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TMS320DM642GDK720

Texas Instruments

TMS320DM642GDK720 by Texas Instruments

TMS320DM642GDK720 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and max clock frequency of 75.19 MHz. Ideal for digital signal processing applications requiring low power mode and fixed-point format in a compact grid array package.

Median Price

$47.678

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 631 parts In-Stock

1+ parts

-

100+ parts

$42.380

1k+ parts

$37.920

10k+ parts

$35.690

631

-

$42.380

$37.920

$35.690

DigiKey

USA . 631 parts In-Stock

1+ parts

-

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-

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631

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Verical

USA . 306 parts In-Stock

1+ parts

-

100+ parts

$52.975

1k+ parts

$47.400

10k+ parts

$44.612

306

-

$52.975

$47.400

$44.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,723 parts In-Stock

1+ parts

$44.736

100+ parts

-

1k+ parts

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1,723

$44.736

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DigiKey Marketplace

USA . 631 parts In-Stock

1+ parts

$48.970

100+ parts

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631

$48.970

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Vyrian

USA . 2,930 parts In-Stock

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2,930

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Bristol Electronics

USA . 3 parts In-Stock

1+ parts

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3

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Goldney Electronics S.L.

Spain . 2 parts In-Stock

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PC Components Company LLC

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,040 parts In-Stock

1+ parts

$17.743

100+ parts

-

1k+ parts

$17.924

10k+ parts

-

1,040

$17.743

-

$17.924

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ChromeModa Solutions

Germany . 6,388 parts In-Stock

1+ parts

$19.936

100+ parts

$16.348

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-

10k+ parts

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6,388

$19.936

$16.348

-

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IDEA Electronic Components Group

UK . 907 parts In-Stock

1+ parts

$19.936

100+ parts

$18.939

1k+ parts

$17.942

10k+ parts

-

907

$19.936

$18.939

$17.942

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$24.824

100+ parts

$22.590

1k+ parts

$20.356

10k+ parts

-

2,000

$24.824

$22.590

$20.356

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Corohmni

South Africa . 1,968 parts In-Stock

1+ parts

$26.932

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1,968

$26.932

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Corphita

USA . 78 parts In-Stock

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$42.381

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78

$42.381

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DigiPath Technology Company

USA . 1,275 parts In-Stock

1+ parts

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$17.974

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1,275

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$17.974

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Cyclops Electronics Ltd (Excess)

UK . 13 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320DM642GDK720 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that are perfect for a wide range of applications. From telecommunications to industrial automation, this DSP offers value, benefits, and advantages that set it apart from the competition. With advanced features and reliable performance, the TMS320DM642GDK720 is the perfect choice for customers looking for cutting-edge technology and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product on circuit boards.

Maximum Supply Voltage: 1.44 V

Support for a high maximum supply voltage ensures flexibility in power management for different applications.

Address Bus Width: 23

A wide address bus width enables efficient communication with external memory and peripherals.

Package Shape: SQUARE

The square package shape allows for space-saving and efficient PCB layout.

Bit Size: 32

A 32-bit architecture offers high processing power and performance for signal processing tasks.

Power Supplies (V): 1.4,3.3

Support for multiple power supply voltages enables compatibility with a wide range of systems and components.

No. of Terminals: 548

A high number of terminals allows for versatile connectivity options and integration with various interfaces.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enhances signal integrity and reliability in demanding applications.

Minimum Supply Voltage: 1.36 V

The low minimum supply voltage ensures efficient power usage and extends battery life in portable devices.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and electrical conductivity for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and assembly in compact designs.

Maximum Seated Height: 2.8 mm

The low maximum seated height helps in designing slim and compact electronic devices.

RAM Words: 16384

A large RAM capacity enables efficient data storage and processing for complex signal processing algorithms.

Width: 23 mm

The compact width allows for space-efficient PCB placement in tight layouts.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the product during manufacturing and maintenance.

External Data Bus Width: 64

A wide external data bus width enhances data transfer speed and throughput for signal processing operations.

Maximum Clock Frequency: 75.19 MHz

High maximum clock frequency enables fast computation and real-time processing of digital signals.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture supports parallel processing and efficient data flow for multitasking applications.

Length: 23 mm

The compact length allows for space-efficient PCB placement in small electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC types expand the functionality and compatibility of the product with various applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration density for energy-efficient and compact designs.

Terminal Form: BALL

Ball terminal form provides robust mechanical connection and thermal performance in demanding operating conditions.

Nominal Supply Voltage: 1.4 V

Stable nominal supply voltage ensures consistent performance and reliability of the product.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting and compact layout design on PCBs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and numeric computations for efficient signal processing algorithms.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates the product can withstand moderate exposure to moisture during storage and operation.

Low Power Mode: YES

Low power mode option enhances energy efficiency and battery life for power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM642GDK720 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM642GDK720 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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