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TMS320F28234ZHHA

Texas Instruments

TMS320F28234ZHHA by Texas Instruments

TMS320F28234ZHHA by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 68 RAM words, and 32-bit external data bus width. Ideal for industrial applications requiring high-speed signal processing, it features low power mode, flash ROM programmability, and AEC-Q100 screening level.

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1k+

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Vyrian

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Digiode

USA . 4,352 parts In-Stock

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AZTECH Wire

Italy . 782 parts In-Stock

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$7.141

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One Stop Electronics

USA . 476 parts In-Stock

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$28.000

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Corohmni

South Africa . 55 parts In-Stock

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$33.370

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Parana Technologies

USA . 92 parts In-Stock

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$35.774

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ChromeModa Solutions

Germany . 6,705 parts In-Stock

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$40.195

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$32.960

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$32.960

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IDEA Electronic Components Group

UK . 751 parts In-Stock

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$40.195

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$38.185

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$36.176

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751

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Corphita

USA . 2,025 parts In-Stock

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DigiPath Technology Company

USA . 782 parts In-Stock

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Microchip USA

USA . 192 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of cutting-edge technology with the TMS320F28234ZHHA by Texas Instruments, a top-of-the-line Digital Signal Processor designed for high-performance applications. With a focus on quality and reliability, Texas Instruments delivers unmatched value to customers seeking efficient signal processing solutions. Whether you're in need of advanced control systems or real-time signal processing, this DSP offers superior performance, low power consumption, and a wide range of features to meet your unique requirements. Elevate your projects to the next level with the TMS320F28234ZHHA and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology makes it easier to integrate the DSP into a PCB, saving space and improving reliability.

Maximum Supply Voltage: 1.995 V

The higher maximum supply voltage allows for more flexibility in power supply design and compatibility with different system configurations.

On Chip Data RAM Width: 16

The wider data RAM width allows for faster data processing and manipulation, enhancing overall performance.

Address Bus Width: 20

A wider address bus width allows for larger memory addressing capacity, enabling the DSP to handle more complex algorithms and data sets.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures high reliability and quality, making the DSP suitable for automotive and other demanding environments.

Package Shape: SQUARE

The square package shape is space-efficient and facilitates easier PCB layout and assembly.

Bit Size: 32

The 32-bit architecture provides higher computational accuracy and performance compared to lower bit sizes.

Power Supplies (V): 1.9,3.3

Multiple power supply options allow for compatibility with various system requirements and reduce the need for external components.

No. of Terminals: 179

Having a high number of terminals provides ample connectivity options for interfacing with other system components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The specific package style offers a compact and reliable form factor suitable for modern electronic devices.

Minimum Supply Voltage: 1.805 V

The low minimum supply voltage allows for efficient power management and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions.

CPU Family: C28X

Being part of the C28X CPU family ensures compatibility with existing software and tools, simplifying development and integration.

No. of External Interrupts: 8

Having multiple external interrupts allows the DSP to respond quickly to external events and enhance real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the DSP to function reliably in cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: BOTTOM

Having terminals on the bottom simplifies PCB layout and assembly, making the integration process more efficient.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for slim and compact device designs, especially in space-constrained applications.

RAM Words: 68

The ample RAM capacity enables the DSP to store and process large volumes of data efficiently, enhancing overall performance.

Width: 12 mm

The compact width of the DSP saves space on the PCB and allows for more efficient use of board real estate.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging during production, reducing time and cost in the manufacturing process.

External Data Bus Width: 32

The wide external data bus width allows for fast data transfer between the DSP and external memory or peripherals, improving overall system performance.

Maximum Clock Frequency: 150 MHz

The high maximum clock frequency enables the DSP to execute instructions quickly, making it suitable for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering of the DSP during manufacturing processes, ensuring reliable connectivity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for a robust soldering process, ensuring durable and long-lasting connections.

Internal Bus Architecture: MULTIPLE

A multiple internal bus architecture improves data processing efficiency and allows for concurrent execution of multiple tasks.

Length: 12 mm

The compact length of the DSP contributes to a smaller overall footprint in the final product design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in a wide range of temperature conditions typically found in industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The specific type of peripheral IC enables the DSP to interface with other components and peripherals effectively, expanding its functionality.

No. of Timers: 19

Having multiple timers allows for precise timing control and synchronization of various operations, enhancing system performance.

RAM Bytes: 69632

The large RAM capacity in terms of bytes allows the DSP to handle complex algorithms and process extensive data sets efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the DSP energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The use of ball terminals facilitates reliable and consistent connections, especially in applications subject to mechanical stress.

Maximum Supply Current: 315 mA

The specified maximum supply current ensures that the DSP operates within safe power limits and does not strain the power supply system.

Nominal Supply Voltage: 1.9 V

Having a stable nominal supply voltage ensures consistent performance and reliable operation of the DSP in various conditions.

No. of DMA Channels: 6

A sufficient number of DMA channels enables efficient data transfer between memory and peripherals, reducing CPU overhead and improving system performance.

PWM Channels: YES

Having PWM channels allows for precise control of analog devices, such as motors or LEDs, expanding the DSP's applicability in various control systems.

ROM Programmability: FLASH

The use of flash ROM allows for easy reprogramming of the DSP firmware, facilitating product updates and customization.

Terminal Pitch: 0.8 mm

The fine terminal pitch enables a higher density of connections, contributing to a compact and efficient PCB layout.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and accelerates processing, making the DSP suitable for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the DSP requires standard moisture sensitivity handling during storage and assembly, ensuring product reliability.

Low Power Mode: YES

The low power mode feature helps optimize power consumption and extend battery life in portable and battery-powered devices.

On Chip Program ROM Width: 16

The wide on-chip program ROM width allows for storing a large number of program instructions, enabling complex algorithms to be executed efficiently.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28234ZHHA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

179

No. of Timers:

19

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

69632

RAM Words:

68

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

315 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F28234ZHHA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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