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TMS320DM6437ZWTQ6

Texas Instruments

TMS320DM6437ZWTQ6 by Texas Instruments

TMS320DM6437ZWTQ6 by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit external data bus width, and max clock frequency of 27 MHz. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$51.942

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 250 parts In-Stock

1+ parts

$42.484

100+ parts

$37.763

1k+ parts

$27.767

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250

$42.484

$37.763

$27.767

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DigiKey

USA . 77 parts In-Stock

1+ parts

$61.400

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77

$61.400

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Digiode

USA . 4,230 parts In-Stock

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$40.360

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$40.360

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Vyrian

USA . 8,426 parts In-Stock

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8,426

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Chip Stock

USA . 5,000 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Legend Electronics Inc.

USA . 96 parts In-Stock

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Cyclops Electronics Ltd

UK . 91 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 158 parts In-Stock

1+ parts

$36.110

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158

$36.110

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Corphita

USA . 1,631 parts In-Stock

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$38.236

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Component Stockers USA

USA . 8 parts In-Stock

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$47.990

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8

$47.990

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Corohmni

South Africa . 939 parts In-Stock

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$52.013

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939

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Parana Technologies

USA . 764 parts In-Stock

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$71.486

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764

$71.486

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DigiPath Technology Company

USA . 2,201 parts In-Stock

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$78.715

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$78.715

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ChromeModa Solutions

Germany . 2,426 parts In-Stock

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$80.321

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$65.863

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2,426

$80.321

$65.863

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IDEA Electronic Components Group

UK . 2,355 parts In-Stock

1+ parts

$80.321

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$76.305

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$72.289

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2,355

$80.321

$76.305

$72.289

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iodParts Technologies Inc.

India . 26,730 parts In-Stock

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Lixinc

USA . 2,411 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Assy Fe

Spain . 1,686 parts In-Stock

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A-Z Elektronik GmbH

Germany . 258 parts In-Stock

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Kepictronics

USA . 90 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320DM6437ZWTQ6 from Texas Instruments. As a leader in digital signal processors (DSPs), Texas Instruments guarantees top-notch quality and cutting-edge technology. This versatile product offers a wide range of applications, providing value and benefits to customers across various industries. With integrated cache and multiple power supplies, this DSP ensures seamless operation and optimal performance. Trust Texas Instruments for all your DSP needs and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it suitable for various industrial applications.

Integrated Cache: YES

The presence of integrated cache helps in improving the processing speed and efficiency of the DSP, allowing for faster data retrieval and computation.

Maximum Supply Voltage: 1.26 V

The specified maximum supply voltage ensures safe operation of the DSP within the defined limits, preventing any potential damage to the device.

Address Bus Width: 32

With a wide address bus width of 32, the DSP can accommodate and process a large amount of data simultaneously, enhancing its performance capabilities.

Bit Size: 32

The 32-bit architecture of the DSP allows for efficient handling of data and calculations, making it suitable for complex signal processing tasks.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature rating ensures that the DSP can perform reliably even in harsh industrial environments with elevated temperatures.

Technology: CMOS

The CMOS technology used in the DSP offers low power consumption, high speed operation, and compatibility with various digital systems, making it a versatile and efficient choice.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6437ZWTQ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B90

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

90

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

61440

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6437ZWTQ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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