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TMS320C6742BZWTA2

Texas Instruments

TMS320C6742BZWTA2 by Texas Instruments

TMS320C6742BZWTA2 by Texas Instruments is a 32-bit DSP with 23-bit address bus, operating at max 30 MHz. Ideal for industrial applications, it features low power mode, floating point format, and boundary scan support. With a package style of grid array and terminal pitch of 0.8mm, it offers high performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,770 parts In-Stock

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Digiode

USA . 4,567 parts In-Stock

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AZTECH Wire

Italy . 286 parts In-Stock

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$7.899

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Corohmni

South Africa . 499 parts In-Stock

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$16.509

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One Stop Electronics

USA . 1,562 parts In-Stock

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$20.000

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Parana Technologies

USA . 1,240 parts In-Stock

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DigiPath Technology Company

USA . 1,179 parts In-Stock

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$57.231

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$52.653

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ChromeModa Solutions

Germany . 1,165 parts In-Stock

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$58.399

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$47.887

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IDEA Electronic Components Group

UK . 848 parts In-Stock

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$58.399

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$55.479

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$52.559

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Corphita

USA . 3,328 parts In-Stock

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Microchip USA

USA . 464 parts In-Stock

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Futuretech Components

Singapore . 76 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS320C6742BZWTA2 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This versatile DSP is perfect for a wide range of applications, offering unmatched performance and efficiency. Whether you're working on audio processing, telecommunications, or industrial automation, this product provides exceptional value and benefits to meet your needs. Elevate your projects to the next level with the TMS320C6742BZWTA2 - the ultimate solution for all your processing requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the DSP easier to handle and less prone to damage during installation and handling.

Surface Mount: YES

Surface mount technology allows for easier integration onto circuit boards, saving space and making the overall design more compact.

Maximum Supply Voltage: 1.32 V

The relatively low maximum supply voltage helps in reducing power consumption and heat dissipation, making the DSP more energy-efficient.

Address Bus Width: 23

A wider address bus width allows for larger memory addressing capabilities, enabling the DSP to handle more complex algorithms and data processing tasks efficiently.

Bit Size: 32

With a 32-bit architecture, the DSP can perform calculations with higher precision and accuracy, making it suitable for demanding signal processing applications.

Power Supplies (V): 1.2,1.8/3.3

The availability of multiple power supply voltages allows for flexibility in different usage scenarios, making the DSP versatile and adaptable to various power requirements.

No. of Terminals: 361

Having a high number of terminals provides ample connectivity options for interfacing with other components and peripherals, enhancing the DSP's overall functionality and compatibility.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliable performance in extreme environmental conditions, making the DSP suitable for industrial applications where temperature fluctuations are common.

Maximum Clock Frequency: 30 MHz

With a high maximum clock frequency, the DSP can process data at a faster rate, making it ideal for real-time signal processing tasks that require high-speed computations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the DSP in various digital signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6742BZWTA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6742BZWTA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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