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TMS320DM8168SCYG

Texas Instruments

TMS320DM8168SCYG by Texas Instruments

TMS320DM8168SCYG by Texas Instruments is a 32-bit DSP with integrated cache, 15-bit address bus width, and 32-bit external data bus width. Ideal for digital signal processing applications, it features low power mode, multiple internal bus architecture, and 72 DMA channels for efficient data handling.

Median Price

$107.070

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 278 parts In-Stock

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$107.070

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278

$107.070

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Distributors (In-Stock)

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Digiode

USA . 1,472 parts In-Stock

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$101.716

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1,472

$101.716

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Vyrian

USA . 3,964 parts In-Stock

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3,964

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Distributors (Availability)

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AZTECH Wire

Italy . 675 parts In-Stock

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$9.810

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675

$9.810

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Parana Technologies

USA . 1,520 parts In-Stock

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$69.278

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$69.278

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IDEA Electronic Components Group

UK . 1,550 parts In-Stock

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$77.841

100+ parts

$73.949

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$70.057

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1,550

$77.841

$73.949

$70.057

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ChromeModa Solutions

Germany . 591 parts In-Stock

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$77.841

100+ parts

$63.830

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591

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$63.830

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Corohmni

South Africa . 2,618 parts In-Stock

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$80.116

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Corphita

USA . 2,656 parts In-Stock

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$96.363

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Microchip USA

USA . 2,368 parts In-Stock

1+ parts

$119.490

100+ parts

$116.310

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$114.710

10k+ parts

$113.120

2,368

$119.490

$116.310

$114.710

$113.120

DigiPath Technology Company

USA . 1,244 parts In-Stock

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$70.181

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Component Stockers USA

USA . 46 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the TMS320DM8168SCYG by Texas Instruments, a leading manufacturer in the industry of Digital Signal Processors (DSPs). This cutting-edge product offers integrated cache, low power mode, and multiple DMA channels, making it ideal for applications requiring high-speed data processing. Whether you're designing a next-generation communication system or a sophisticated industrial automation solution, this DSP delivers exceptional value, efficiency, and versatility. Elevate your projects to new heights with the TMS320DM8168SCYG and experience the difference that superior quality and innovation can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability for the DSP, making it a good choice for long-term usage.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the DSP, making it a good choice for handling complex digital signal processing tasks.

Maximum Supply Voltage: 1.05 V

With a maximum supply voltage of 1.05 V, this DSP is designed to operate efficiently while consuming minimal power, making it a good choice for energy-efficient applications.

RAM Words: 16384

The large RAM capacity of 16384 words allows for efficient storage and retrieval of data during signal processing operations, making this DSP suitable for handling large amounts of data.

Technology: CMOS

Being based on CMOS technology ensures efficient power consumption and high-speed processing, making this DSP a good choice for applications requiring fast data processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8168SCYG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8168SCYG Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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