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TMS320LC542PBK1-50

Texas Instruments

TMS320LC542PBK1-50 by Texas Instruments

TMS320LC542PBK1-50 by Texas Instruments is a 16-bit DSP with 10K RAM words, operating at max 20 MHz clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point format processing. Features include 128 terminals, 3.3V supply voltage, and -40 to 100°C temperature range.

Median Price

$35.330

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,177 parts In-Stock

1+ parts

$35.330

100+ parts

$34.620

1k+ parts

$33.920

10k+ parts

-

1,177

$35.330

$34.620

$33.920

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 763 parts In-Stock

1+ parts

$33.564

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$33.564

-

-

-

Vyrian

USA . 7,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,324

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 900 parts In-Stock

1+ parts

$17.540

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$17.540

-

-

-

Corphita

USA . 3,657 parts In-Stock

1+ parts

$31.797

100+ parts

-

1k+ parts

-

10k+ parts

-

3,657

$31.797

-

-

-

Parana Technologies

USA . 994 parts In-Stock

1+ parts

$59.408

100+ parts

-

1k+ parts

-

10k+ parts

-

994

$59.408

-

-

-

Corohmni

South Africa . 89 parts In-Stock

1+ parts

$60.098

100+ parts

-

1k+ parts

-

10k+ parts

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89

$60.098

-

-

-

ChromeModa Solutions

Germany . 4,593 parts In-Stock

1+ parts

$66.750

100+ parts

$54.735

1k+ parts

-

10k+ parts

-

4,593

$66.750

$54.735

-

-

IDEA Electronic Components Group

UK . 2,274 parts In-Stock

1+ parts

$66.750

100+ parts

$63.412

1k+ parts

$60.075

10k+ parts

-

2,274

$66.750

$63.412

$60.075

-

DigiPath Technology Company

USA . 938 parts In-Stock

1+ parts

-

100+ parts

$60.182

1k+ parts

-

10k+ parts

-

938

-

$60.182

-

-

Overview

Experience superior performance and reliability with the TMS320LC542PBK1-50 by Texas Instruments, a leading manufacturer in the industry of Digital Signal Processors (DSPs). This versatile product offers a wide range of applications, making it ideal for various projects. With a focus on quality and innovation, Texas Instruments ensures that customers receive excellent value and benefits from their products. Trust in the TMS320LC542PBK1-50 to deliver exceptional results and streamline your workflow efficiently. Choose Texas Instruments for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability makes for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a relatively high maximum supply voltage for flexibility in power requirements.

On Chip Data RAM Width: 16

Wide data RAM width allows for efficient data processing and storage capabilities.

Address Bus Width: 16

Broad address bus width enables efficient data retrieval and storage operations.

Bit Size: 16

The 16-bit architecture allows for faster data processing compared to lower bit size DSPs.

Power Supplies (V): 3.3

Operates on a standard power supply voltage of 3.3V for compatibility with common power sources.

No. of Terminals: 128

Ample terminals provide multiple connectivity options for interfacing with other components and peripherals.

Minimum Supply Voltage: 3 V

Supports a minimum supply voltage of 3V, ensuring operational stability at low voltage levels.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range makes the DSP suitable for a variety of environments and applications.

No. of External Interrupts: 5

Multiple external interrupts allow for efficient handling of external events or signals.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range ensures reliable performance even in harsh environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal position offers stable and secure connections for enhanced reliability in circuit integration.

RAM Words: 10K

Large RAM capacity of 10K words enables efficient data storage and processing.

Width: 14 mm

Compact width of 14mm allows for space-efficient integration into electronic devices.

Boundary Scan: YES

Boundary scan feature facilitates testing and debugging during development and production processes.

External Data Bus Width: 16

Wide external data bus width ensures high-speed data transfer between the DSP and external components.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency of 20 MHz enables fast data processing and response times.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture provides efficient data routing and processing capabilities within the DSP.

Length: 14 mm

Compact length of 14mm enables space-saving integration in electronic systems and devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in challenging temperature environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The product offers a variety of digital signal processing features and additional peripheral functions for versatile applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy and secure soldering onto circuit boards for reliable connections.

Nominal Supply Voltage: 3.3 V

Operates at a nominal supply voltage of 3.3V for standard power compatibility.

ROM Programmability: MROM

MROM programmability allows for secure and reliable storage of read-only memory data.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm enables precise and compact circuit board integration.

Format: FIXED POINT

Fixed-point format provides accurate and efficient numerical processing capabilities for various applications.

Low Power Mode: YES

Low power mode option offers energy-saving operation for extended battery life in portable devices.

Barrel Shifter: YES

Barrel shifter feature allows for efficient and flexible data shifting operations within the DSP.

On Chip Program ROM Width: 16

Wide on-chip program ROM width of 16 bits enables storage of program instructions for fast execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC542PBK1-50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

128

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

10K

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320LC542PBK1-50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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