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TMS320C6745CPTPD4

Texas Instruments

TMS320C6745CPTPD4 by Texas Instruments

TMS320C6745CPTPD4 by Texas Instruments is a 32-bit DSP with 13-bit address bus, operating at max 50 MHz. It features 8192 RAM words, low power mode, and boundary scan. Ideal for digital signal processing applications requiring high-speed data processing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,649 parts In-Stock

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Vyrian

USA . 2,054 parts In-Stock

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2,054

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Distributors (Availability)

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AZTECH Wire

Italy . 313 parts In-Stock

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$17.770

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$17.770

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One Stop Electronics

USA . 653 parts In-Stock

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$18.000

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653

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Parana Technologies

USA . 8 parts In-Stock

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$21.912

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$22.410

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8

$21.912

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$22.410

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ChromeModa Solutions

Germany . 3,018 parts In-Stock

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$24.620

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$20.188

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$24.620

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IDEA Electronic Components Group

UK . 1,167 parts In-Stock

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$24.620

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$23.389

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$22.158

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1,167

$24.620

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$22.158

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Corohmni

South Africa . 4,985 parts In-Stock

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$53.388

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Corphita

USA . 2,004 parts In-Stock

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DigiPath Technology Company

USA . 893 parts In-Stock

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$22.197

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Microchip USA

USA . 109 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320C6745CPTPD4 by Texas Instruments, a leader in innovative technology solutions. This Digital Signal Processor (DSP) is designed to elevate your applications to new heights, offering a wide range of benefits such as superior processing power, low power consumption, and versatile package styles for seamless integration. Whether you're working on audio processing, telecommunications, or industrial automation, this top-of-the-line product delivers exceptional value and quality that will exceed your expectations. Unlock the full potential of your projects with Texas Instruments' TMS320C6745CPTPD4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability while keeping the overall weight of the product low, making it ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product on circuit boards, improving production efficiency.

Maximum Supply Voltage: 1.35 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Address Bus Width: 13

With a wider address bus width, the processor can handle larger amounts of data efficiently, enhancing its processing capabilities.

Bit Size: 32

A 32-bit processor enables faster data processing and complex calculations, making the product suitable for high-performance tasks.

Power Supplies (V): 1.2, 1.8, 3.3

Having multiple power supply options allows for flexibility in different application scenarios, ensuring compatibility and efficiency.

No. of Terminals: 176

The high number of terminals provides robust connectivity options, enabling seamless integration with other components in the system.

Minimum Supply Voltage: 1.25 V

The low minimum supply voltage ensures stable operation even under varying voltage conditions, improving reliability.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the product can function in extreme cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections in diverse operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of a digital signal processor and other peripheral IC types enhances the product's versatility, enabling a wide range of applications.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures improves data transfer speeds and overall efficiency, enhancing the processing capabilities of the product.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the product energy-efficient and suitable for battery-operated devices.

Format: FLOATING POINT

A floating-point format allows for precise and accurate calculations, making the product ideal for applications requiring complex mathematical operations.

Low Power Mode: YES

The availability of a low power mode helps in conserving energy and extending battery life, making the product more environmentally friendly.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6745CPTPD4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6745CPTPD4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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