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TMS320F2808NMFS

Texas Instruments

TMS320F2808NMFS by Texas Instruments

TMS320F2808NMFS by Texas Instruments is a 32-bit DSP with 100 terminals, operating at up to 100 MHz. Ideal for automotive applications, it features 3 timers, ADC channels, and PWM channels. With low power mode and floating-point format, this CMOS technology device offers high performance in a compact package.

Median Price

$19.575

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,462 parts In-Stock

1+ parts

$19.575

100+ parts

$17.098

1k+ parts

$11.792

10k+ parts

-

2,462

$19.575

$17.098

$11.792

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,491 parts In-Stock

1+ parts

$18.596

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-

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2,491

$18.596

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$21.509

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50

$21.509

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Vyrian

USA . 2,466 parts In-Stock

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2,466

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Chip Stock

USA . 463 parts In-Stock

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463

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,150 parts In-Stock

1+ parts

$16.640

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-

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$16.640

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Corphita

USA . 4,399 parts In-Stock

1+ parts

$17.618

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4,399

$17.618

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Continental Prestige Electronics

USA . 2,679 parts In-Stock

1+ parts

$21.509

100+ parts

-

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$21.078

2,679

$21.509

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$21.078

Netroflash

USA . 500 parts In-Stock

1+ parts

$21.509

100+ parts

-

1k+ parts

$20.433

10k+ parts

$20.003

500

$21.509

-

$20.433

$20.003

Corohmni

South Africa . 2,693 parts In-Stock

1+ parts

$34.770

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2,693

$34.770

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Parana Technologies

USA . 1,570 parts In-Stock

1+ parts

$36.976

100+ parts

$3,433.777

1k+ parts

$33.278

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1,570

$36.976

$3,433.777

$33.278

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DigiPath Technology Company

USA . 211 parts In-Stock

1+ parts

$40.715

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211

$40.715

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IDEA Electronic Components Group

UK . 1,853 parts In-Stock

1+ parts

$41.546

100+ parts

$39.469

1k+ parts

$37.391

10k+ parts

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1,853

$41.546

$39.469

$37.391

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ChromeModa Solutions

Germany . 1,253 parts In-Stock

1+ parts

$41.546

100+ parts

$34.068

1k+ parts

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1,253

$41.546

$34.068

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Microchip USA

USA . 4,249 parts In-Stock

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$52.696

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4,249

$52.696

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Lixinc

USA . 16,047 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Argo Parts USA

USA . 2,225 parts In-Stock

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2,225

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Overview

Unlock the power of advanced digital signal processing with the TMS320F2808NMFS by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-notch quality and reliability. This DSP is perfect for applications such as motor control, renewable energy, and power conversion. Experience the value of seamless performance, enhanced efficiency, and cutting-edge technology with the TMS320F2808NMFS. Elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the components inside the package, ensuring durability and reliability.

Surface Mount: YES

Ease of installation and compatibility with modern PCB designs.

Maximum Supply Voltage: 1.89 V

Allows for higher performance and flexibility in power supply options.

On Chip Data RAM Width: 16

Wider data RAM allows for efficient processing of complex algorithms and data sets.

Package Shape: SQUARE

Compact shape saves space on the PCB and provides better thermal management.

Bit Size: 32

Higher bit size allows for processing of larger data chunks and more complex calculations.

No. of Terminals: 100

Sufficient number of terminals for connecting various external components and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high connection density, low profile for space-saving, and fine pitch for improved signal integrity.

Minimum Supply Voltage: 1.71 V

Allows for lower power consumption and operation in low voltage scenarios.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, suitable for demanding applications.

CPU Family: C28X

Belongs to a known and reliable CPU family, ensuring compatibility and performance.

No. of External Interrupts: 3

Sufficient number of external interrupts for handling real-time events and time-critical tasks.

Minimum Operating Temperature: -40 °C

Can operate in harsh cold environments, making it suitable for automotive and industrial applications.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated ADC channels for analog signal processing, expanding the range of applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting on the PCB.

Maximum Seated Height: 1.4 mm

Low profile design for space-saving and improved thermal characteristics.

RAM Words: 18432

Sufficient RAM words for storing and processing data efficiently.

Width: 10 mm

Compact width for space-saving on the PCB.

Boundary Scan: YES

Boundary scan capability for easier testing and debugging.

Maximum Clock Frequency: 100 MHz

High clock frequency for fast processing and real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time for efficient manufacturing and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering and robust connections.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture for efficient data transfer and processing.

Length: 10 mm

Compact length for space-saving on the PCB.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications with the ability to withstand automotive temperature requirements.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized digital signal processor for high-performance signal processing tasks.

No. of Timers: 3

Multiple timers for time-critical tasks and event handling.

RAM Bytes: 36864

Sufficient RAM bytes for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: BALL

Ball terminal form for secure connections and easy mounting.

Maximum Supply Current: 230 mA

Low supply current for efficient power consumption.

Nominal Supply Voltage: 1.8 V

Standard nominal supply voltage for compatibility with power supply systems.

PWM Channels: YES

Integrated PWM channels for signal modulation and control.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and customization.

Terminal Pitch: 0.8 mm

Fine terminal pitch for improved signal integrity and compact design.

Format: FLOATING POINT

Support for floating-point format for more precise calculations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 for moderate moisture sensitivity, suitable for standard manufacturing and storage conditions.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 16

Wider on-chip ROM width for efficient program storage and execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2808NMFS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2808NMFS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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