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TMS320DM643GDK600

Texas Instruments

TMS320DM643GDK600 by Texas Instruments

TMS320DM643GDK600 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at max 133 MHz clock frequency. It features 16384 RAM words and low power mode, suitable for digital signal processing applications requiring high-speed performance in a compact form factor.

Median Price

$27.889

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$24.790

1k+ parts

$22.180

10k+ parts

$20.870

60

-

$24.790

$22.180

$20.870

DigiKey

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Verical

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$30.988

1k+ parts

$27.725

10k+ parts

$26.087

60

-

$30.988

$27.725

$26.087

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,366 parts In-Stock

1+ parts

$26.163

100+ parts

-

1k+ parts

-

10k+ parts

-

4,366

$26.163

-

-

-

Vyrian

USA . 2,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,132

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 134 parts In-Stock

1+ parts

$15.880

100+ parts

-

1k+ parts

-

10k+ parts

-

134

$15.880

-

-

-

Ampacity Inc.

Singapore . 60 parts In-Stock

1+ parts

$23.410

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$23.410

-

-

-

Corphita

USA . 1,895 parts In-Stock

1+ parts

$24.786

100+ parts

-

1k+ parts

-

10k+ parts

-

1,895

$24.786

-

-

-

Parana Technologies

USA . 427 parts In-Stock

1+ parts

$57.194

100+ parts

-

1k+ parts

-

10k+ parts

-

427

$57.194

-

-

-

Microchip USA

USA . 2,708 parts In-Stock

1+ parts

$60.810

100+ parts

$59.750

1k+ parts

$59.230

10k+ parts

$58.700

2,708

$60.810

$59.750

$59.230

$58.700

ChromeModa Solutions

Germany . 2,748 parts In-Stock

1+ parts

$64.263

100+ parts

$52.696

1k+ parts

-

10k+ parts

-

2,748

$64.263

$52.696

-

-

IDEA Electronic Components Group

UK . 239 parts In-Stock

1+ parts

$64.263

100+ parts

$61.050

1k+ parts

$57.837

10k+ parts

-

239

$64.263

$61.050

$57.837

-

DigiPath Technology Company

USA . 1,402 parts In-Stock

1+ parts

-

100+ parts

$57.940

1k+ parts

-

10k+ parts

-

1,402

-

$57.940

-

-

Perfect Parts

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Overview

Unlock the power of seamless digital signal processing with the TMS320DM643GDK600 by Texas Instruments. As a leader in cutting-edge technology, Texas Instruments delivers quality and reliability that you can trust. Ideal for a wide range of applications, this Digital Signal Processor offers unmatched performance and versatility. Experience enhanced efficiency and superior functionality with this innovative product, providing value and benefits that exceed expectations. Choose Texas Instruments for unparalleled excellence in DSP technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the DSP, making it easy to handle and transport.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, saving space and facilitating mass production.

Maximum Supply Voltage: 1.44 V

Allows for a higher supply voltage, potentially improving performance and flexibility in power management.

Address Bus Width: 20

Provides a wide address bus width, enhancing the DSP's ability to handle complex memory operations efficiently.

Bit Size: 32

With a 32-bit architecture, the DSP can process data and instructions in larger chunks, leading to faster computations.

Power Supplies (V): 1.4,3.3

Supports multiple power supply options, giving users flexibility in designing power circuits for different applications.

No. of Terminals: 548

With a high number of terminals, the DSP can interface with a variety of external components and peripherals, enhancing its connectivity.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch design offers high density and connectivity, allowing for efficient routing of signals and reducing signal interference.

Minimum Supply Voltage: 1.36 V

Even with a low supply voltage, the DSP can still operate reliably, ensuring consistent performance in diverse operating conditions.

Maximum Operating Temperature: 90 °C

Can withstand high operating temperatures, making it suitable for industrial and automotive applications where thermal management is crucial.

Minimum Operating Temperature: 0 °C

Can operate in cold environments without any issues, providing reliability in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

The tin-lead finish enhances solderability and reliability of the terminals, ensuring a robust connection with the circuit board.

Terminal Position: BOTTOM

Bottom terminal position simplifies the mounting process and allows for efficient heat dissipation, enhancing overall performance.

Maximum Seated Height: 2.8 mm

With a low seated height, the DSP can be accommodated in compact designs without compromising on performance or reliability.

RAM Words: 16384

The ample RAM capacity allows for efficient data storage and retrieval, enabling faster processing of complex algorithms and computations.

Width: 23 mm

A compact width makes the DSP suitable for space-constrained applications, while still providing high performance capabilities.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, improving overall product quality and time-to-market.

External Data Bus Width: 64

A wide external data bus width enables high-speed data transfers between the DSP and external devices, enhancing overall system performance.

Maximum Clock Frequency: 133 MHz

With a high clock frequency, the DSP can execute instructions quickly, improving overall system responsiveness and throughput.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data transfer within the DSP, optimizing performance and reducing latency.

Length: 23 mm

Compact length enables easy integration into various system designs, while maintaining high performance capabilities.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports various peripherals and interfaces, making it versatile and adaptable to different application requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliability in diverse environments.

Terminal Form: BALL

Ball terminal form simplifies mounting and improves thermal conductivity, enhancing overall reliability and performance.

Nominal Supply Voltage: 1.4 V

Stable nominal supply voltage ensures consistent performance and reliability in various operating conditions.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting, saving space and improving signal integrity and transmission.

Format: FIXED POINT

Fixed-point format simplifies computation and reduces processing overhead, improving overall efficiency and speed of operations.

Moisture Sensitivity Level (MSL): 4

With MSL level 4, the DSP can withstand standard humidity conditions during handling and assembly processes, ensuring product reliability.

Low Power Mode: YES

The low power mode option allows for power-efficient operation, extending battery life in portable applications and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM643GDK600 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

133 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM643GDK600 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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