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TMS320C6747DZKBD4

Texas Instruments

TMS320C6747DZKBD4 by Texas Instruments

TMS320C6747DZKBD4 by Texas Instruments is a 32-bit DSP with integrated cache, 16-bit external data bus width, and 30 MHz max clock frequency. Ideal for digital signal processing applications requiring low power mode, it features 8192 RAM words and operates b/w -40 to 70 °C.

Median Price

$23.560

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,148 parts In-Stock

1+ parts

$18.541

100+ parts

$16.480

1k+ parts

$12.118

10k+ parts

-

1,148

$18.541

$16.480

$12.118

-

DigiKey

USA . 220 parts In-Stock

1+ parts

$28.580

100+ parts

$20.272

1k+ parts

$19.402

10k+ parts

-

220

$28.580

$20.272

$19.402

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,808 parts In-Stock

1+ parts

$17.614

100+ parts

-

1k+ parts

-

10k+ parts

-

2,808

$17.614

-

-

-

Vyrian

USA . 3,451 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,451

-

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 264 parts In-Stock

1+ parts

$15.760

100+ parts

-

1k+ parts

-

10k+ parts

-

264

$15.760

-

-

-

Corphita

USA . 2,955 parts In-Stock

1+ parts

$16.687

100+ parts

-

1k+ parts

-

10k+ parts

-

2,955

$16.687

-

-

-

Corohmni

South Africa . 733 parts In-Stock

1+ parts

$38.818

100+ parts

-

1k+ parts

-

10k+ parts

-

733

$38.818

-

-

-

Parana Technologies

USA . 727 parts In-Stock

1+ parts

$42.950

100+ parts

-

1k+ parts

-

10k+ parts

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727

$42.950

-

-

-

DigiPath Technology Company

USA . 82 parts In-Stock

1+ parts

$47.293

100+ parts

-

1k+ parts

-

10k+ parts

-

82

$47.293

-

-

-

ChromeModa Solutions

Germany . 3,118 parts In-Stock

1+ parts

$48.258

100+ parts

$39.572

1k+ parts

-

10k+ parts

-

3,118

$48.258

$39.572

-

-

IDEA Electronic Components Group

UK . 1,871 parts In-Stock

1+ parts

$48.258

100+ parts

$45.845

1k+ parts

$43.432

10k+ parts

-

1,871

$48.258

$45.845

$43.432

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Lixinc

USA . 12,002 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,002

-

-

-

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S.R.D Solutions

India . 600 parts In-Stock

1+ parts

-

100+ parts

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600

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-

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A-Z Elektronik GmbH

Germany . 180 parts In-Stock

1+ parts

-

100+ parts

-

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180

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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100

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Overview

Experience unparalleled performance and efficiency with the TMS320C6747DZKBD4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in its Digital Signal Processors (DSPs), ensuring reliability and precision in every application. Whether you're working on audio processing, telecommunications, or industrial automation, this product offers unmatched value with integrated cache, low power mode, and maximum clock frequency of 30 MHz. Stay ahead of the curve and elevate your projects with the TMS320C6747DZKBD4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring long-lasting performance.

Integrated Cache: YES

Improves processing speed by storing frequently used data and instructions for quick access.

Maximum Supply Voltage: 1.35 V

Allows for efficient power consumption while providing enough voltage for optimal performance.

Package Shape: SQUARE

Facilitates easy and compact integration of the DSP into electronic devices.

Bit Size: 32

Enables the DSP to handle larger amounts of data and complex calculations effectively.

Maximum Operating Temperature: 70 °C

Ensures the DSP can operate effectively in various environmental conditions.

RAM Words: 8192

Provides ample memory for storing data and instructions, enhancing the DSP's performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Indicates the versatile functionality of the DSP, making it suitable for a wide range of applications.

No. of DMA Channels: 40

Enables efficient data transfer between peripherals and memory, enhancing overall system performance.

Low Power Mode: YES

Allows for power-saving operation when the DSP is not in active use, prolonging battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6747DZKBD4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

No. of Timers:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6747DZKBD4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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