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TMS320C6670ACYPA2

Texas Instruments

TMS320C6670ACYPA2 by Texas Instruments

TMS320C6670ACYPA2 by Texas Instruments is a 32-bit DSP with integrated cache, operating at -40 to 100 °C. It has 841 terminals, 32768 RAM words, and supports floating point format. Ideal for industrial applications requiring high-performance digital signal processing in a compact package.

Median Price

$415.500

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 768 parts In-Stock

1+ parts

$248.667

100+ parts

$225.086

1k+ parts

$214.368

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768

$248.667

$225.086

$214.368

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Mouser Electronics

USA . 6 parts In-Stock

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$415.500

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6

$415.500

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DigiKey

USA . 43 parts In-Stock

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$415.530

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43

$415.530

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,711 parts In-Stock

1+ parts

$236.234

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1,711

$236.234

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Vyrian

USA . 4,028 parts In-Stock

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4,028

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,784 parts In-Stock

1+ parts

$16.022

100+ parts

-

1k+ parts

$16.364

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1,784

$16.022

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$16.364

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DigiPath Technology Company

USA . 1,125 parts In-Stock

1+ parts

$17.642

100+ parts

$16.231

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1,125

$17.642

$16.231

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ChromeModa Solutions

Germany . 3,567 parts In-Stock

1+ parts

$18.002

100+ parts

$14.762

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3,567

$18.002

$14.762

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IDEA Electronic Components Group

UK . 2,015 parts In-Stock

1+ parts

$18.002

100+ parts

$17.102

1k+ parts

$16.202

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2,015

$18.002

$17.102

$16.202

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Corohmni

South Africa . 1,972 parts In-Stock

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$28.006

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$28.006

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Corphita

USA . 4,698 parts In-Stock

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$223.800

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4,698

$223.800

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Microchip USA

USA . 1,269 parts In-Stock

1+ parts

$326.010

100+ parts

$317.320

1k+ parts

$312.970

10k+ parts

$308.630

1,269

$326.010

$317.320

$312.970

$308.630

Lixinc

USA . 17,033 parts In-Stock

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17,033

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iodParts Technologies Inc.

India . 8,016 parts In-Stock

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8,016

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 197 parts In-Stock

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Overview

Elevate your projects with the TMS320C6670ACYPA2 from Texas Instruments, a leading manufacturer in digital signal processors. This powerful DSP offers unparalleled performance and reliability, making it ideal for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial automation, this product delivers exceptional value with its integrated cache, low power mode, and advanced technology. Trust in Texas Instruments to provide top-of-the-line solutions for your digital processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures the product is lightweight and durable, making it ideal for portable devices.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, enhancing overall performance.

Maximum Supply Voltage: 1.05 V

Operates efficiently within specified voltage range, ensuring stability and reliability.

Bit Size: 32

32-bit architecture allows for high precision processing and calculations, suitable for complex applications.

Power Supplies (V): 1, 1.5, 1.8

Supports multiple voltage options, providing flexibility for different power requirements.

No. of Terminals: 841

Higher number of terminals allow for more connectivity options and functionalities.

RAM Words: 32768

Large RAM capacity enables handling of extensive data and tasks efficiently.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making it energy efficient.

No. of DMA Channels: 80

Having 80 DMA channels allows for efficient data transfer and management, improving overall performance.

Low Power Mode: YES

Low power mode option helps in conserving energy and extending battery life, which is beneficial for portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6670ACYPA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6670ACYPA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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