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TMS320LC206PZA80

Texas Instruments

TMS320LC206PZA80 by Texas Instruments

TMS320LC206PZA80 by Texas Instruments is a 16-bit DSP with 3.3V supply, 80MHz clock frequency, and 4640 RAM words. Ideal for industrial applications requiring low power consumption and fixed-point format processing. Features include boundary scan, multiple internal bus architecture, and on-chip program ROM.

Median Price

$23.276

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 283 parts In-Stock

1+ parts

$18.690

100+ parts

$18.320

1k+ parts

$17.940

10k+ parts

-

283

$18.690

$18.320

$17.940

-

Texas Instruments

USA . 730 parts In-Stock

1+ parts

$27.861

100+ parts

$24.337

1k+ parts

$16.784

10k+ parts

-

730

$27.861

$24.337

$16.784

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,554 parts In-Stock

1+ parts

$26.468

100+ parts

-

1k+ parts

-

10k+ parts

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1,554

$26.468

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-

-

Vyrian

USA . 7,321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,321

-

-

-

-

Speed Components Ltd

Israel . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 695 parts In-Stock

1+ parts

$13.670

100+ parts

-

1k+ parts

-

10k+ parts

-

695

$13.670

-

-

-

Parana Technologies

USA . 824 parts In-Stock

1+ parts

$17.508

100+ parts

-

1k+ parts

$17.703

10k+ parts

-

824

$17.508

-

$17.703

-

DigiPath Technology Company

USA . 87 parts In-Stock

1+ parts

$19.279

100+ parts

-

1k+ parts

-

10k+ parts

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87

$19.279

-

-

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ChromeModa Solutions

Germany . 3,673 parts In-Stock

1+ parts

$19.672

100+ parts

$16.131

1k+ parts

-

10k+ parts

-

3,673

$19.672

$16.131

-

-

IDEA Electronic Components Group

UK . 999 parts In-Stock

1+ parts

$19.672

100+ parts

$18.688

1k+ parts

$17.705

10k+ parts

-

999

$19.672

$18.688

$17.705

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Corphita

USA . 2,929 parts In-Stock

1+ parts

$25.075

100+ parts

-

1k+ parts

-

10k+ parts

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2,929

$25.075

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Microchip USA

USA . 1,387 parts In-Stock

1+ parts

$59.260

100+ parts

$58.230

1k+ parts

$57.720

10k+ parts

$57.200

1,387

$59.260

$58.230

$57.720

$57.200

Corohmni

South Africa . 5,011 parts In-Stock

1+ parts

$60.343

100+ parts

-

1k+ parts

-

10k+ parts

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5,011

$60.343

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Perfect Parts

USA . 466 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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466

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Overview

Unlock the power of digital signal processing with the TMS320LC206PZA80 by Texas Instruments. Crafted with precision and expertise, this product offers unparalleled performance and reliability for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial control systems, this DSP will exceed your expectations. With its low power mode and advanced features like barrel shifter and boundary scan, the TMS320LC206PZA80 provides exceptional value and efficiency to customers looking for top-notch performance in a compact package. Elevate your projects with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easier and more cost-effective PCB assembly processes, saving time and labor.

Maximum Supply Voltage: 3.6 V

Supports a high supply voltage, providing flexibility in power source options for the product.

On Chip Data RAM Width: 16

Wide data RAM width allows for faster data processing and storage within the chip.

Address Bus Width: 16

Having a wide address bus width enables the processor to access a larger memory space efficiently.

Package Shape: SQUARE

Square package shape facilitates easier and more compact placement on the PCB, optimizing board space.

Bit Size: 16

16-bit architecture offers a balance between performance and cost, suitable for many embedded applications.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance of the DSP under various operating conditions.

No. of Terminals: 100

Having a high number of terminals allows for more connections and interfaces to external components, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a good balance between compact size and ease of assembly, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.7 V

Supports a low minimum supply voltage, enabling efficient power management and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the DSP to operate reliably in harsh environments without thermal issues.

No. of External Interrupts: 4

Having multiple external interrupts enables the processor to quickly respond to external events, enhancing real-time responsiveness.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the DSP can operate in extreme cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides corrosion resistance and excellent conductivity for reliable connections and long-term performance.

Terminal Position: QUAD

Quad terminal position enables easy soldering and connection to the PCB, simplifying the manufacturing process.

Maximum Seated Height: 1.6 mm

Low seated height saves space on the PCB and allows for more compact and streamlined product designs.

RAM Words: 4640

Large RAM capacity allows for efficient data storage and manipulation, essential for processing complex algorithms and computations.

Width: 14 mm

Compact width facilitates easy integration into tight spaces and enables the DSP to be used in small form factor devices.

Boundary Scan: YES

Boundary scan feature helps with debugging, testing, and programming the DSP, simplifying the development and troubleshooting process.

External Data Bus Width: 16

With a wide external data bus width, the DSP can efficiently transfer data to and from external memory or peripherals.

Maximum Clock Frequency: 80 MHz

High clock frequency allows for fast execution of instructions and signal processing tasks, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures proper soldering and assembly of the DSP without damaging sensitive components.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering during assembly processes, ensuring long-term durability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer speeds within the chip, improving overall processing performance.

Length: 14 mm

Compact length enables the DSP to fit in small spaces and be used in applications with size constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the DSP can operate reliably in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type enables the DSP to interface with a wide range of external devices, expanding its usability in different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and handling during assembly, reducing the risk of damage during the manufacturing process.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance of the DSP across different operating conditions.

ROM Programmability: MROM

Mask-programmable ROM offers secure and permanent storage of firmware or configuration data, safeguarding against unauthorized modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for closer spacing of terminals, enabling more connections in a smaller footprint on the PCB.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and reduces computational complexity, speeding up signal processing tasks.

Low Power Mode: YES

Low power mode feature helps to conserve energy and extend battery life, making the DSP suitable for portable and battery-powered applications.

Barrel Shifter: YES

Barrel shifter feature allows for efficient shifting and rotation operations, improving performance in DSP algorithms and data processing tasks.

On Chip Program ROM Width: 16

Wide on-chip program ROM width allows for storing a large amount of program code, enhancing the versatility of the DSP for various applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC206PZA80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Terminals:

100

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

4640

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320LC206PZA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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