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TMS320DM6435ZDU7

Texas Instruments

TMS320DM6435ZDU7 by Texas Instruments

TMS320DM6435ZDU7 by Texas Instruments is a 32-bit DSP with integrated cache, 20480 RAM words, and 72 DMA channels. It operates b/w 0-90°C and has a max supply voltage of 1.26V. Ideal for digital signal processing applications requiring high-speed data processing capabilities.

Median Price

$34.370

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,133 parts In-Stock

1+ parts

$35.199

100+ parts

$31.288

1k+ parts

$23.006

10k+ parts

-

1,133

$35.199

$31.288

$23.006

-

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$33.540

1k+ parts

$30.010

10k+ parts

$28.250

2

-

$33.540

$30.010

$28.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,059 parts In-Stock

1+ parts

$30.352

100+ parts

-

1k+ parts

-

10k+ parts

-

3,059

$30.352

-

-

-

Vyrian

USA . 6,179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,179

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$20.240

100+ parts

-

1k+ parts

-

10k+ parts

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803

$20.240

-

-

-

Corphita

USA . 947 parts In-Stock

1+ parts

$28.755

100+ parts

-

1k+ parts

-

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947

$28.755

-

-

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Corohmni

South Africa . 5,120 parts In-Stock

1+ parts

$30.534

100+ parts

-

1k+ parts

-

10k+ parts

-

5,120

$30.534

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$58.444

100+ parts

$53.184

1k+ parts

$47.924

10k+ parts

-

500

$58.444

$53.184

$47.924

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Parana Technologies

USA . 2,360 parts In-Stock

1+ parts

$66.070

100+ parts

-

1k+ parts

-

10k+ parts

-

2,360

$66.070

-

-

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DigiPath Technology Company

USA . 277 parts In-Stock

1+ parts

$72.751

100+ parts

-

1k+ parts

-

10k+ parts

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277

$72.751

-

-

-

ChromeModa Solutions

Germany . 2,188 parts In-Stock

1+ parts

$74.236

100+ parts

$60.874

1k+ parts

-

10k+ parts

-

2,188

$74.236

$60.874

-

-

IDEA Electronic Components Group

UK . 637 parts In-Stock

1+ parts

$74.236

100+ parts

$70.524

1k+ parts

$66.812

10k+ parts

-

637

$74.236

$70.524

$66.812

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Microchip USA

USA . 491 parts In-Stock

1+ parts

$101.910

100+ parts

$101.030

1k+ parts

$101.030

10k+ parts

$100.140

491

$101.910

$101.030

$101.030

$100.140

QUARKTWIN TECHNOLOGY LTD

USA . 13,015 parts In-Stock

1+ parts

-

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13,015

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Perfect Parts

USA . 1,277 parts In-Stock

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1,277

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Speed Components Ltd (Excess)

Israel . 156 parts In-Stock

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156

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Overview

Unlock the power of advanced digital signal processing with the TMS320DM6435ZDU7 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that are trusted by professionals worldwide. This DSP offers integrated cache, multiple timers, and a wide external data bus width, making it perfect for applications in telecommunications, multimedia, and industrial control systems. Experience exceptional performance and reliability with this cutting-edge technology, and take your projects to the next level with the unmatched value and benefits that the TMS320DM6435ZDU7 provides.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and enables cost-effective manufacturing of the product.

Integrated Cache: YES

Integrated cache enhances the processing speed and efficiency of the DSP, making it suitable for complex signal processing tasks.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures stable operation and protects the DSP from voltage spikes.

Address Bus Width: 13

With a wide address bus width of 13, the DSP can efficiently handle large amounts of data and memory addresses.

Bit Size: 32

A 32-bit architecture allows for high-speed computation and processing of data, making the DSP suitable for demanding applications.

No. of Terminals: 376

Having 376 terminals provides connectivity options and allows for integration with various external components and peripherals.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C ensures reliable performance even in challenging environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

No. of DMA Channels: 72

Having 72 DMA channels enables efficient data transfer between the DSP and external devices, enhancing overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6435ZDU7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

ROM Programmability:

MROM

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320DM6435ZDU7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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