.705

-

DigiPath Technology Company

USA . 1,594 parts In-Stock

1+ parts

$80.388

100+ parts

-

1k+ parts

-

10k+ parts

-

1,594

$80.388

-

-

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

1+ parts

$82.029

100+ parts

$77.928

1k+ parts

$73.826

10k+ parts

-

1,962

$82.029

$77.928

$73.826

-

ChromeModa Solutions

Germany . 260 parts In-Stock

1+ parts

$82.029

100+ parts

$67.264

1k+ parts

-

10k+ parts

-

260

$82.029

$67.264

-

-

Corohmni

South Africa . 2,708 parts In-Stock

1+ parts

$83.341

100+ parts

-

1k+ parts

-

10k+ parts

-

2,708

$83.341

-

-

-

Microchip USA

USA . 161 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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161

-

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Overview

Experience unparalleled performance and efficiency with the TMS320VC5471GHKA by Texas Instruments, a leading manufacturer in the industry. This digital signal processor (DSP) offers cutting-edge technology that opens up endless possibilities for applications in various fields. From advanced audio processing to telecommunications, this product delivers exceptional value and benefits to customers seeking top-notch quality and reliability. Elevate your projects to new heights with the TMS320VC5471GHKA and unlock a world of opportunities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.95 V

With a maximum supply voltage of 1.95V, this DSP is energy efficient and can operate within a low power consumption range.

Address Bus Width: 23

A wider address bus width allows for efficient memory addressing capabilities, enhancing overall processing performance.

Package Shape: SQUARE

The square shape of the package offers a compact design, saving space on the PCB and making it suitable for small form factor devices.

Bit Size: 16

The 16-bit architecture provides a good balance between processing power and efficiency for handling various digital signal processing tasks.

Power Supplies (V): 1.8,3.3

Supporting multiple power supply voltages allows for flexibility in different operating environments and power requirements.

No. of Terminals: 257

Having a high number of terminals enables connectivity with a wide range of external components, expanding the versatility of the DSP.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style with grid array, low profile, and fine pitch design enhances signal integrity, thermal performance, and PCB layout density.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures operational stability even in low power scenarios, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature makes the DSP reliable in both extreme cold and hot environments.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish provides good solderability and reliability in the assembly process.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and enables easier heat dissipation, improving overall performance.

Maximum Seated Height: 1.4 mm

The low seated height allows for a compact design, suitable for applications where space constraints are crucial.

RAM Words: 16384

Having a large RAM capacity of 16384 words enables efficient data storage and processing for complex algorithms and applications.

Width: 16 mm

The compact width of 16mm enhances the overall form factor of the DSP, making it suitable for space-constrained designs.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, improving overall reliability and manufacturability.

External Data Bus Width: 32

A wider external data bus width of 32 bits enables faster data transfer rates and enhanced processing capabilities.

Maximum Clock Frequency: 100 MHz

Supporting a maximum clock frequency of 100MHz, the DSP can handle real-time processing tasks with high speed and accuracy.

Maximum Time At Peak Reflow Temperature (s): 20

The short duration of 20 seconds at peak reflow temperature ensures reliable soldering during assembly processes.

Peak Reflow Temperature °C: 220

The high peak reflow temperature of 220°C ensures proper solder melting and joint formation for robust connections.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and enables parallel processing capabilities for efficient signal processing.

Length: 16 mm

The compact length of 16mm complements the width and height, providing a well-balanced form factor for various applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the DSP can operate reliably in harsh temperature and environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type provides a versatile solution for handling multiple signal processing tasks and interfacing with various peripherals.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed operation, and compatibility with a wide range of digital systems.

Terminal Form: BALL

The ball terminal form simplifies soldering and facilitates better electrical connections, ensuring reliable performance.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V provides stable operation and energy efficiency for a wide range of applications.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the DSP offers high-density packaging and efficient routing of signals on the PCB.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and improves processing efficiency for a variety of signal processing algorithms.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the level of protection against moisture during storage and handling, ensuring long-term reliability.

Low Power Mode: YES

The low power mode feature enables the DSP to operate in a power-efficient state, extending battery life and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5471GHKA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B257

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

257

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5471GHKA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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