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TMS320LF2402APGAR

Texas Instruments

TMS320LF2402APGAR by Texas Instruments

TMS320LF2402APGAR by Texas Instruments is a 16-bit DSP with 3.3V supply, 20MHz clock frequency, and 544 RAM words. Ideal for industrial applications, it features FLASH ROM programmability, 16-bit data RAM width, and low power mode for efficient processing in digital signal processing tasks.

Median Price

$13.230

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,115 parts In-Stock

1+ parts

$13.230

100+ parts

$11.557

1k+ parts

$7.970

10k+ parts

-

1,115

$13.230

$11.557

$7.970

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,468 parts In-Stock

1+ parts

$12.568

100+ parts

-

1k+ parts

-

10k+ parts

-

2,468

$12.568

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$14.824

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$14.824

-

-

-

Vyrian

USA . 8,687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,687

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 878 parts In-Stock

1+ parts

$11.250

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$11.250

-

-

-

Corphita

USA . 3,650 parts In-Stock

1+ parts

$11.907

100+ parts

-

1k+ parts

-

10k+ parts

-

3,650

$11.907

-

-

-

AZTECH Wire

Italy . 85 parts In-Stock

1+ parts

$14.680

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$14.680

-

-

-

Bastille Electronics

Australia . 550 parts In-Stock

1+ parts

$14.820

100+ parts

$14.079

1k+ parts

-

10k+ parts

$13.190

550

$14.820

$14.079

-

$13.190

Continental Prestige Electronics

USA . 4,378 parts In-Stock

1+ parts

$14.824

100+ parts

-

1k+ parts

-

10k+ parts

$14.528

4,378

$14.824

-

-

$14.528

Corohmni

South Africa . 1,164 parts In-Stock

1+ parts

$34.847

100+ parts

-

1k+ parts

-

10k+ parts

-

1,164

$34.847

-

-

-

Parana Technologies

USA . 1,382 parts In-Stock

1+ parts

$77.098

100+ parts

-

1k+ parts

-

10k+ parts

-

1,382

$77.098

-

-

-

DigiPath Technology Company

USA . 817 parts In-Stock

1+ parts

$84.894

100+ parts

-

1k+ parts

-

10k+ parts

-

817

$84.894

-

-

-

ChromeModa Solutions

Germany . 5,234 parts In-Stock

1+ parts

$86.627

100+ parts

$71.034

1k+ parts

-

10k+ parts

-

5,234

$86.627

$71.034

-

-

IDEA Electronic Components Group

UK . 212 parts In-Stock

1+ parts

$86.627

100+ parts

$82.296

1k+ parts

$77.964

10k+ parts

-

212

$86.627

$82.296

$77.964

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Argo Parts USA

USA . 3,819 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,819

-

-

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Perfect Parts

USA . 1,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,344

-

-

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Overview

Elevate your digital signal processing capabilities with the TMS320LF2402APGAR by Texas Instruments. Crafted with precision and expertise, this DSP offers unmatched performance and reliability for a wide range of applications. Whether you're in the industrial sector or working on cutting-edge innovations, this product delivers exceptional value, efficiency, and flexibility. With features like low power mode, PWM channels, and ROM programmability, the TMS320LF2402APGAR empowers you to push boundaries and achieve your goals with ease. Join the ranks of satisfied customers who have experienced the superior quality and advantages of Texas Instruments products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the DSP, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options without exceeding the maximum voltage limit, ensuring safe operation.

Bit Size: 16

Offers a high processing capability with a 16-bit architecture, suitable for handling complex digital signal processing tasks.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with a wide temperature range, making it suitable for industrial applications.

Maximum Clock Frequency: 20 MHz

Provides fast processing speed for real-time digital signal processing applications, enhancing overall performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LF2402APGAR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G64

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.7X.95,40

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

544

ROM Programmability:

FLASH

Maximum Seated Height:

3.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320LF2402APGAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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