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TMS320R2812GHHS

Texas Instruments

TMS320R2812GHHS by Texas Instruments

TMS320R2812GHHS by Texas Instruments is a 32-bit DSP with 16-bit data RAM, 19-bit address bus, and 150 MHz clock frequency. Ideal for automotive applications, it features low power mode, multiple internal bus architecture, and boundary scan capability.

Median Price

$14.500

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 975 parts In-Stock

1+ parts

-

100+ parts

$12.550

1k+ parts

$11.230

10k+ parts

$10.570

975

-

$12.550

$11.230

$10.570

DigiKey

USA . 975 parts In-Stock

1+ parts

-

100+ parts

$14.500

1k+ parts

-

10k+ parts

-

975

-

$14.500

-

-

Verical

USA . 760 parts In-Stock

1+ parts

-

100+ parts

$15.688

1k+ parts

$14.037

10k+ parts

$13.213

760

-

$15.688

$14.037

$13.213

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,699 parts In-Stock

1+ parts

$13.243

100+ parts

-

1k+ parts

-

10k+ parts

-

3,699

$13.243

-

-

-

Vyrian

USA . 2,242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,242

-

-

-

-

DigiKey Marketplace

USA . 975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

975

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 477 parts In-Stock

1+ parts

$11.850

100+ parts

-

1k+ parts

-

10k+ parts

-

477

$11.850

-

-

-

Corphita

USA . 2,787 parts In-Stock

1+ parts

$12.546

100+ parts

-

1k+ parts

-

10k+ parts

-

2,787

$12.546

-

-

-

Parana Technologies

USA . 256 parts In-Stock

1+ parts

$74.004

100+ parts

-

1k+ parts

-

10k+ parts

-

256

$74.004

-

-

-

ChromeModa Solutions

Germany . 1,243 parts In-Stock

1+ parts

$83.151

100+ parts

$68.184

1k+ parts

-

10k+ parts

-

1,243

$83.151

$68.184

-

-

IDEA Electronic Components Group

UK . 916 parts In-Stock

1+ parts

$83.151

100+ parts

$78.993

1k+ parts

$74.836

10k+ parts

-

916

$83.151

$78.993

$74.836

-

Corohmni

South Africa . 4,925 parts In-Stock

1+ parts

$86.565

100+ parts

-

1k+ parts

-

10k+ parts

-

4,925

$86.565

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

DigiPath Technology Company

USA . 1,792 parts In-Stock

1+ parts

-

100+ parts

$74.969

1k+ parts

-

10k+ parts

-

1,792

-

$74.969

-

-

Microchip USA

USA . 330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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330

-

-

-

-

Overview

Experience the power and precision of Texas Instruments with the TMS320R2812GHHS Digital Signal Processor. This high-quality product offers unparalleled performance and reliability for a wide range of applications, making it a valuable asset for any project. With advanced technology and innovative features, this DSP provides customers with unmatched benefits and advantages, ensuring optimal results every time. Trust in Texas Instruments to deliver excellence with the TMS320R2812GHHS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

Surface Mount: YES

Allows for easy mounting onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 2 V

Efficient power usage and compatibility with various power sources.

On Chip Data RAM Width: 16

Wide data RAM width for fast processing and storage of data.

Address Bus Width: 19

Larger address bus width for accessing a wide range of memory locations.

Package Shape: SQUARE

Compact and uniform shape for easy placement and installation.

Bit Size: 32

High bit size for processing complex digital signals with precision.

Power Supplies (V): 1.8,3.3

Support for multiple power supply options for flexibility in different operating environments.

No. of Terminals: 179

Sufficient number of terminals for versatile connectivity and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Innovative package style for reduced footprint and improved performance in compact systems.

Minimum Supply Voltage: 1.81 V

Low minimum supply voltage for energy efficiency and extended battery life.

Maximum Operating Temperature: 125 °C

High maximum operating temperature for reliable performance in harsh conditions.

No. of External Interrupts: 3

Multiple external interrupt options for handling various external events and signals.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in extreme cold environments.

Terminal Finish: TIN LEAD

Durable terminal finish for reliable connections and longevity.

Terminal Position: BOTTOM

Bottom terminal position for convenient access and space-saving design.

Maximum Seated Height: 1.4 mm

Low seated height for slim and compact product design.

RAM Words: 20480

Large RAM capacity for storing and processing a vast amount of data efficiently.

Width: 12 mm

Narrow width for easy integration into space-constrained systems.

Boundary Scan: YES

Boundary scan feature for testing and debugging circuit connections.

External Data Bus Width: 16

Expanded external data bus width for faster data transfer and processing.

Maximum Clock Frequency: 150 MHz

High clock frequency for rapid data processing and real-time signal handling.

Maximum Time At Peak Reflow Temperature (s): 20

Short reflow time for quick and efficient soldering during manufacturing.

Peak Reflow Temperature °C: 220

High peak reflow temperature for robust soldering and component reliability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture for optimized data flow and processing speed.

Length: 12 mm

Compact length for space-saving design and easy integration.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance for reliable performance in automotive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type for handling various digital signal processing tasks effectively.

No. of Timers: 8

Multiple timers for scheduling and coordinating time-sensitive tasks.

Technology: CMOS

CMOS technology for low power consumption and efficient signal processing.

Terminal Form: BALL

Ball terminal form for secure and reliable connections with external components.

Maximum Supply Current: 260 mA

Maximum supply current for stable and consistent power delivery.

Nominal Supply Voltage: 1.9 V

Optimal nominal supply voltage for reliable performance and energy efficiency.

Terminal Pitch: 0.8 mm

Narrow terminal pitch for compact and high-density PCB layouts.

Format: FIXED POINT

Fixed-point format for precise numerical calculations and signal processing.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 for safe handling and storage in humid environments.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMS320R2812GHHS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

179

No. of Timers:

8

On Chip Data RAM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

260 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320R2812GHHS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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