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TMS320C6672ACYP

Texas Instruments

TMS320C6672ACYP by Texas Instruments

TMS320C6672ACYP by Texas Instruments is a 32-bit DSP with integrated cache and 64-bit external data bus. It operates at 1.045-1.155 V, has 841 terminals, and offers low power mode. Ideal for digital signal processing applications requiring high performance in a compact package.

Median Price

$205.558

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 148 parts In-Stock

1+ parts

$151.395

100+ parts

$137.039

1k+ parts

$130.513

10k+ parts

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148

$151.395

$137.039

$130.513

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Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$259.720

100+ parts

$209.780

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-

10k+ parts

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1

$259.720

$209.780

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,015 parts In-Stock

1+ parts

$143.825

100+ parts

-

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4,015

$143.825

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Vyrian

USA . 3,827 parts In-Stock

1+ parts

-

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3,827

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Chip Stock

USA . 135 parts In-Stock

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135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,180 parts In-Stock

1+ parts

$36.994

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-

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2,180

$36.994

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ChromeModa Solutions

Germany . 2,391 parts In-Stock

1+ parts

$41.566

100+ parts

$34.084

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-

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2,391

$41.566

$34.084

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IDEA Electronic Components Group

UK . 2,327 parts In-Stock

1+ parts

$41.566

100+ parts

$39.488

1k+ parts

$37.409

10k+ parts

-

2,327

$41.566

$39.488

$37.409

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Corohmni

South Africa . 2,736 parts In-Stock

1+ parts

$59.247

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-

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2,736

$59.247

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Corphita

USA . 4,821 parts In-Stock

1+ parts

$136.256

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4,821

$136.256

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Lixinc

USA . 12,894 parts In-Stock

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12,894

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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DigiPath Technology Company

USA . 243 parts In-Stock

1+ parts

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$37.476

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243

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$37.476

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Perfect Parts

USA . 49 parts In-Stock

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49

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Overview

Unleash the power of cutting-edge technology with the TMS320C6672ACYP by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability in every product. Designed for a variety of applications, this DSP offers integrated cache, high-speed processing, and low power consumption. With a wide range of power supplies and advanced features like boundary scan and on-chip program ROM, the TMS320C6672ACYP provides unmatched value and performance. Elevate your projects to the next level with this versatile and powerful DSP solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable electronic devices.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.155 V

Lower maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

On Chip Data RAM Width: 8

Wide on-chip data RAM width allows for faster data processing and storage capabilities.

Package Shape: SQUARE

Square package shape provides compact form factor, optimizing board space and layout.

Bit Size: 32

32-bit architecture enables high processing speeds and efficient computational capabilities.

Power Supplies (V): 1,1.5,1.8

Multiple power supply options provide flexibility in design and compatibility with various voltage requirements.

No. of Terminals: 841

High number of terminals allow for a greater number of connections and peripherals to be integrated, enhancing overall functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design facilitates high-density mounting, enabling more components to be packed in a limited space.

Minimum Supply Voltage: 1.045 V

Lower minimum supply voltage ensures stable operation even at low power levels, enhancing reliability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows the product to function in extreme temperature conditions without compromising performance.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

Bottom terminal position aids in efficient heat dissipation and solder joint reliability during PCB assembly.

Maximum Seated Height: 3.39 mm

Low maximum seated height makes the product suitable for compact designs and slim devices.

RAM Words: 16384

Large RAM capacity allows for extensive data storage and processing capabilities, enhancing overall performance.

Width: 24 mm

Compact width dimension enables easy integration into various electronic PCB layouts and designs.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the product during production and maintenance.

External Data Bus Width: 64

Wide external data bus width enhances data transfer speeds and processing efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and component mounting during PCB assembly.

Peak Reflow Temperature °C: 245

High peak reflow temperature tolerance ensures reliable soldering and component attachment.

Internal Bus Architecture: SINGLE

Single internal bus architecture simplifies design complexity and enhances overall system performance.

Length: 24 mm

Compact length dimension allows for space-efficient board layout and integration in various electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type enables the product to support a wide range of signal processing applications and functions.

No. of Timers: 10

Multiple timers provide precise timing control for various operations and tasks, enhancing overall system functionality.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making it a suitable choice for digital signal processing applications.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and reliable electrical connections during PCB assembly.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent performance and reliability under varying operating conditions.

No. of DMA Channels: 144

High number of DMA channels enable efficient data transfer and management, enhancing overall processing capabilities.

ROM Programmability: MROM

Mask ROM programmability offers secure and reliable storage of firmware and software, preventing unauthorized access or modification.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting and compact PCB design, optimizing board space and layout.

Format: FLOATING POINT

Floating-point format supports high precision mathematical calculations, essential for complex signal processing algorithms and computations.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates the product's tolerance to moisture exposure, ensuring reliability and performance in various environmental conditions.

Low Power Mode: YES

Low power mode feature helps in reducing energy consumption and extending battery life, making the product suitable for portable devices.

On Chip Program ROM Width: 8

Wide on-chip program ROM width enables efficient storage and retrieval of program instructions, enhancing overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6672ACYP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

144

No. of Terminals:

841

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6672ACYP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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