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TMS320LC549PGE-80

Texas Instruments

TMS320LC549PGE-80 by Texas Instruments

TMS320LC549PGE-80 by Texas Instruments is a 16-bit DSP with 3.3V supply, 20MHz clock frequency, and 32768 RAM words. Ideal for industrial applications requiring low power consumption and fixed-point format processing. Features include boundary scan, multiple internal bus architecture, and barrel shifter for efficient signal processing tasks.

Median Price

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Vyrian

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Legend Electronics Inc.

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Bristol Electronics

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One Stop Electronics

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Corohmni

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AZTECH Wire

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

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IDEA Electronic Components Group

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Overview

Unlock the power of digital signal processing with the TMS320LC549PGE-80 by Texas Instruments. Crafted with precision and expertise, this DSP offers unmatched performance and reliability for a wide range of applications. From audio processing to telecommunications, this cutting-edge technology delivers exceptional value and benefits to customers looking for high-quality solutions. Experience seamless operation and efficiency like never before with the TMS320LC549PGE-80. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for better portability and longevity.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs for flexibility in power supply.

Address Bus Width: 23

Allows for efficient memory addressing and data transfer.

Package Shape: SQUARE

Compact design for efficient use of space on the circuit board.

Bit Size: 16

Ideal for processing tasks requiring 16-bit precision and performance.

Power Supplies (V): 3.3

Stable power supply for reliable performance.

No. of Terminals: 144

Sufficient terminals for connectivity and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Streamlined package style for efficient integration and space-saving.

Minimum Supply Voltage: 3 V

Ensures operation even at low voltage conditions.

Maximum Operating Temperature: 100 °C

Can withstand high operating temperatures for extended use in various environments.

Minimum Operating Temperature: -40 °C

Operates efficiently even in extremely cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for excellent conductivity and durability.

Terminal Position: QUAD

Quad terminal position for easy connectivity in circuit designs.

Maximum Seated Height: 1.6 mm

Low profile design for compact installations.

RAM Words: 32768

Sufficient RAM capacity for processing and storing data efficiently.

Width: 20 mm

Compact width for fitting in tight spaces on the circuit board.

Boundary Scan: YES

Boundary scan feature for testing and debugging during development.

External Data Bus Width: 16

Matching external data bus width for seamless data transfer.

Maximum Clock Frequency: 20 MHz

High clock frequency for fast processing and performance.

Maximum Time At Peak Reflow Temperature (s): 30

Suitable reflow duration for manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture for efficient data flow.

Length: 20 mm

Compact length for space-saving installations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable operation in harsh environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type for diverse signal processing applications.

Technology: CMOS

CMOS technology for low power consumption and efficient performance.

Terminal Form: GULL WING

Gull wing terminal form for secure mounting and connectivity.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility with various systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and efficient connectivity.

Format: FIXED POINT

Fixed-point format for precise arithmetic operations and data processing.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 for safe handling and storage.

Low Power Mode: YES

Low power mode option for energy-efficient operation.

Barrel Shifter: YES

Barrel shifter feature for efficient data manipulation and processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC549PGE-80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320LC549PGE-80 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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