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TMS320C6745DPTPA3

Texas Instruments

TMS320C6745DPTPA3 by Texas Instruments

TMS320C6745DPTPA3 by Texas Instruments is a 32-bit DSP with integrated cache, operating at max 30 MHz clock frequency. Ideal for industrial applications, it features 16-bit external data bus width and low power mode for efficient performance in digital signal processing tasks.

Median Price

$15.807

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 302 parts In-Stock

1+ parts

$15.807

100+ parts

$13.807

1k+ parts

$9.522

10k+ parts

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302

$15.807

$13.807

$9.522

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,953 parts In-Stock

1+ parts

$15.017

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1,953

$15.017

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Vyrian

USA . 2,264 parts In-Stock

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2,264

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Distributors (Availability)

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Corphita

USA . 3,874 parts In-Stock

1+ parts

$14.226

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3,874

$14.226

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Corohmni

South Africa . 350 parts In-Stock

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$15.229

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350

$15.229

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AZTECH Wire

Italy . 300 parts In-Stock

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$17.840

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300

$17.840

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Parana Technologies

USA . 444 parts In-Stock

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$74.222

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444

$74.222

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DigiPath Technology Company

USA . 981 parts In-Stock

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$81.728

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981

$81.728

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IDEA Electronic Components Group

UK . 1,556 parts In-Stock

1+ parts

$83.396

100+ parts

$79.226

1k+ parts

$75.056

10k+ parts

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1,556

$83.396

$79.226

$75.056

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ChromeModa Solutions

Germany . 351 parts In-Stock

1+ parts

$83.396

100+ parts

$68.385

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QUARKTWIN TECHNOLOGY LTD

USA . 2,784 parts In-Stock

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Metaverse IC Inc.

Canada . 416 parts In-Stock

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Overview

Experience a new level of performance with the TMS320C6745DPTPA3 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability. This DSP is perfect for a wide range of applications, offering integrated cache, low power mode, and a maximum clock frequency of 30 MHz. With a floating-point format and impressive technology, this product provides exceptional value and benefits to customers seeking high-performance solutions. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the internal components of the DSP, making it suitable for a variety of environments.

Integrated Cache: YES

The integrated cache helps improve processing speeds and efficiency by storing frequently accessed data and instructions, enhancing the overall performance of the DSP.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V allows for stable operation of the DSP within safe voltage limits, preventing any potential damage to the device.

Address Bus Width: 15

With a wide address bus width of 15, the DSP can efficiently handle and process large amounts of memory addresses, enhancing its overall performance and data manipulation capabilities.

Bit Size: 32

The 32-bit size of the DSP allows for high-speed processing of data and complex mathematical calculations, making it ideal for applications requiring high computational power.

No. of Terminals: 176

The high number of terminals (176) provides ample connectivity options for interfacing with external devices and peripherals, expanding the versatility and flexibility of the DSP.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the DSP can reliably function in elevated temperature conditions, making it suitable for industrial applications and harsh environments.

Technology: CMOS

The use of CMOS technology in the DSP allows for low power consumption and high-speed performance, making it energy-efficient and suitable for battery-powered devices or applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6745DPTPA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

40

No. of Terminals:

176

No. of Timers:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6745DPTPA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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