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TMS320DM8148BCYE0

Texas Instruments

TMS320DM8148BCYE0 by Texas Instruments

TMS320DM8148BCYE0 by Texas Instruments is a 32-bit DSP with 16-bit external data bus, operating at max 30 MHz. It features 16384 RAM words and operates b/w 0-90°C. Ideal for digital signal processing applications requiring low power consumption and high-speed data processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,879 parts In-Stock

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Digiode

USA . 2,808 parts In-Stock

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One Stop Electronics

USA . 1,169 parts In-Stock

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$3.000

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$3.000

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Parana Technologies

USA . 2,305 parts In-Stock

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$16.914

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$1,570.681

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$15.222

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AZTECH Wire

Italy . 384 parts In-Stock

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$17.540

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DigiPath Technology Company

USA . 2,248 parts In-Stock

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$18.624

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IDEA Electronic Components Group

UK . 1,707 parts In-Stock

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$19.004

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$18.054

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$17.104

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ChromeModa Solutions

Germany . 1,170 parts In-Stock

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$19.004

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$15.583

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Corohmni

South Africa . 168 parts In-Stock

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$24.156

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QUARKTWIN TECHNOLOGY LTD

USA . 22,240 parts In-Stock

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Corphita

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Microchip USA

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Overview

Experience the power of cutting-edge technology with the TMS320DM8148BCYE0 by Texas Instruments. As a leader in the industry, Texas Instruments brings you a high-quality Digital Signal Processor that is perfect for a wide range of applications. From audio processing to telecommunications, this DSP offers unparalleled performance and reliability. With its advanced features and innovative design, the TMS320DM8148BCYE0 provides customers with exceptional value and benefits. Trust Texas Instruments to deliver top-notch solutions for all your processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and allowing for efficient assembly.

Maximum Supply Voltage: 1.16 V

Operating at a maximum supply voltage of 1.16V ensures compatibility with various power sources and efficiency in power consumption.

Address Bus Width: 8

Having an address bus width of 8 allows for efficient memory addressing and data management in the processor.

Package Shape: SQUARE

Square package shape is ideal for efficient board layout and space utilization in electronic designs.

Bit Size: 32

With a 32-bit architecture, this DSP can handle complex mathematical computations and signal processing tasks with high precision and accuracy.

Power Supplies (V): 0.95/1.35

Having a range of power supply voltages allows for flexibility in power management and optimization for different application requirements.

No. of Terminals: 684

A large number of terminals enable connections to various external components and peripherals, enhancing the functionality and versatility of the DSP.

Minimum Supply Voltage: 1.05 V

Operating at a minimum supply voltage of 1.05V ensures reliable performance and power efficiency in low-power settings.

Maximum Operating Temperature: 90 °C

Operating at a maximum temperature of 90°C allows for reliable performance in high-temperature environments and extended usage without overheating.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures reliable performance in cold environments and startup conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides good conductivity and reliability in connecting the DSP to external components on the board.

RAM Words: 16384

With a large RAM capacity of 16384 words, the DSP can efficiently store and process data, enabling fast and responsive signal processing tasks.

Width: 23 mm

Compact width of 23mm allows for space-saving integration in electronic designs while maintaining functionality and performance.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the DSP during production and maintenance, ensuring quality and reliability.

External Data Bus Width: 16

Having an external data bus width of 16 enables high-speed data transfers and efficient communication with external devices, enhancing overall performance.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30MHz allows for fast processing and response times in signal processing and data computation tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperatures for 30 seconds ensures durability and reliability during manufacturing processes.

Peak Reflow Temperature °C: 250

Capable of withstanding peak reflow temperatures of 250°C during soldering processes, ensuring structural integrity and performance stability.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architectures allows for efficient data routing and processing, enhancing overall performance and speed.

Length: 23 mm

Compact length of 23mm allows for space-saving integration in electronic designs while maintaining functionality and performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with various peripheral IC types allows for versatile applications in signal processing, communications, and control systems.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Having a terminal form of ball provides reliable connections and soldering points for securing the DSP in electronic assemblies.

Nominal Supply Voltage: 1.1 V

Operating at a nominal supply voltage of 1.1V ensures stability and efficiency in power management for consistent performance.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the DSP allows for precise connections and compact board layouts in electronic designs.

Format: FLOATING POINT

Utilizing floating-point format allows for high-precision mathematical computations and signal processing tasks, ensuring accurate results and performance.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates the level of protection needed during storage and handling to prevent moisture-induced damage to the DSP.

Low Power Mode: YES

Incorporating a low power mode feature allows for energy-saving operation and extended battery life in power-constrained applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8148BCYE0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

8

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA688,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

RAM Words:

16384

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8148BCYE0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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