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TMS320TCI6482BGTZ

Texas Instruments

TMS320TCI6482BGTZ by Texas Instruments

TMS320TCI6482BGTZ by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at 66.6 MHz. It features 8192 RAM words and operates b/w -40 to +90°C. Ideal for digital signal processing applications requiring high-speed performance in a compact form factor.

Median Price

$77.171

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

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$77.171

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Vyrian

USA . 5,187 parts In-Stock

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Digiode

USA . 2,065 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 267 parts In-Stock

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$17.456

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Corohmni

South Africa . 1,035 parts In-Stock

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$25.019

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One Stop Electronics

USA . 1,347 parts In-Stock

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Parana Technologies

USA . 156 parts In-Stock

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ChromeModa Solutions

Germany . 1,910 parts In-Stock

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$50.756

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$41.620

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IDEA Electronic Components Group

UK . 831 parts In-Stock

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$50.756

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$48.218

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$45.680

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831

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Corphita

USA . 4,202 parts In-Stock

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DigiPath Technology Company

USA . 2,152 parts In-Stock

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Microchip USA

USA . 1,372 parts In-Stock

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Metaverse IC Inc.

Canada . 268 parts In-Stock

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Overview

Unlock the power of advanced digital signal processing with the TMS320TCI6482BGTZ by Texas Instruments. This cutting-edge DSP offers unparalleled performance and reliability, thanks to the unmatched quality of its manufacturer. Ideal for a wide range of applications, this product delivers superior value and benefits to customers seeking top-tier signal processing solutions. Experience the advantage of Texas Instruments technology with the TMS320TCI6482BGTZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount compatibility allows for easy and efficient assembly on circuit boards.

Maximum Supply Voltage: 1.2875 V

Higher maximum supply voltage allows for increased performance and efficiency.

Address Bus Width: 20

Wider address bus width enables the processor to access a larger memory space for enhanced processing capabilities.

Package Shape: SQUARE

Square package shape ensures efficient use of space on the circuit board.

Bit Size: 32

32-bit architecture enables the processor to handle complex algorithms and data processing tasks effectively.

Power Supplies (V): 1.25,1.5/1.8,1.8,3.3

Multiple power supply options provide flexibility for different voltage requirements in various applications.

No. of Terminals: 697

Higher number of terminals allow for more connections and functionalities in the system.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and soldering during assembly.

RAM Words: 8192

Large RAM capacity enables efficient storage and access to data for processing tasks.

Maximum Clock Frequency: 66.6 MHz

High clock frequency allows for fast processing of data and instructions, leading to better performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer efficiency within the processor for improved processing speed.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated digital signal processing capabilities along with support for other peripheral IC types make it versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the processor energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) TMS320TCI6482BGTZ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e0

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.25,1.5/1.8,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2875 V

Minimum Supply Voltage:

1.2125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320TCI6482BGTZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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