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TMS320TCI6482BGTZA

Texas Instruments

TMS320TCI6482BGTZA by Texas Instruments

TMS320TCI6482BGTZA by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at max 66.6 MHz. Ideal for industrial applications, it features 8192 RAM words and operates b/w -40 to 105 °C, with low power mode available.

Median Price

$29.250

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$29.250

1k+ parts

$26.170

10k+ parts

$24.630

6

-

$29.250

$26.170

$24.630

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,653 parts In-Stock

1+ parts

$30.875

100+ parts

-

1k+ parts

-

10k+ parts

-

1,653

$30.875

-

-

-

Vyrian

USA . 2,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,885

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 921 parts In-Stock

1+ parts

$21.180

100+ parts

-

1k+ parts

-

10k+ parts

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921

$21.180

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-

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Corphita

USA . 1,498 parts In-Stock

1+ parts

$29.250

100+ parts

-

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1,498

$29.250

-

-

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Corohmni

South Africa . 1,196 parts In-Stock

1+ parts

$37.426

100+ parts

-

1k+ parts

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1,196

$37.426

-

-

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Parana Technologies

USA . 2,268 parts In-Stock

1+ parts

$39.234

100+ parts

-

1k+ parts

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2,268

$39.234

-

-

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ChromeModa Solutions

Germany . 1,071 parts In-Stock

1+ parts

$44.083

100+ parts

$36.148

1k+ parts

-

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1,071

$44.083

$36.148

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IDEA Electronic Components Group

UK . 921 parts In-Stock

1+ parts

$44.083

100+ parts

$41.879

1k+ parts

$39.675

10k+ parts

-

921

$44.083

$41.879

$39.675

-

Microchip USA

USA . 1,906 parts In-Stock

1+ parts

$71.760

100+ parts

$70.510

1k+ parts

$69.890

10k+ parts

$69.260

1,906

$71.760

$70.510

$69.890

$69.260

QUARKTWIN TECHNOLOGY LTD

USA . 22,752 parts In-Stock

1+ parts

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22,752

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DigiPath Technology Company

USA . 584 parts In-Stock

1+ parts

-

100+ parts

$39.745

1k+ parts

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10k+ parts

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584

-

$39.745

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Overview

Discover the unparalleled performance and reliability of the TMS320TCI6482BGTZA by Texas Instruments, a leading manufacturer in the industry. Ideal for a wide range of applications in digital signal processing, this powerful DSP offers exceptional value and benefits to customers. With advanced technology and high-quality construction, this product ensures efficient operation and seamless integration into your projects. Experience the advantages of Texas Instruments' expertise and innovation with the TMS320TCI6482BGTZA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good durability and protection for the digital signal processor.

Surface Mount: YES

Being surface mountable makes the DSP easy to integrate into various electronic devices and PCBs.

Maximum Supply Voltage: 1.2875 V

The maximum supply voltage of 1.2875 V ensures safe and efficient operation of the DSP.

Address Bus Width: 20

A wider address bus width of 20 allows for efficient data processing and communication within the DSP.

Package Shape: SQUARE

The square package shape helps in easy placement and alignment of the DSP on the circuit board.

Bit Size: 32

With a bit size of 32, this DSP can handle complex digital signal processing tasks effectively.

Power Supplies (V): 1.25,1.5/1.8,1.8,3.3

The availability of multiple power supply voltages ensures compatibility with a wide range of electronic systems.

No. of Terminals: 697

The high number of terminals allows for efficient connectivity and data transfer capabilities.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style provides compactness and high-density integration for space-constrained applications.

Minimum Supply Voltage: 1.2125 V

The minimum supply voltage of 1.2125 V ensures stable operation and power efficiency for the DSP.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this DSP can withstand higher temperature environments and maintain performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this DSP suitable for a wide range of industrial applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliable connections for the DSP.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy mounting and soldering of the DSP onto the PCB.

Maximum Seated Height: 3.242 mm

The maximum seated height of 3.242 mm allows for low-profile and space-saving designs when integrating the DSP.

RAM Words: 8192

With 8192 RAM words, this DSP has sufficient memory capacity for storing and processing data efficiently.

Width: 24 mm

The compact width of 24 mm enables easy placement and integration of the DSP in various electronic devices.

Boundary Scan: YES

The boundary scan feature allows for testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 64

A wide external data bus width of 64 ensures high-speed data transfer and processing capabilities for the DSP.

Maximum Clock Frequency: 66.6 MHz

With a maximum clock frequency of 66.6 MHz, this DSP can handle real-time processing of digital signals with high precision.

Maximum Time At Peak Reflow Temperature (s): 20

The DSP can withstand peak reflow temperatures for up to 20 seconds, ensuring reliable soldering and assembly processes.

Peak Reflow Temperature °C: 220

The peak reflow temperature of 220°C allows for efficient soldering of the DSP onto the PCB during production.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and communication within the DSP for faster processing speeds.

Length: 24 mm

The length of 24 mm provides a compact form factor for the DSP, making it suitable for small and portable electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation of the DSP in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor, combined with other functionalities, offers versatile and comprehensive signal processing capabilities.

Technology: CMOS

The CMOS technology used in this DSP provides low power consumption and high noise immunity for efficient signal processing.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and reliable connections for the DSP on the PCB.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage of 1.25 V ensures stable and efficient operation of the DSP in various electronic systems.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting and space-efficient design of the DSP on the PCB.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and enhances computational efficiency in signal processing tasks.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that this DSP is suitable for reflow soldering processes and has moderate moisture sensitivity.

Low Power Mode: YES

The low power mode feature helps in optimizing power consumption and extending the battery life of electronic devices using this DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320TCI6482BGTZA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e0

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.25,1.5/1.8,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2875 V

Minimum Supply Voltage:

1.2125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320TCI6482BGTZA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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