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TMS320TCI6482BZTZ

Texas Instruments

TMS320TCI6482BZTZ by Texas Instruments

TMS320TCI6482BZTZ by Texas Instruments is a 32-bit DSP with 64-bit external data bus width, operating at max 66.6 MHz clock frequency. Ideal for digital signal processing applications, it features a low power mode and boundary scan capability. With a package style of grid array and fine pitch, this CMOS technology-based processor has 8192 RAM words and operates b/w 0-90°C temperature range.

Median Price

$34.130

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 53 parts In-Stock

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$34.130

100+ parts

$32.080

1k+ parts

$29.010

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53

$34.130

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DigiKey

USA . 53 parts In-Stock

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Digiode

USA . 1,513 parts In-Stock

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$32.424

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DigiKey Marketplace

USA . 53 parts In-Stock

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$33.800

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Vyrian

USA . 3,274 parts In-Stock

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Semi Source

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Cyclops Electronics Ltd

UK . 6 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 606 parts In-Stock

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$17.133

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Corphita

USA . 2,054 parts In-Stock

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$30.717

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Parana Technologies

USA . 1,584 parts In-Stock

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$33.479

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$126.151

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$33.479

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ChromeModa Solutions

Germany . 4,201 parts In-Stock

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$37.617

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$30.846

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IDEA Electronic Components Group

UK . 1,260 parts In-Stock

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$37.617

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$35.736

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$33.855

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$37.617

$35.736

$33.855

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Microchip USA

USA . 2,483 parts In-Stock

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$71.760

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$70.510

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$69.890

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$69.260

2,483

$71.760

$70.510

$69.890

$69.260

QUARKTWIN TECHNOLOGY LTD

USA . 29,831 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,061 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 928 parts In-Stock

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$33.915

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Metaverse IC Inc.

Canada . 600 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 90 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS320TCI6482BZTZ by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-quality products that are trusted by professionals worldwide. With applications ranging from telecommunications to audio processing, this DSP offers unparalleled performance and efficiency. Experience seamless operation and superior functionality with the TMS320TCI6482BZTZ, making it the perfect choice for all your digital processing needs. Elevate your projects with Texas Instruments' advanced technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology saves space on the circuit board and improves the overall reliability of the product.

Maximum Supply Voltage: 1.2875 V

Operating at a lower maximum supply voltage helps in reducing power consumption and heat generation, leading to energy efficiency.

Address Bus Width: 20

A wider address bus allows for efficient data transfer and processing, enhancing the performance of the product.

Package Shape: SQUARE

Square package shape is space-efficient and easy to mount on the circuit board, optimizing the use of available space.

Bit Size: 32

A higher bit size allows for processing and handling larger data chunks, enabling the product to handle complex tasks effectively.

Power Supplies (V): 1.25,1.5/1.8,1.8,3.3

Multiple power supply options provide flexibility in operating the product under different voltage requirements.

No. of Terminals: 697

Having a high number of terminals allows for a greater connection capacity and flexibility for interfacing with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package style ensure a reliable and secure connection with the circuit board, enhancing the product's durability.

Minimum Supply Voltage: 1.2125 V

Operating at a lower minimum supply voltage ensures stable performance and efficient power utilization for the product.

Maximum Operating Temperature: 90 °C

High maximum operating temperature tolerance allows the product to function in harsh environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures makes the product suitable for use in various industrial and commercial settings.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation and maintenance process of the product, making it user-friendly.

Maximum Seated Height: 3.242 mm

Low maximum seated height allows the product to be accommodated in tight spaces, enhancing its versatility in various applications.

RAM Words: 8192

Large RAM capacity enables the product to store and process a significant amount of data, improving its performance in multitasking scenarios.

Width: 24 mm

Compact width dimension makes the product suitable for integration into space-constrained devices or systems.

Boundary Scan: YES

Boundary scan feature allows for testing and diagnosing the integrity of the product's connections and components, ensuring reliability and ease of maintenance.

External Data Bus Width: 64

Wider external data bus width facilitates faster data transfer rates and enhanced processing capabilities of the product.

Maximum Clock Frequency: 66.6 MHz

High maximum clock frequency enables rapid data processing and quick response times, improving the overall performance of the product.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature minimizes the risk of component damage during the manufacturing process, ensuring product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows the product to withstand the reflow soldering process without degradation, ensuring proper assembly.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances data transfer efficiency and processing speed within the product, improving overall performance.

Length: 24 mm

Compact length dimension facilitates easy integration of the product into various equipment or systems without occupying excess space.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Advanced digital signal processor and other peripheral IC types provide specialized processing capabilities for handling complex signal processing tasks efficiently.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making the product energy-efficient and versatile.

Terminal Form: BALL

Ball terminal form allows for reliable connections and easy soldering of the product onto the circuit board, ensuring secure and stable operation.

Nominal Supply Voltage: 1.25 V

Maintaining a stable nominal supply voltage ensures consistent performance and reliable operation of the product under varying load conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density mounting of the product on the circuit board, optimizing space utilization and improving connectivity.

Format: FIXED POINT

Using fixed-point format simplifies data processing operations and enhances computational efficiency for performing arithmetic calculations accurately.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating ensures the product is less susceptible to moisture-related damage during storage, handling, and operation, enhancing its reliability.

Low Power Mode: YES

Availability of low power mode allows for energy-saving operation and extends the battery life of portable devices or systems using the product.

Technical Specifications

Digital Signal Processors (DSPs) TMS320TCI6482BZTZ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25,1.5/1.8,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2875 V

Minimum Supply Voltage:

1.2125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320TCI6482BZTZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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