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TMS320VC5409PGE100

Texas Instruments

TMS320VC5409PGE100 by Texas Instruments

TMS320VC5409PGE100 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20MHz clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point format processing. Features include 32768 RAM words, boundary scan support, and nickel palladium gold terminal finish.

Median Price

$49.979

Lifecycle Status

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American Microsemiconductor Inc.

USA . 28 parts In-Stock

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Right Parts Inc.

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Speed Components Ltd

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Semtec, LLC

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AZTECH Wire

Italy . 696 parts In-Stock

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One Stop Electronics

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Parana Technologies

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ChromeModa Solutions

Germany . 4,712 parts In-Stock

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IDEA Electronic Components Group

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Corohmni

South Africa . 514 parts In-Stock

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Component Stockers USA

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Overview

Experience unparalleled performance and efficiency with the TMS320VC5409PGE100 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge Digital Signal Processors (DSPs) known for their reliability and innovation. Ideal for a wide range of applications, this product offers customers exceptional value, benefits, and advantages. Whether you're looking to enhance audio quality, improve image processing, or optimize data transmission, the TMS320VC5409PGE100 is the perfect solution for all your DSP needs. Unlock new possibilities and elevate your projects with this advanced technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic packaging as it provides good protection and insulation for the components inside.

Surface Mount: YES

Surface mounting allows for easy assembly onto the PCB, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.98 V

This ensures that the DSP operates within a safe voltage range, preventing damage to the device.

Address Bus Width: 23

Having a wide address bus allows for faster processing of data and more efficient memory access.

Bit Size: 16

A 16-bit processor can handle larger chunks of data at once, increasing processing speed and efficiency.

Power Supplies (V): 1.8,3.3

The availability of multiple power supply options gives flexibility in designing systems with different power requirements.

No. of Terminals: 144

Having a high number of terminals enables connectivity to multiple external devices, expanding the DSP's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles provide versatility in mounting options, suitable for compact and advanced electronic designs.

Minimum Supply Voltage: 1.71 V

Ensuring a low minimum supply voltage allows for energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 100 °C

With a high operating temperature range, the DSP can withstand harsh environmental conditions and maintain performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this DSP suitable for a wide range of applications, including industrial and automotive.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: QUAD

Quad terminal positioning allows for efficient heat dissipation and improved signal integrity in high-speed applications.

Maximum Seated Height: 1.6 mm

The low profile design of the DSP makes it suitable for space-constrained applications, such as mobile devices and wearables.

RAM Words: 32768

With a large RAM capacity, the DSP can efficiently store and manipulate data during processing, enhancing performance.

Width: 20 mm

Compact width dimension allows for easy integration into various PCB layouts, optimizing space utilization.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during production, ensuring quality and reliability.

External Data Bus Width: 16

A wide external data bus allows for fast data transfer between the DSP and other peripherals, enhancing overall system performance.

Maximum Clock Frequency: 20 MHz

The high clock frequency enables fast data processing and real-time operations, making this DSP suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specifies the maximum reflow time, ensuring proper soldering of the DSP during assembly for reliable connections.

Peak Reflow Temperature °C: 260

The high reflow temperature tolerance allows for lead-free soldering processes, meeting industry standards and regulations.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and parallel processing capabilities, improving overall system performance.

Length: 20 mm

Compact length dimension allows for flexible placement on the PCB and easy integration into various electronic designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments with temperature fluctuations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enables seamless integration with a wide range of devices and systems, enhancing compatibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this DSP energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides easy soldering and robust mechanical connection, ensuring secure and stable mounting on the PCB.

Nominal Supply Voltage: 1.8 V

Having a stable nominal supply voltage ensures consistent and reliable operation of the DSP in various applications.

Terminal Pitch: 0.5 mm

The tight terminal pitch allows for high-density mounting, reducing PCB footprint and enabling compact electronic designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves computational efficiency, making this DSP ideal for real-time signal processing.

Low Power Mode: YES

Low power mode feature allows for energy-saving operation in battery-powered devices, extending runtime and enhancing efficiency.

Barrel Shifter: YES

The barrel shifter enables efficient shifting and rotation of data bits, improving computational speed and versatility in data processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5409PGE100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5409PGE100 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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