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TMS320VC5409PGE-80

Texas Instruments

TMS320VC5409PGE-80 by Texas Instruments

TMS320VC5409PGE-80 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and 32768 RAM words.

Median Price

$20.980

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

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$20.980

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$18.770

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$17.660

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$18.770

$17.660

Distributors (In-Stock)

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Digiode

USA . 3,746 parts In-Stock

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Vyrian

USA . 2,307 parts In-Stock

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Bristol Electronics

USA . 49 parts In-Stock

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Atlantic Semiconductor

USA . 49 parts In-Stock

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Sensible Micro Corp

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 843 parts In-Stock

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$14.200

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$14.200

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Corphita

USA . 4,143 parts In-Stock

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$20.970

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$24.603

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$22.389

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$20.174

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$20.174

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Corohmni

South Africa . 863 parts In-Stock

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$30.854

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Parana Technologies

USA . 1,499 parts In-Stock

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$36.106

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ChromeModa Solutions

Germany . 4,537 parts In-Stock

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$40.569

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$33.267

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IDEA Electronic Components Group

UK . 1,035 parts In-Stock

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$40.569

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$38.541

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$36.512

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QUARKTWIN TECHNOLOGY LTD

USA . 21,594 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 2,200 parts In-Stock

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Metaverse IC Inc.

Canada . 252 parts In-Stock

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ChipstoGo Electronic ltd

UK . 26 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320VC5409PGE-80 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality digital signal processors that are essential for a wide range of applications. Whether you are working on audio processing, telecommunications, or industrial automation, this DSP offers unmatched value and performance. Trust in the reliability and innovation of Texas Instruments to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing overall product size.

Maximum Supply Voltage: 1.98 V

Operating within a lower maximum supply voltage helps in reducing power consumption and heat generation, making the product more energy-efficient.

Address Bus Width: 23

A wider address bus width allows for more memory access and faster processing of data, improving overall performance.

Package Shape: SQUARE

A square package shape helps in maximizing space utilization on circuit boards, making it easier to integrate into compact devices.

Bit Size: 16

With a 16-bit architecture, the product can handle complex data processing tasks efficiently and effectively.

Power Supplies (V): 1.8,3.3

Supporting multiple power supply voltages allows for greater flexibility in system design and compatibility with different components.

No. of Terminals: 144

Having a higher number of terminals enables more connectivity options and integration with other electronic components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options provide versatility in installation and compatibility with various circuit board designs.

Minimum Supply Voltage: 1.71 V

With a lower minimum supply voltage, the product can operate efficiently even under low-power conditions.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended use.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, ensuring reliability and performance in a wide range of conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the product's durability and longevity.

Terminal Position: QUAD

Quad terminal position allows for secure connections and efficient signal transmission, ensuring reliability in data processing.

Maximum Seated Height: 1.6 mm

With a low seated height, the product can fit into slim devices and compact spaces without sacrificing performance or functionality.

RAM Words: 32768

Ample RAM capacity of 32768 words enables efficient data storage and processing, improving overall system performance.

Width: 20 mm

Compact width size makes the product suitable for integration into small or space-constrained electronic devices.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the product during manufacturing and operation, ensuring high reliability and quality control.

External Data Bus Width: 16

A wide external data bus width of 16 bits enables high-speed data transfer and processing, improving system performance and responsiveness.

Maximum Clock Frequency: 20 MHz

Supporting a high clock frequency of 20 MHz allows for faster data processing and real-time performance, making the product suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short peak reflow time, the product can undergo rapid and efficient soldering processes during manufacturing, reducing production time and cost.

Peak Reflow Temperature °C: 260

Capable of withstanding high temperatures during soldering processes, ensuring reliable and durable connection to circuit boards.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architectures enhances data flow and processing efficiency, resulting in improved system performance and speed.

Length: 20 mm

Compact length size makes the product suitable for integration into small or space-constrained electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable and reliable operation in harsh industrial environments, making the product suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Featuring digital signal processor and other peripheral IC types enhances the product's versatility and compatibility with various electronic applications and devices.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high-speed performance, making the product energy-efficient and reliable for extended use.

Terminal Form: GULL WING

Gull wing terminal form offers secure mounting and reliable connection to circuit boards, ensuring stable and efficient signal transmission.

Nominal Supply Voltage: 1.8 V

With a nominal supply voltage of 1.8V, the product maintains stable performance and efficiency during operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for precise and compact integration onto circuit boards, optimizing space utilization and connectivity.

Format: FIXED POINT

Utilizing fixed-point format enhances data accuracy and processing efficiency, ensuring reliable and precise results in mathematical computations and signal processing.

Low Power Mode: YES

Incorporating a low power mode option helps in reducing energy consumption and extending the product's battery life, making it suitable for portable and battery-operated devices.

Barrel Shifter: YES

Having a barrel shifter feature enables efficient and fast data manipulation, improving data processing speed and overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5409PGE-80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5409PGE-80 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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