Loading...

TMS320VC5441GGURZE

Texas Instruments

TMS320VC5441GGURZE by Texas Instruments

TMS320VC5441GGURZE by Texas Instruments is a 16-bit DSP with 133 MHz clock frequency, 65536 RAM words, and 19-bit address bus width. Ideal for digital signal processing applications requiring low power mode, it features a grid array package style and operates b/w -40 to +85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,981

-

-

-

-

Digiode

USA . 4,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,366

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 927 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

927

$5.000

-

-

-

AZTECH Wire

Italy . 813 parts In-Stock

1+ parts

$15.141

100+ parts

-

1k+ parts

-

10k+ parts

-

813

$15.141

-

-

-

Parana Technologies

USA . 1,840 parts In-Stock

1+ parts

$16.400

100+ parts

-

1k+ parts

$16.696

10k+ parts

-

1,840

$16.400

-

$16.696

-

DigiPath Technology Company

USA . 1,641 parts In-Stock

1+ parts

$18.058

100+ parts

-

1k+ parts

-

10k+ parts

-

1,641

$18.058

-

-

-

ChromeModa Solutions

Germany . 3,337 parts In-Stock

1+ parts

$18.427

100+ parts

$15.110

1k+ parts

-

10k+ parts

-

3,337

$18.427

$15.110

-

-

IDEA Electronic Components Group

UK . 787 parts In-Stock

1+ parts

$18.427

100+ parts

$17.506

1k+ parts

$16.584

10k+ parts

-

787

$18.427

$17.506

$16.584

-

Corohmni

South Africa . 492 parts In-Stock

1+ parts

$43.664

100+ parts

-

1k+ parts

-

10k+ parts

-

492

$43.664

-

-

-

Component Stockers USA

USA . 435 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

435

$99.990

-

-

-

Corphita

USA . 1,118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,118

-

-

-

-

Microchip USA

USA . 362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

362

-

-

-

-

Overview

Experience unparalleled performance and efficiency with the TMS320VC5441GGURZE by Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line Digital Signal Processor, this product offers cutting-edge technology and reliability for a wide range of applications. From audio processing to telecommunications, this DSP provides unmatched value, benefits, and advantages to customers looking for high-quality solutions. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body helps in reducing the overall weight of the product, making it easier to handle and transport.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and enabling efficient layout designs.

Maximum Supply Voltage: 1.65 V

The low maximum supply voltage helps in minimizing power consumption and heat generation, making the product energy-efficient.

Address Bus Width: 19

Having a wider address bus width enables the processor to access a larger memory space efficiently, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape offers a compact form factor, allowing for efficient use of space on the PCB while ensuring good thermal characteristics.

Bit Size: 16

The 16-bit architecture provides a good balance between processing power and efficiency, suitable for various signal processing tasks.

Power Supplies (V): 1.6,3.3

Having multiple power supply options allows for flexibility in design and compatibility with different systems.

No. of Terminals: 169

The high number of terminals enables seamless connections with other components, promoting reliable performance and signal integrity.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density integration, minimizing signal delays and improving overall performance.

Minimum Supply Voltage: 1.55 V

The low minimum supply voltage ensures stable operation even under low power conditions, extending the product's reliability and lifespan.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions, ensuring consistent performance in various applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the processor to function effectively in cold environments, expanding its usability across different settings.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and durability, facilitating easy assembly and ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and routing, optimizing signal paths and reducing electromagnetic interference.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for a slimmer profile and better airflow in the system, improving thermal management and overall performance.

RAM Words: 65536

With a large RAM capacity of 65536 words, the processor can efficiently store and access data, enhancing its processing speed and capabilities.

Width: 12 mm

The compact 12mm width enables easy integration into space-constrained designs, offering flexibility in system architecture and layout.

Boundary Scan: YES

Having boundary scan capability allows for easy debugging and testing of the processor, ensuring quick identification and resolution of potential issues.

External Data Bus Width: 16

The 16-bit external data bus width facilitates high-speed data transfer between the processor and external components, improving overall system efficiency.

Maximum Clock Frequency: 133 MHz

The high maximum clock frequency of 133 MHz enables fast data processing and real-time signal handling, suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 20

The short time duration of 20 seconds at peak reflow temperature ensures quick and efficient soldering during assembly, reducing manufacturing time and costs.

Peak Reflow Temperature °C: 220

The high peak reflow temperature of 220°C enables reliable and robust solder joints, enhancing the durability and performance of the product.

Internal Bus Architecture: MULTIPLE

Employing multiple internal bus architectures enhances data flow efficiency within the processor, maximizing performance and accelerating signal processing tasks.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral IC types enhances the product's versatility and suitability for a wide range of signal processing applications.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of system designs, making the product energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and simplifies the soldering process, ensuring robust and stable performance in various operating conditions.

Nominal Supply Voltage: 1.6 V

The nominal supply voltage of 1.6 V offers a balance between energy efficiency and performance, ensuring reliable operation with optimized power consumption.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting and efficient signal routing, contributing to compact system designs and improved signal integrity.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and reduces complexity in algorithm implementation, enhancing computational efficiency and real-time processing capabilities.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage practices to maintain product integrity and reliability.

Low Power Mode: YES

The low power mode option allows for power-efficient operation, extending battery life and reducing energy consumption in portable and battery-powered devices.

Barrel Shifter: YES

The inclusion of a barrel shifter enhances computational efficiency by enabling fast shifts and rotations, facilitating complex signal processing operations with improved speed and accuracy.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5441GGURZE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

19

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

133 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5441GGURZE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20