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TMS320C6671ACYP25

Texas Instruments

TMS320C6671ACYP25 by Texas Instruments

TMS320C6671ACYP25 by Texas Instruments is a 32-bit DSP with integrated cache and 64-bit external data bus. It operates at 0-85°C, has 841 terminals, and supports boundary scan. Ideal for digital signal processing applications requiring low power mode and multiple timers.

Median Price

$150.728

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 96 parts In-Stock

1+ parts

$150.728

100+ parts

$136.435

1k+ parts

$129.938

10k+ parts

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96

$150.728

$136.435

$129.938

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 94 parts In-Stock

1+ parts

$143.192

100+ parts

-

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94

$143.192

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Vyrian

USA . 6,374 parts In-Stock

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-

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6,374

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Distributors (Availability)

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AZTECH Wire

Italy . 76 parts In-Stock

1+ parts

$10.710

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-

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76

$10.710

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Parana Technologies

USA . 1,149 parts In-Stock

1+ parts

$23.227

100+ parts

$2,157.000

1k+ parts

$20.904

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-

1,149

$23.227

$2,157.000

$20.904

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DigiPath Technology Company

USA . 685 parts In-Stock

1+ parts

$25.576

100+ parts

$23.530

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-

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685

$25.576

$23.530

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IDEA Electronic Components Group

UK . 1,112 parts In-Stock

1+ parts

$26.098

100+ parts

$24.793

1k+ parts

$23.488

10k+ parts

-

1,112

$26.098

$24.793

$23.488

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ChromeModa Solutions

Germany . 110 parts In-Stock

1+ parts

$26.098

100+ parts

$21.400

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110

$26.098

$21.400

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Corohmni

South Africa . 130 parts In-Stock

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$39.223

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130

$39.223

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Corphita

USA . 3,409 parts In-Stock

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$135.655

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3,409

$135.655

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Microchip USA

USA . 2,389 parts In-Stock

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$218.295

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2,389

$218.295

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QUARKTWIN TECHNOLOGY LTD

USA . 29,655 parts In-Stock

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29,655

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Overview

Unleash the power of advanced digital signal processing with the TMS320C6671ACYP25 by Texas Instruments. With a proven track record of manufacturing excellence, Texas Instruments delivers cutting-edge technology in the form of this high-quality DSP. Ideal for applications requiring fast and efficient data processing, this DSP offers unmatched performance and reliability. Whether you're working on telecommunications, industrial automation, or multimedia applications, the TMS320C6671ACYP25 provides the value, benefits, and advantages that customers need to stay ahead in today's competitive market. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, allowing for easy handling and transportation.

Integrated Cache: YES

Having an integrated cache improves the performance of the DSP by reducing memory access times and increasing overall processing speed.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05V ensures efficient power consumption and prevents the risk of damage from voltage spikes.

On Chip Data RAM Width: 8

With a data RAM width of 8, the DSP can handle and process larger amounts of data simultaneously, enhancing its computational capabilities.

Address Bus Width: 16

A wider address bus width of 16 allows the DSP to access a larger memory space, enabling it to handle complex algorithms and tasks.

Bit Size: 32

The 32-bit architecture of the DSP allows for high precision and accuracy in signal processing, making it suitable for a wide range of applications.

Power Supplies (V): 1, 1.5, 1.8

The availability of multiple power supply options (1V, 1.5V, 1.8V) offers flexibility in operation and power management based on specific requirements.

No. of Terminals: 841

With a high number of terminals, the DSP can easily connect to various external devices and interfaces, expanding its versatility and usability.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style provides a compact and space-saving design, making it suitable for applications where size constraints are a concern.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95V ensures that the DSP can operate efficiently even at low power levels, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the DSP to function reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the DSP can operate effectively in a wide range of temperature settings, ensuring consistent performance.

Terminal Finish: TIN SILVER COPPER

The use of Tin, Silver, and Copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Width: 24 mm

The compact width of 24mm makes the DSP suitable for space-constrained applications where size is a critical factor.

No. of Timers: 18

Having 18 timers allows the DSP to schedule and execute tasks with precision timing, making it ideal for applications requiring strict time control.

Technology: CMOS

The CMOS technology used in the DSP offers low power consumption, high speed, and scalability, making it an efficient and reliable choice for signal processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6671ACYP25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

144

No. of Terminals:

841

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6671ACYP25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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