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TMS320C6745BPTPT3

Texas Instruments

TMS320C6745BPTPT3 by Texas Instruments

TMS320C6745BPTPT3 by Texas Instruments is a 32-bit DSP with 16-bit address and data bus width, operating at up to 30 MHz. Ideal for automotive applications, it features low power mode, floating-point format, and boundary scan capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,237 parts In-Stock

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Digiode

USA . 145 parts In-Stock

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145

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One Stop Electronics

USA . 1,213 parts In-Stock

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$5.000

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1,213

$5.000

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AZTECH Wire

Italy . 578 parts In-Stock

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$17.565

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578

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Parana Technologies

USA . 1,597 parts In-Stock

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$48.978

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$48.978

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DigiPath Technology Company

USA . 2,119 parts In-Stock

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$53.931

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$49.617

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2,119

$53.931

$49.617

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ChromeModa Solutions

Germany . 5,574 parts In-Stock

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$55.032

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$45.126

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$55.032

$45.126

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IDEA Electronic Components Group

UK . 1,277 parts In-Stock

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$55.032

100+ parts

$52.280

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$49.529

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1,277

$55.032

$52.280

$49.529

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Corohmni

South Africa . 3,164 parts In-Stock

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$59.679

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Corphita

USA . 2,976 parts In-Stock

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Microchip USA

USA . 317 parts In-Stock

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Overview

Discover the unparalleled performance and reliability of the TMS320C6745BPTPT3 by Texas Instruments, a leading manufacturer in the industry of Digital Signal Processors. Designed for a wide range of applications, this high-quality DSP offers exceptional value with its advanced technology and innovative features. Experience the benefits of faster processing speeds, lower power consumption, and superior accuracy, making it the ideal choice for automotive and other digital signal processing needs. Upgrade your projects today with the TMS320C6745BPTPT3 and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers durability and protection to the DSP, making it reliable for long-term use.

Surface Mount: YES

Surface mount capability simplifies the installation process and saves space in electronic devices.

Maximum Supply Voltage: 1.32 V

Operates efficiently within specified voltage range, ensuring stability and performance.

Address Bus Width: 16

Allows for efficient data transfer and processing, enhancing overall performance.

Package Shape: SQUARE

Square package shape facilitates easy handling and placement in electronic circuits.

Bit Size: 32

32-bit processing capability enables fast and accurate data processing for advanced applications.

Power Supplies (V): 1.2,1.8,3.3

Multiple power supply options allow for flexibility in different operating environments and power requirements.

No. of Terminals: 176

Ample terminals provide connectivity options for various peripherals and interfaces, enhancing functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Diverse package styles offer adaptability to different design requirements and enable efficient heat dissipation.

Minimum Supply Voltage: 1.14 V

Supports low-power operation and helps in reducing energy consumption.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range support allows for operation in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal positioning facilitates easy soldering and connection with other components.

Maximum Seated Height: 1.6 mm

Low-profile design with maximum seated height of 1.6mm saves space and enables compact device designs.

RAM Words: 8192

Large RAM capacity enables storage of significant data for processing, enhancing overall performance.

Width: 24 mm

Compact width size allows for easy integration into a variety of electronic devices.

Boundary Scan: YES

Boundary scan support facilitates testing and troubleshooting of the DSP during manufacturing and maintenance.

External Data Bus Width: 16

Wider external data bus width of 16 allows for faster data transfer between the DSP and external devices.

Maximum Clock Frequency: 30 MHz

High clock frequency support enables fast data processing and real-time operations for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with a maximum time of 30 seconds reduces manufacturing time and ensures quality soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures reliable soldering and component adherence during manufacturing.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing and efficiency within the DSP.

Length: 24 mm

Compact length size enables easy installation in various electronic devices without occupying much space.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable performance in harsh environmental conditions typically found in automotive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports various digital signal processing functions and other applications, making it a versatile choice.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the DSP energy-efficient and fast.

Terminal Form: GULL WING

Gull wing terminal form provides easy soldering and connection options, ensuring secure and reliable electrical contacts.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2V ensures consistent and reliable performance of the DSP.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and compact design integration.

Format: FLOATING POINT

Floating-point format support enhances numerical accuracy and precision in computational tasks, making the DSP suitable for complex algorithms.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 indicates robustness against moisture exposure during manufacturing and storage.

Low Power Mode: YES

Low power mode capability allows for energy-efficient operation, prolonging battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6745BPTPT3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6745BPTPT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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